EPF81188ARC240-2

The EPF81188ARC240-2 is a FLEX 8000 family programmable logic device from Intel, delivered in a 240-pin BFQFP package with an exposed pad. It implements a matrix of logic elements (LEs) built from compact 4-input look-up tables and programmable registers, providing a reconfigurable platform for mid-density logic integration.

Designed for commercial applications, this device offers 1,008 logic elements, 184 user I/O pins and a nominal operating supply range of 4.75 V to 5.25 V, making it suitable for bus interfaces, TTL integration, coprocessor functions and high-speed controller roles where a programmable, register-rich logic solution is required.

Key Features

• Core Architecture Logic implemented in LEs with 4-input LUTs and programmable registers for fine-grained, register-rich logic.
• Logic Capacity 1,008 logic elements (approximately 12,000 usable gates) and 126 logic array blocks (LABs) to accommodate combinational and sequential designs.
• I/O Density & Flexibility 184 user I/O pins support high-pin-count interfaces and multi-bus integration scenarios.
• Family-Level System Features FLEX 8000 family features include in-circuit reconfigurability (ICR) via external configuration devices or an intelligent controller, and selectable JTAG boundary-scan on supported devices.
• Power & Signal Integrity Operates from 4.75 V to 5.25 V and includes programmable output slew-rate control to help reduce switching noise. Typical standby current is specified at low current levels in the family data.
• Packaging & Mounting Surface-mount 240-BFQFP with exposed pad (240-RQFP supplier device package reference 32 × 32) for board-level assembly and thermal conduction.
• Temperature & Grade Commercial grade device with an operating temperature range of 0 °C to 70 °C and RoHS compliance.
• Design Tool Support (Family) FLEX 8000 family devices are supported by vendor development systems and standard HDL/netlist flows for design entry and place-and-route.

Typical Applications

• Bus Interface & Bridge Logic High I/O count and flexible routing make the device suitable for implementing bus interfaces and multi-bus glue logic.
• High-Speed Control Register-rich architecture supports timing-critical controllers and state machines.
• TTL/3.3 V Integration MultiVolt family I/O characteristics (family-level feature) enable interoperability with 5.0 V and 3.3 V logic domains for mixed-voltage systems.
• Coprocessor & Glue Logic Capacity of 1,008 LEs is appropriate for integrating auxiliary processing functions and custom peripheral logic.

Unique Advantages

• Right-sized Logic Capacity: 1,008 logic elements and roughly 12,000 gates deliver a mid-density solution that balances capacity and board-level cost for complex glue logic and control functions.
• High I/O Count: 184 user I/O pins enable direct connection to multiple buses or wide-data paths without external multiplexing.
• Reconfigurability: In-circuit reconfigurability (ICR) capability from the FLEX 8000 family reduces design iterations and enables field updates via external configuration devices or intelligent controllers.
• Simplified Mixed-Voltage Integration: Family-level MultiVolt I/O support facilitates interfacing between 5.0 V and 3.3 V logic, simplifying BOM and board-level translators.
• Commercial-Grade Specification: Rated for 0 °C to 70 °C operation and RoHS compliant for standard commercial applications.
• Surface-Mount 240-BFQFP Package: High pin count in a standardized surface-mount footprint with an exposed pad for board mounting and thermal conduction.

Why Choose EPF81188ARC240-2?

The EPF81188ARC240-2 combines a register-rich FPGA fabric with a high I/O count and family-proven system features to deliver a reconfigurable solution for commercial embedded designs. Its mid-range logic capacity and flexible I/O make it well suited for bus interfaces, glue logic, coprocessor offload, and timing-critical controllers where predictable routing and reprogrammability matter.

For teams targeting commercial-temperature designs that require field reconfigurability, mixed-voltage interfacing and solid toolchain support from the FLEX 8000 family, this device provides a balanced option in a 240-pin BFQFP exposed-pad package.

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