EPF6024ATC144-2

The EPF6024ATC144-2 is a FLEX 6000 family programmable logic device from Intel (Altera). Based on a register-rich, LUT‑based OptiFLEX architecture, this device is intended as a low‑cost, reprogrammable alternative to fixed gate‑array designs and for rapid prototyping or design testing.

With 1,960 logic elements, approximately 24,000 typical gates, 117 I/O pins and a 144‑pin LQFP package, the EPF6024ATC144-2 targets applications that need flexible I/O, reconfigurability and compact PCB footprint while operating from a 3.0 V to 3.6 V supply and a commercial temperature range (0 °C to 85 °C).

Key Features

• Core architecture  Register‑rich, LUT‑based OptiFLEX architecture that optimizes device area efficiency for the FLEX 6000 family.
• Logic capacity  Approximately 1,960 logic elements and 24,000 typical gates to implement mid‑density logic functions and custom glue logic.
• I/O and interfacing  117 I/O pins in the 144‑LQFP package provide flexible external connectivity for peripherals and system interfaces.
• Clock and timing  Built‑in low‑skew clock distribution tree for predictable clocking across the device.
• System features  In‑circuit reconfigurability via external configuration device or controller, and IEEE 1149.1 JTAG boundary‑scan test circuitry available without consuming device logic.
• Power and supply  Operates from a 3.0 V to 3.6 V supply; typical low standby current (family specification under 0.5 mA in standby mode).
• Package and mounting  Surface‑mount 144‑LQFP (supplier device package: 144‑TQFP 20×20) for compact PCB designs.
• Testing and reliability  100% functional testing prior to shipment as a family characteristic.
• Environmental grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C; RoHS compliant.

Typical Applications

• Prototyping and design validation  Use for iterative hardware development and rapid function changes during prototype cycles thanks to in‑circuit reconfigurability.
• Gate‑array replacement  Low‑cost programmable alternative to mid‑volume gate‑array designs where post‑production changes or customization are required.
• I/O bridging and peripheral control  Flexible 117 I/O pins make the device suitable for interfacing peripherals, implementing protocol glue logic or custom I/O functions.
• Boundary‑scan test integration  Built‑in JTAG boundary‑scan supports board‑level testability without consuming core logic resources.

Unique Advantages

• Compact package with substantial I/O: 144‑LQFP footprint with 117 I/O pins balances board space and connectivity for dense designs.
• Reconfigurable hardware: In‑circuit reconfiguration capability enables rapid feature updates and field modifications without replacing silicon.
• Predictable timing infrastructure: Built‑in low‑skew clock distribution and dedicated chains for arithmetic and high‑fan‑in logic enhance timing predictability for common FPGA functions.
• Verified devices: 100% functional testing at shipment helps reduce initial board bring‑up risk.
• Commercial operating range: 0 °C to 85 °C temperature rating and RoHS compliance for standard electronic product applications.

Why Choose EPF6024ATC144-2?

The EPF6024ATC144-2 delivers a balanced combination of mid‑density logic capacity (1,960 logic elements / ~24,000 gates), flexible I/O and a compact 144‑LQFP package for designs that require reprogrammability and board‑level test support. It suits engineering teams looking to replace fixed ASICs or gate arrays with a reprogrammable solution for prototyping, functional updates, and moderate integration of logic and I/O.

Backed by the FLEX 6000 family features—OptiFLEX architecture, JTAG boundary‑scan and in‑circuit reconfigurability—this device provides a practical platform for scalable development and design iteration while operating from a 3.0 V to 3.6 V supply in commercial environments.

Request a quote or submit a sourcing inquiry to receive pricing, availability and lead‑time information for the EPF6024ATC144-2.