EPF81188AQC240-2

IC FPGA 184 I/O 240QFP
Part Description

FLEX 8000 Field Programmable Gate Array (FPGA) IC 184 1008 240-BFQFP

Quantity 1,867 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFPNumber of I/O184Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs126Number of Logic Elements/Cells1008
Number of Gates12000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/A

Overview of EPF81188AQC240-2 – FLEX 8000 Field Programmable Gate Array (FPGA) IC 184 I/O 1008 Logic Elements 240-BFQFP

The EPF81188AQC240-2 is a FLEX 8000 family programmable logic device from Intel. It combines a register‑rich, fine‑grained programmable-logic architecture with FastTrack continuous routing and dedicated arithmetic/cascade chains for predictable interconnect and high-speed logic functions.

Targeted at applications that require bus interfaces, wide-data-path manipulation, and control or coprocessor functions, the device offers 1,008 logic elements across 126 LABs, 184 user I/O pins, and support for in-circuit reconfigurability and MultiVolt I/O operation.

Key Features

  • Core Logic — 1,008 logic elements organized into 126 logic array blocks (LABs), suitable for register‑rich designs and mid-density logic integration.
  • Gate Equivalent — Approximately 12,000 usable gates to characterize device density for system planning.
  • I/O Capacity — 184 user I/O pins to support multiple bus interfaces and external peripheral connections.
  • Package & Mounting — 240‑pin BFQFP package (240‑PQFP, 32 × 32) with surface-mount mounting type for standard PCB assembly.
  • Power and Voltage — Device supply 4.75 V to 5.25 V; MultiVolt I/O family support described in the FLEX 8000 documentation enables core operation at 5.0 V with I/O compatibility for 5.0‑V and 3.3‑V logic levels.
  • Memory — No embedded RAM (Total RAM bits: 0); optimized for register-rich and logic-dominant implementations.
  • Temperature Range — Commercial grade operation from 0 °C to 70 °C.
  • Compliance — RoHS compliant.
  • Family-Level System Features — FLEX 8000 family supports in-circuit reconfigurability via external configuration devices or intelligent controllers, and includes architectural features such as FastTrack Interconnect, dedicated carry and cascade chains, and programmable output slew-rate control.
  • Design Ecosystem — Family documentation references supported design flows and software tool integration for automated place-and-route and common HDL/netlist formats.

Typical Applications

  • Bus Interfaces — Integrate multiple 32‑bit buses or complex bus bridging functions using the device’s high pin count and logic resources.
  • Digital Signal Processing (DSP) — Register-rich architecture supports wide-data-path manipulation and data transformation tasks in DSP pipelines.
  • High-Speed Controllers — Implement control logic and timing-critical functions leveraging dedicated carry and cascade chains for arithmetic and high-fan-in operations.
  • Coprocessor and Peripheral Integration — Offload specialized processing or glue logic between TTL-level peripherals and system buses.

Unique Advantages

  • Register-Rich Architecture: 1,008 logic elements across 126 LABs provide a balance of logic density and plentiful registers for stateful designs.
  • High I/O Count: 184 user I/O pins enable complex system interconnects and multiple bus instantiations without external IO expanders.
  • Predictable Interconnect: FastTrack continuous routing and dedicated carry/cascade chains reduce routing unpredictability for timing-sensitive functions.
  • MultiVolt I/O Support: Family-level MultiVolt I/O capability allows core and I/O level flexibility for mixed-voltage system integration.
  • Standard Package & Assembly: 240‑pin BFQFP surface-mount package simplifies PCB layout and supports common assembly processes.
  • Compliance & Supply Range: RoHS compliance and a defined 4.75 V–5.25 V supply window simplify regulatory and supply planning for commercial applications.

Why Choose EPF81188AQC240-2?

The EPF81188AQC240-2 positions itself as a mid-density, register-rich programmable logic device for commercial embedded and system applications that need predictable interconnect, abundant registers, and a high I/O count. Its FLEX 8000 family architecture and dedicated routing resources are designed to simplify implementation of bus interfaces, control logic, and wide-data-path processing without relying on embedded RAM.

This part is a practical choice for engineering teams requiring a commercially graded FPGA with documented family-level tool support and architectural features that aid synthesis, place-and-route, and high-speed arithmetic functions.

Request a quote or submit a sales inquiry to receive pricing, availability, and lead-time information for the EPF81188AQC240-2.

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