EPF6024AQC240-2
| Part Description |
FLEX 6000 Field Programmable Gate Array (FPGA) IC 199 1960 240-BFQFP |
|---|---|
| Quantity | 1,090 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 199 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 6 (Time on Label) | Number of LABs/CLBs | 196 | Number of Logic Elements/Cells | 1960 | ||
| Number of Gates | 24000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of EPF6024AQC240-2 – FLEX 6000 FPGA, 240‑pin BFQFP
The EPF6024AQC240-2 is an Intel FLEX 6000 family field-programmable gate array (FPGA) offered in a 240‑pin BFQFP surface-mount package. It implements a register‑rich, look‑up table (LUT) based OptiFLEX architecture designed for area efficiency and reprogrammability, targeting commercial applications that require a low‑cost, programmable alternative to fixed gate-array designs.
With 1,960 logic elements and approximately 24,000 typical gates, the device is suitable for prototyping, design testing, and medium-density logic integration. Key system-level features include in‑circuit reconfigurability, built‑in JTAG boundary-scan, and robust I/O capabilities for bridging and peripheral interfacing in commercial systems.
Key Features
- Core Architecture OptiFLEX, register‑rich LUT‑based architecture optimized for device area efficiency and reprogrammable logic implementation.
- Logic Capacity 1,960 logic elements providing approximately 24,000 typical gates for medium-density logic integration.
- I/O Density 199 I/O pins to support parallel peripherals, external busses, and multi-signal interfaces in a single package.
- Package & Mounting 240‑pin BFQFP surface-mount package; supplier lists a 240‑PQFP (32×32) device package footprint.
- Power & Temperature Supply voltage range 3.0 V to 3.6 V and commercial operating temperature range 0 °C to 85 °C.
- System-Level Reconfigurability Supports in‑circuit reconfiguration via an external configuration device or intelligent controller to enable design changes without device removal.
- Test & Boundary Scan Built‑in IEEE Std. 1149.1 JTAG boundary‑scan circuitry available without consuming device logic; devices are 100% functionally tested prior to shipment.
- Flexible I/O Controls Individual tri‑state output enable control and programmable output slew‑rate control to manage signal integrity and switching noise.
- Routing & Arithmetic Support FastTrack interconnect, dedicated carry and cascade chains to implement fast adders, counters, and high‑fan‑in logic functions.
Typical Applications
- Prototyping & Design Validation Rapid, reprogrammable platform for validating logic designs and iterating system behavior during development.
- Gate‑Array Replacement Low‑cost programmable alternative to high‑volume gate arrays for mid-density logic implementations.
- Peripheral Bridging & Interface Logic High I/O count and flexible I/O controls make the device suitable for bridging between subsystems and implementing custom bus logic.
- Embedded Control & User Interfaces Configurable logic and dedicated arithmetic chains support control tasks, counters, and interface management in commercial equipment.
Unique Advantages
- Reprogrammable Flexibility: Change functionality in‑circuit or during prototyping to accelerate development cycles and reduce time to market.
- High I/O in a Compact Package: 199 I/O pins in a 240‑pin BFQFP footprint provide dense external connectivity without a larger package.
- Verified Reliability: 100% functional testing prior to shipment and integrated JTAG boundary‑scan improve device testability and manufacturing confidence.
- Efficient Arithmetic & Routing: Dedicated carry and cascade chains plus FastTrack interconnect simplify implementation of adders, counters, and high‑fan‑in logic.
- Commercial Grade Fit: Designed for commercial applications with a 0 °C to 85 °C operating range and RoHS compliance for regulatory alignment.
Why Choose EPF6024AQC240-2?
The EPF6024AQC240-2 positions itself as a practical, reprogrammable solution for designers who need medium‑density logic, substantial I/O capability, and in‑circuit configurability in a commercial‑grade FPGA. Its OptiFLEX LUT architecture and dedicated arithmetic resources enable efficient mapping of control, interface, and mid‑range processing functions while keeping board-level integration straightforward with a 240‑pin surface‑mount package.
Backed by family-level design tool support and industry standard boundary‑scan testability, this device is suited to teams looking to reduce BOM complexity, iterate quickly during prototyping, and deploy configurable logic into a wide range of commercial electronic systems.
Request a quote or submit a purchase inquiry to receive pricing and availability for the EPF6024AQC240-2.

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