EPF6024AQC240-2N

The EPF6024AQC240-2N is a FLEX 6000 family programmable logic device that implements a register-rich, look-up-table (LUT) based architecture (OptiFLEX) for area-efficient, reconfigurable logic. Designed as a low-cost, programmable alternative to gate-array designs, it targets prototyping, design testing, and low-to-medium density custom logic integration where in-circuit reconfiguration and boundary-scan testability are required.

Key device characteristics include approximately 1,960 logic elements (≈24,000 typical gates), 199 user I/Os, operation from a 3.0 V to 3.6 V supply, and a commercial operating temperature range of 0 °C to 85 °C. The device is supplied in a 240‑pin fine-pitch quad flat package for surface-mount use and is RoHS compliant.

Key Features

• OptiFLEX architecture: Register-rich, LUT-based core that improves die-area efficiency while providing flexible, reprogrammable logic resources.
• Logic capacity: Approximately 1,960 logic elements (typical ~24,000 gates) for implementing medium-density custom logic and glue‑logic functions.
• I/O and package: 199 user I/Os packaged in a 240‑pin BFQFP/PQFP (supplier lists 240‑PQFP 32×32) surface-mount package, enabling a dense peripheral interface count.
• Configuration and test: In-circuit reconfigurability via external configuration device or intelligent controller and built-in JTAG boundary-scan test circuitry compliant with IEEE Std. 1149.1-1990, available without consuming device logic.
• Flexible interconnect and arithmetic support: FastTrack interconnect structure with dedicated carry and cascade chains for high-speed adders, counters, and high-fan-in logic functions.
• Fast I/O control: Individual tri-state output enable per pin, programmable output slew-rate control to reduce switching noise, and a fast register‑to‑I/O path for improved clock‑to‑output time.
• Power and supply: Operates from a 3.0 V to 3.6 V supply; datasheet cites low standby current (typical <0.5 mA).
• Memory: No on-chip embedded RAM (Total RAM bits: 0), making the device suitable for pure-logic and I/O-focused implementations.
• Environment and grade: Commercial grade device, RoHS compliant, with an operating temperature range of 0 °C to 85 °C.

Typical Applications

• Prototyping & evaluation: Rapid reprogrammability and in-circuit configuration capability make the device well suited for hardware prototyping and iterative design testing.
• Gate-array replacement: Low-cost programmable alternative to custom gate-array implementations for mid-volume production where design flexibility is needed.
• Custom peripheral interfacing: High I/O count and programmable I/O controls allow implementation of custom bus interfaces, protocol glue logic, and peripheral aggregation.
• System control & glue logic: Implement control state machines, counters, comparators, and other control logic using dedicated carry and cascade resources.

Unique Advantages

• Reconfigurable design flow: In-circuit reconfigurability enables design updates and functional changes without board rework, accelerating development cycles.
• Boundary-scan testability: Built-in IEEE 1149.1 JTAG boundary-scan reduces the need for additional test logic and simplifies board-level bring-up and debug.
• Predictable routing & performance: FastTrack interconnect and low-skew global paths provide consistent routing behavior for timing‑sensitive designs.
• High I/O density in a compact package: 199 user I/Os in a 240‑pin surface-mount package enable dense peripheral connectivity while maintaining a compact PCB footprint.
• Dedicated arithmetic chains: Built-in carry and cascade chains accelerate implementation of adders, counters, and high‑fan‑in logic without manual routing effort.
• Standby power efficiency: Low typical standby current supports lower-power system modes when the device is not actively switching.

Why Choose EPF6024AQC240-2N?

The EPF6024AQC240-2N is positioned for designers who need a commercially graded, reprogrammable logic device that balances logic capacity, I/O density, and package convenience. Its OptiFLEX architecture, FastTrack interconnect, and dedicated arithmetic chains deliver a predictable implementation platform for mid-density custom logic, glue logic, and interface aggregation.

With built-in JTAG boundary-scan, in-circuit reconfiguration, and support for established development toolchains referenced in the family data, this FLEX 6000 device offers a practical, testable, and reconfigurable solution for prototyping and volume designs where flexibility and integration reduce BOM complexity and speed time-to-market.

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