EPF6024AQC240-2

IC FPGA 199 I/O 240QFP
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 199 1960 240-BFQFP

Quantity 1,090 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFPNumber of I/O199Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level6 (Time on Label)Number of LABs/CLBs196Number of Logic Elements/Cells1960
Number of Gates24000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of EPF6024AQC240-2 – FLEX 6000 FPGA, 240‑pin BFQFP

The EPF6024AQC240-2 is an Intel FLEX 6000 family field-programmable gate array (FPGA) offered in a 240‑pin BFQFP surface-mount package. It implements a register‑rich, look‑up table (LUT) based OptiFLEX architecture designed for area efficiency and reprogrammability, targeting commercial applications that require a low‑cost, programmable alternative to fixed gate-array designs.

With 1,960 logic elements and approximately 24,000 typical gates, the device is suitable for prototyping, design testing, and medium-density logic integration. Key system-level features include in‑circuit reconfigurability, built‑in JTAG boundary-scan, and robust I/O capabilities for bridging and peripheral interfacing in commercial systems.

Key Features

  • Core Architecture  OptiFLEX, register‑rich LUT‑based architecture optimized for device area efficiency and reprogrammable logic implementation.
  • Logic Capacity  1,960 logic elements providing approximately 24,000 typical gates for medium-density logic integration.
  • I/O Density  199 I/O pins to support parallel peripherals, external busses, and multi-signal interfaces in a single package.
  • Package & Mounting  240‑pin BFQFP surface-mount package; supplier lists a 240‑PQFP (32×32) device package footprint.
  • Power & Temperature  Supply voltage range 3.0 V to 3.6 V and commercial operating temperature range 0 °C to 85 °C.
  • System-Level Reconfigurability  Supports in‑circuit reconfiguration via an external configuration device or intelligent controller to enable design changes without device removal.
  • Test & Boundary Scan  Built‑in IEEE Std. 1149.1 JTAG boundary‑scan circuitry available without consuming device logic; devices are 100% functionally tested prior to shipment.
  • Flexible I/O Controls  Individual tri‑state output enable control and programmable output slew‑rate control to manage signal integrity and switching noise.
  • Routing & Arithmetic Support  FastTrack interconnect, dedicated carry and cascade chains to implement fast adders, counters, and high‑fan‑in logic functions.

Typical Applications

  • Prototyping & Design Validation  Rapid, reprogrammable platform for validating logic designs and iterating system behavior during development.
  • Gate‑Array Replacement  Low‑cost programmable alternative to high‑volume gate arrays for mid-density logic implementations.
  • Peripheral Bridging & Interface Logic  High I/O count and flexible I/O controls make the device suitable for bridging between subsystems and implementing custom bus logic.
  • Embedded Control & User Interfaces  Configurable logic and dedicated arithmetic chains support control tasks, counters, and interface management in commercial equipment.

Unique Advantages

  • Reprogrammable Flexibility: Change functionality in‑circuit or during prototyping to accelerate development cycles and reduce time to market.
  • High I/O in a Compact Package: 199 I/O pins in a 240‑pin BFQFP footprint provide dense external connectivity without a larger package.
  • Verified Reliability: 100% functional testing prior to shipment and integrated JTAG boundary‑scan improve device testability and manufacturing confidence.
  • Efficient Arithmetic & Routing: Dedicated carry and cascade chains plus FastTrack interconnect simplify implementation of adders, counters, and high‑fan‑in logic.
  • Commercial Grade Fit: Designed for commercial applications with a 0 °C to 85 °C operating range and RoHS compliance for regulatory alignment.

Why Choose EPF6024AQC240-2?

The EPF6024AQC240-2 positions itself as a practical, reprogrammable solution for designers who need medium‑density logic, substantial I/O capability, and in‑circuit configurability in a commercial‑grade FPGA. Its OptiFLEX LUT architecture and dedicated arithmetic resources enable efficient mapping of control, interface, and mid‑range processing functions while keeping board-level integration straightforward with a 240‑pin surface‑mount package.

Backed by family-level design tool support and industry standard boundary‑scan testability, this device is suited to teams looking to reduce BOM complexity, iterate quickly during prototyping, and deploy configurable logic into a wide range of commercial electronic systems.

Request a quote or submit a purchase inquiry to receive pricing and availability for the EPF6024AQC240-2.

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