EPF6024AQI208-3

IC FPGA 171 I/O 208QFP
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 171 1960 208-BFQFP

Quantity 908 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case208-BFQFPNumber of I/O171Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs196Number of Logic Elements/Cells1960
Number of Gates24000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of EPF6024AQI208-3 – FLEX 6000 Field Programmable Gate Array (FPGA) IC, 208-BFQFP

The EPF6024AQI208-3 is a FLEX 6000 family FPGA offering a register-rich, LUT-based OptiFLEX architecture targeted at low-cost gate-array replacement, prototyping, and design testing. It provides reprogrammable logic resources and system-level features such as in-circuit reconfigurability and IEEE 1149.1 JTAG boundary-scan for debug and test.

Designed for embedded and industrial applications, the device combines 1,960 logic elements with up to 171 I/O pins in a 208-pin fine-pitch package, supporting a 3.0 V to 3.6 V supply and an operating temperature range of -40 °C to 100 °C.

Key Features

  • Core Architecture  Register-rich, LUT-based OptiFLEX architecture that improves device area efficiency and supports reprogrammable SRAM-based designs.
  • Logic Capacity  Approximately 1,960 logic elements and a typical gate-equivalent count of 24,000 (family figure) for medium-density logic implementation.
  • I/O  Up to 171 I/O pins to support broad peripheral interfacing and system integration requirements.
  • On-chip Memory  No embedded RAM bits are provided on this device (Total RAM Bits: 0).
  • System-Level Features  In-circuit reconfigurability (ICR) via external configuration devices or intelligent controllers; built-in JTAG boundary-scan (IEEE Std. 1149.1) for test and debug.
  • I/O Flexibility  MultiVolt I/O interface operation to bridge systems operating at different voltages (family feature).
  • Clock & Performance  Built-in low-skew clock distribution tree and dedicated carry/cascade chains for arithmetic and high-fan-in logic (family features).
  • Package & Mounting  208-pin BFQFP / PQFP (28×28) package, surface-mount mounting type for compact board designs.
  • Power & Supply  Operates from a 3.0 V to 3.6 V supply range.
  • Environmental & Reliability  RoHS compliant; industrial-grade operating temperature from -40 °C to 100 °C.

Typical Applications

  • Prototyping & Design Validation  Use as a reprogrammable alternative to gate arrays for rapid design iteration and functional testing during development.
  • Low- to Mid-Volume Logic Replacement  Implement medium-density digital logic where a programmable solution reduces turnkey gate-array costs and shortens time-to-market.
  • System Interfacing  MultiVolt I/O capability allows bridging between subsystems operating at different voltage domains.
  • Embedded Industrial Control  Industrial temperature range and surface-mount packaging make the device suitable for control, monitoring, and user-interface logic in industrial systems.

Unique Advantages

  • Reprogrammable Flexibility:  SRAM-based reconfiguration and in-circuit reprogramming enable fast functional changes without respins.
  • Verified Quality:  100% functional testing at shipment reduces integration risk and supports reliable production use.
  • Rich I/O Count:  171 I/O pins provide broad connectivity for peripheral interfaces and system signals without additional glue logic.
  • Industrial Temperature Range:  Rated from -40 °C to 100 °C to meet the thermal requirements of industrial designs.
  • Package Options for Compact Designs:  208-pin BFQFP/PQFP 28×28 surface-mount package enables dense PCB routing in constrained spaces.

Why Choose EPF6024AQI208-3?

The EPF6024AQI208-3 positions itself as a practical, reprogrammable solution for designers needing medium-density programmable logic with substantial I/O and industrial temperature support. Its OptiFLEX architecture and family-level features such as low-skew clocks, JTAG boundary-scan, and in-circuit reconfigurability deliver a combination of design flexibility and system-level testability.

This device is suited to teams replacing gate-array designs, accelerating prototyping cycles, or consolidating discrete logic into a single programmable device while maintaining RoHS compliance and industrial-grade operating conditions.

Request a quote or submit an RFQ today to get pricing and availability for EPF6024AQI208-3 and evaluate how it fits your next design iteration.

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