EPF6024AQC240-3N

IC FPGA 199 I/O 240QFP
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 199 1960 240-BFQFP

Quantity 699 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFPNumber of I/O199Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs196Number of Logic Elements/Cells1960
Number of Gates24000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of EPF6024AQC240-3N – FLEX 6000 FPGA, 240-pin BFQFP

The EPF6024AQC240-3N is a FLEX 6000 family field-programmable gate array (FPGA) offered in a 240-pin surface-mount package. It implements a register-rich, LUT-based OptiFLEX architecture and targets designers who need a reprogrammable, low-cost alternative to fixed gate-array solutions for prototyping and production designs.

With 1,960 logic elements, up to 24,000 typical gates and nearly 200 I/O pins, this device is suited for applications that require moderate logic density, flexible I/O interfacing and in-circuit reconfigurability while operating from a 3.0 V to 3.6 V supply and a commercial temperature range.

Key Features

  • Core Architecture Register-rich, LUT-based OptiFLEX architecture designed to increase device area efficiency and support reprogrammable logic implementations.
  • Logic Capacity Approximately 1,960 logic elements and a typical gate count of 24,000 provide moderate-density logic resources for control, glue logic and custom accelerators.
  • I/O and Interfaces 199 available I/O pins with individual tri-state output enables and programmable output slew-rate control for flexible system interfacing and noise management.
  • Reconfiguration and Test In-circuit reconfigurability (ICR) via external configuration device or controller and built-in IEEE 1149.1 JTAG boundary-scan test circuitry for board-level testing without consuming user logic.
  • Performance Support Built-in low-skew clock distribution tree, dedicated carry and cascade chains, and FastTrack continuous interconnect structure to support predictable timing for arithmetic and high-fan-in logic.
  • Power and Supply Designed for 3.0 V to 3.6 V supply operation; low-power standby capability (typical less than 0.5 mA) reduces idle power draw.
  • Package and Mounting Surface-mount 240-pin package (listed as 240-BFQFP; supplier device package 240-PQFP, 32×32) suitable for board-level deployment where a PQFP/BFQFP footprint is required.
  • Commercial Grade & Compliance Commercial-grade device with RoHS compliance and an operating temperature range of 0 °C to 85 °C.

Typical Applications

  • Prototyping and Design Validation Reprogrammable logic and in-circuit reconfiguration enable rapid iteration during prototype development and design testing.
  • Gate-Array Replacement Acts as a low-cost, programmable alternative to high-volume gate array implementations where post-production changes or customization are expected.
  • System Glue and Interface Bridging High I/O count and MultiVolt I/O capability allow the device to bridge components or subsystems operating at different logic voltages.
  • Control and Glue Logic Moderate logic density and dedicated arithmetic support (carry chains) make it suitable for custom control logic, counters and state machines.

Unique Advantages

  • OptiFLEX Area Efficiency: Architecture designed to maximize usable silicon area, enabling more logic in a compact device footprint.
  • Flexible I/O Management: Individual tri-state control and programmable slew rates let designers optimize signal integrity and board-level noise performance.
  • Built-in Test and Reconfiguration: Integrated JTAG boundary-scan and support for in-circuit reconfiguration simplify board testing and field updates without consuming user logic.
  • Power-Conscious Operation: Low standby current supports designs with low-power idle requirements while maintaining full functionality when active.
  • Predictable Arithmetic and Routing: Dedicated carry and cascade chains plus FastTrack interconnect provide efficient implementation of adders, counters and high-fan-in logic.
  • RoHS-Compliant Commercial Offering: Meets RoHS requirements and fits standard commercial temperature requirements for general embedded and industrial-adjacent applications.

Why Choose EPF6024AQC240-3N?

The EPF6024AQC240-3N positions itself as a practical, reprogrammable alternative to fixed gate-array designs where flexibility and in-field updates matter. Its combination of roughly 1,960 logic elements, about 24,000 typical gates and nearly 200 I/O pins delivers the resources needed for medium-complexity designs that require robust I/O and on-board testability.

This device is a good fit for teams seeking a commercially graded FPGA with OptiFLEX architecture, built-in test features and support for in-circuit reconfiguration—providing a balance of integration, flexibility and predictable behavior for prototyping, product development and production designs.

Request a quote or submit your quote request to obtain pricing and availability for EPF6024AQC240-3N.

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