EPF6024AQC240-3N
| Part Description |
FLEX 6000 Field Programmable Gate Array (FPGA) IC 199 1960 240-BFQFP |
|---|---|
| Quantity | 699 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 199 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 196 | Number of Logic Elements/Cells | 1960 | ||
| Number of Gates | 24000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of EPF6024AQC240-3N – FLEX 6000 FPGA, 240-pin BFQFP
The EPF6024AQC240-3N is a FLEX 6000 family field-programmable gate array (FPGA) offered in a 240-pin surface-mount package. It implements a register-rich, LUT-based OptiFLEX architecture and targets designers who need a reprogrammable, low-cost alternative to fixed gate-array solutions for prototyping and production designs.
With 1,960 logic elements, up to 24,000 typical gates and nearly 200 I/O pins, this device is suited for applications that require moderate logic density, flexible I/O interfacing and in-circuit reconfigurability while operating from a 3.0 V to 3.6 V supply and a commercial temperature range.
Key Features
- Core Architecture Register-rich, LUT-based OptiFLEX architecture designed to increase device area efficiency and support reprogrammable logic implementations.
- Logic Capacity Approximately 1,960 logic elements and a typical gate count of 24,000 provide moderate-density logic resources for control, glue logic and custom accelerators.
- I/O and Interfaces 199 available I/O pins with individual tri-state output enables and programmable output slew-rate control for flexible system interfacing and noise management.
- Reconfiguration and Test In-circuit reconfigurability (ICR) via external configuration device or controller and built-in IEEE 1149.1 JTAG boundary-scan test circuitry for board-level testing without consuming user logic.
- Performance Support Built-in low-skew clock distribution tree, dedicated carry and cascade chains, and FastTrack continuous interconnect structure to support predictable timing for arithmetic and high-fan-in logic.
- Power and Supply Designed for 3.0 V to 3.6 V supply operation; low-power standby capability (typical less than 0.5 mA) reduces idle power draw.
- Package and Mounting Surface-mount 240-pin package (listed as 240-BFQFP; supplier device package 240-PQFP, 32×32) suitable for board-level deployment where a PQFP/BFQFP footprint is required.
- Commercial Grade & Compliance Commercial-grade device with RoHS compliance and an operating temperature range of 0 °C to 85 °C.
Typical Applications
- Prototyping and Design Validation Reprogrammable logic and in-circuit reconfiguration enable rapid iteration during prototype development and design testing.
- Gate-Array Replacement Acts as a low-cost, programmable alternative to high-volume gate array implementations where post-production changes or customization are expected.
- System Glue and Interface Bridging High I/O count and MultiVolt I/O capability allow the device to bridge components or subsystems operating at different logic voltages.
- Control and Glue Logic Moderate logic density and dedicated arithmetic support (carry chains) make it suitable for custom control logic, counters and state machines.
Unique Advantages
- OptiFLEX Area Efficiency: Architecture designed to maximize usable silicon area, enabling more logic in a compact device footprint.
- Flexible I/O Management: Individual tri-state control and programmable slew rates let designers optimize signal integrity and board-level noise performance.
- Built-in Test and Reconfiguration: Integrated JTAG boundary-scan and support for in-circuit reconfiguration simplify board testing and field updates without consuming user logic.
- Power-Conscious Operation: Low standby current supports designs with low-power idle requirements while maintaining full functionality when active.
- Predictable Arithmetic and Routing: Dedicated carry and cascade chains plus FastTrack interconnect provide efficient implementation of adders, counters and high-fan-in logic.
- RoHS-Compliant Commercial Offering: Meets RoHS requirements and fits standard commercial temperature requirements for general embedded and industrial-adjacent applications.
Why Choose EPF6024AQC240-3N?
The EPF6024AQC240-3N positions itself as a practical, reprogrammable alternative to fixed gate-array designs where flexibility and in-field updates matter. Its combination of roughly 1,960 logic elements, about 24,000 typical gates and nearly 200 I/O pins delivers the resources needed for medium-complexity designs that require robust I/O and on-board testability.
This device is a good fit for teams seeking a commercially graded FPGA with OptiFLEX architecture, built-in test features and support for in-circuit reconfiguration—providing a balance of integration, flexibility and predictable behavior for prototyping, product development and production designs.
Request a quote or submit your quote request to obtain pricing and availability for EPF6024AQC240-3N.

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