EPF6024ATC144-3N

The EPF6024ATC144-3N is a FLEX 6000 family field programmable gate array (FPGA) in a 144-pin LQFP package, offering reconfigurable SRAM-based logic suitable for commercial electronic designs. It implements a register-rich, LUT-based OptiFLEX architecture that improves device area efficiency for medium-density programmable logic needs.

Designed for applications that require fast design changes during prototyping or in-field reconfiguration, this device provides a balance of logic capacity, I/O count, and package density for system-level interfacing and control functions in commercial products.

Key Features

• Core architecture Register-rich, look-up table (LUT) based OptiFLEX architecture to increase device area efficiency and support reprogrammable logic.
• Logic capacity Approximately 1,960 logic elements and a typical gate count of 24,000 for the FLEX 6000 EPF6024 family.
• I/O and package 117 I/O pins in a 144-LQFP surface-mount package (supplier package listed as 144-TQFP 20×20), providing compact board-level integration.
• Supply and temperature Operates from 3 V to 3.6 V and rated for commercial temperature range 0 °C to 85 °C.
• System-level reconfiguration & test Supports in-circuit reconfigurability via external configuration device or controller and includes built-in JTAG boundary-scan (IEEE 1149.1) for board-level testability.
• Interconnect and arithmetic support Family-level FastTrack continuous routing and dedicated carry and cascade chains for efficient implementation of arithmetic functions and high-fan-in logic.
• Clock and I/O control Built-in low-skew clock distribution paths, individual tri-state output enable per pin, programmable output slew-rate control, and fast register-to-I/O paths.
• Quality and compliance 100% functional tested prior to shipment and RoHS compliant.

Typical Applications

• Prototyping & design validation Rapidly iterate and validate hardware designs where fast design changes and reprogrammability accelerate development cycles.
• In-circuit reconfiguration Systems that require runtime or field updates to logic functions using external configuration devices or intelligent controllers.
• Interface bridging & peripheral control Bridge between subsystems operating at different voltages and implement custom peripheral interfaces using flexible I/O and programmable logic.
• Medium-density logic integration Combine control, glue logic, and moderate combinational/sequential functions into a single compact FPGA package for commercial products.

Unique Advantages

• Reconfigurable, register-rich architecture: Enables design changes during prototyping and in-field updates without changing hardware.
• Balanced logic and I/O in a compact package: 1,960 logic elements with 117 I/O pins in a 144-LQFP footprint reduces board area while supporting diverse interfaces.
• Efficient arithmetic and routing: Dedicated carry and cascade chains plus FastTrack interconnect streamline implementation of adders, counters, and high-fan-in logic.
• Built-in test and reconfiguration support: JTAG boundary-scan and in-circuit reconfigurability simplify production test and field maintenance.
• Commercial-grade reliability and compliance: Rated for 0 °C to 85 °C and RoHS compliant for regulatory and environmental compatibility.
• Verified functional quality: 100% functional testing ensures consistent device behavior out of the box.

Why Choose EPF6024ATC144-3N?

The EPF6024ATC144-3N delivers a practical combination of reconfigurable logic capacity, flexible I/O, and compact packaging for commercial designs that need a programmable alternative to fixed gate arrays. It leverages the FLEX 6000 family architecture to provide area-efficient LUT-based logic and system-level features such as in-circuit reconfiguration and boundary-scan testability.

This device is appropriate for designers seeking a medium-density FPGA with robust routing and arithmetic support, footprint compatibility within the FLEX 6000 family, and development support through established design flows and toolchains. Its commercial temperature rating and RoHS compliance help simplify integration into production electronic products.

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