EPF81188AQC208-3

The EPF81188AQC208-3 is an FPGA from the FLEX 8000 family designed for register-rich, fine-grained programmable logic applications. It delivers 1,008 logic elements across 126 logic array blocks and supports 148 user I/O pins in a 208-pin BFQFP package, making it suitable for mid-density control, interfacing, and data-path tasks.

Built for commercial-grade systems, this device operates from a 4.75 V to 5.25 V supply and across a 0 °C to 70 °C operating range, offering in-circuit reconfigurability and architecture features from the FLEX 8000 family that simplify arithmetic and high-fan-in logic implementation.

Key Features

• Core Architecture 1,008 logic elements implemented in FLEX 8000 logic array blocks (126 LABs) for register-rich, fine-grained programmable logic.
• Logic Capacity Approximately 12,000 usable gates and dedicated routing resources for predictable interconnect delays.
• I/O 148 user I/O pins provided in a high-pin-count package to support multiple bus interfaces and external peripherals.
• Voltage Supply Operates from 4.75 V to 5.25 V, compatible with 5.0 V system environments referenced by the FLEX 8000 family description.
• Package & Mounting 208-pin BFQFP (supplier device package shown as 208-PQFP 28×28) in a surface-mount form factor for board-level integration.
• Commercial Grade Temperature Specified for operation from 0 °C to 70 °C for commercial applications.
• On-chip Memory Total on-chip RAM bits: 0 (no embedded RAM reported for this device).
• Environmental Compliance RoHS compliant.
• FLEX 8000 Family Technologies Family-level features include in-circuit reconfigurability, a continuous FastTrack interconnect structure, dedicated carry and cascade chains for arithmetic and high-fan-in logic, and programmable output slew-rate control to manage switching noise.

Typical Applications

• Bus Interfaces and Protocol Bridging Integrate multiple buses and glue-logic functions using the 148 I/O pins and flexible routing resources.
• High-speed Controller and Peripheral Logic Implement controllers, interface logic, and coprocessor glue with the device’s register-rich architecture and dedicated logic chains.
• Data-path and Wide-Data Manipulation Use the abundant registers and logic elements for DSP-like wide-data-path operations and data transformation pipelines.
• TTL Integration and Legacy System Support Deploy in systems that require TTL-level interfacing and mid-density programmable logic to consolidate discrete components.

Unique Advantages

• Balanced Mid-density Capacity: 1,008 logic elements and approximately 12,000 gates provide a balance between density and predictability for many embedded control and interface designs.
• High I/O Count in a Compact Package: 148 user I/O pins in a 208-pin BFQFP support integration of multiple external interfaces while remaining surface-mount friendly.
• Family-level Architectural Benefits: FastTrack interconnect and dedicated carry/cascade chains simplify implementation of fast adders, counters, and high-fan-in logic without manual routing workarounds.
• In-circuit Reconfigurability: Supports reconfiguration via external configuration devices or an intelligent controller to enable field updates and iterative development.
• Commercial Temperature and RoHS Compliance: Commercial operating range (0 °C to 70 °C) and RoHS status match many mainstream electronic product requirements.

Why Choose EPF81188AQC208-3?

The EPF81188AQC208-3 positions itself as a practical, mid-density FPGA option within the FLEX 8000 family for designs that require a register-rich logic fabric, substantial I/O, and predictable interconnect behavior. Its combination of 1,008 logic elements, 148 I/O pins, and in-circuit reconfigurability makes it well suited for bus interfacing, controller logic, and complex glue-logic consolidation in commercial products.

For engineering teams seeking a commercially graded, RoHS-compliant FPGA with family-proven architectural features—such as dedicated carry and cascade chains and programmable slew-rate control—the EPF81188AQC208-3 offers a clear, verifiable specification set to support development and deployment in mid-density applications.

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