EPF6024AQI208-3
| Part Description |
FLEX 6000 Field Programmable Gate Array (FPGA) IC 171 1960 208-BFQFP |
|---|---|
| Quantity | 908 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 171 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 196 | Number of Logic Elements/Cells | 1960 | ||
| Number of Gates | 24000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of EPF6024AQI208-3 – FLEX 6000 Field Programmable Gate Array (FPGA) IC, 208-BFQFP
The EPF6024AQI208-3 is a FLEX 6000 family FPGA offering a register-rich, LUT-based OptiFLEX architecture targeted at low-cost gate-array replacement, prototyping, and design testing. It provides reprogrammable logic resources and system-level features such as in-circuit reconfigurability and IEEE 1149.1 JTAG boundary-scan for debug and test.
Designed for embedded and industrial applications, the device combines 1,960 logic elements with up to 171 I/O pins in a 208-pin fine-pitch package, supporting a 3.0 V to 3.6 V supply and an operating temperature range of -40 °C to 100 °C.
Key Features
- Core Architecture Register-rich, LUT-based OptiFLEX architecture that improves device area efficiency and supports reprogrammable SRAM-based designs.
- Logic Capacity Approximately 1,960 logic elements and a typical gate-equivalent count of 24,000 (family figure) for medium-density logic implementation.
- I/O Up to 171 I/O pins to support broad peripheral interfacing and system integration requirements.
- On-chip Memory No embedded RAM bits are provided on this device (Total RAM Bits: 0).
- System-Level Features In-circuit reconfigurability (ICR) via external configuration devices or intelligent controllers; built-in JTAG boundary-scan (IEEE Std. 1149.1) for test and debug.
- I/O Flexibility MultiVolt I/O interface operation to bridge systems operating at different voltages (family feature).
- Clock & Performance Built-in low-skew clock distribution tree and dedicated carry/cascade chains for arithmetic and high-fan-in logic (family features).
- Package & Mounting 208-pin BFQFP / PQFP (28×28) package, surface-mount mounting type for compact board designs.
- Power & Supply Operates from a 3.0 V to 3.6 V supply range.
- Environmental & Reliability RoHS compliant; industrial-grade operating temperature from -40 °C to 100 °C.
Typical Applications
- Prototyping & Design Validation Use as a reprogrammable alternative to gate arrays for rapid design iteration and functional testing during development.
- Low- to Mid-Volume Logic Replacement Implement medium-density digital logic where a programmable solution reduces turnkey gate-array costs and shortens time-to-market.
- System Interfacing MultiVolt I/O capability allows bridging between subsystems operating at different voltage domains.
- Embedded Industrial Control Industrial temperature range and surface-mount packaging make the device suitable for control, monitoring, and user-interface logic in industrial systems.
Unique Advantages
- Reprogrammable Flexibility: SRAM-based reconfiguration and in-circuit reprogramming enable fast functional changes without respins.
- Verified Quality: 100% functional testing at shipment reduces integration risk and supports reliable production use.
- Rich I/O Count: 171 I/O pins provide broad connectivity for peripheral interfaces and system signals without additional glue logic.
- Industrial Temperature Range: Rated from -40 °C to 100 °C to meet the thermal requirements of industrial designs.
- Package Options for Compact Designs: 208-pin BFQFP/PQFP 28×28 surface-mount package enables dense PCB routing in constrained spaces.
Why Choose EPF6024AQI208-3?
The EPF6024AQI208-3 positions itself as a practical, reprogrammable solution for designers needing medium-density programmable logic with substantial I/O and industrial temperature support. Its OptiFLEX architecture and family-level features such as low-skew clocks, JTAG boundary-scan, and in-circuit reconfigurability deliver a combination of design flexibility and system-level testability.
This device is suited to teams replacing gate-array designs, accelerating prototyping cycles, or consolidating discrete logic into a single programmable device while maintaining RoHS compliance and industrial-grade operating conditions.
Request a quote or submit an RFQ today to get pricing and availability for EPF6024AQI208-3 and evaluate how it fits your next design iteration.

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