EPF6024ATC144-1
| Part Description |
FLEX 6000 Field Programmable Gate Array (FPGA) IC 117 1960 144-LQFP |
|---|---|
| Quantity | 1,015 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 117 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 196 | Number of Logic Elements/Cells | 1960 | ||
| Number of Gates | 24000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of EPF6024ATC144-1 – FLEX 6000 FPGA, 117 I/O, 1,960 logic elements, 144‑LQFP
The EPF6024ATC144-1 is a FLEX 6000 family Field Programmable Gate Array (FPGA) offering a register-rich, look-up table (LUT) based architecture optimized for low-cost, reconfigurable logic. Built on the OptiFLEX architecture, this device targets prototyping, design testing, and system-level glue logic where in-circuit reconfigurability and flexible I/O are required.
With 1,960 logic elements and up to 117 I/O pins in a 144‑pin surface-mount package, the EPF6024ATC144-1 delivers a compact, reprogrammable solution for engineers needing predictable interconnect, dedicated arithmetic chains, and support for multi-voltage I/O operation.
Key Features
- Core Architecture Register-rich, LUT-based OptiFLEX architecture for area-efficient, reprogrammable logic implementation.
- Logic Density Approximately 1,960 logic elements and a typical gate count of 24,000, providing capacity for moderate-density logic designs.
- I/O and Pin Count 117 available I/O pins with individual tri-state output enable control and programmable output slew-rate options for signal integrity management.
- Configuration & Test Supports in-circuit reconfigurability and includes IEEE 1149.1 JTAG boundary-scan circuitry for board-level test and debug without consuming user logic.
- Interconnect & Arithmetic Support FastTrack continuous routing, dedicated carry chains, and cascade chains for efficient implementation of adders, counters, and high‑fan‑in logic.
- Power and Supply Operates from a 3.0 V to 3.6 V supply; device family notes low standby current characteristics typical of FLEX 6000 devices.
- Package & Mounting Surface-mount 144‑LQFP package (supplier device package: 144‑TQFP 20×20) suitable for compact board layouts.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C and RoHS compliant for standard commercial applications.
Typical Applications
- Prototyping and Design Validation Reprogrammable logic for rapid design iterations and functional testing during development cycles.
- In-Circuit Reconfiguration Systems that require feature updates or mode switching in the field using external configuration devices or intelligent controllers.
- Voltage-Domain Bridging MultiVolt I/O capability enables interfacing between subsystems that operate at different I/O voltages.
- Peripheral and Interface Glue Logic Compact solution for consolidating discrete logic, implementing custom protocols, or managing board-level control functions.
Unique Advantages
- Reprogrammable Flexibility: In-circuit reconfiguration allows design changes without board rework, accelerating development and enabling field updates.
- Predictable, High‑Efficiency Routing: FastTrack interconnect and OptiFLEX architecture deliver efficient use of device area and predictable routing delays for timing-sensitive designs.
- Dedicated Arithmetic Resources: Built-in carry and cascade chains simplify implementation of fast adders, counters, and high‑fan‑in logic without extra fabric overhead.
- Test and Debug Support: Integrated IEEE 1149.1 JTAG boundary-scan circuitry supports board-level testing and debug with minimal impact on user logic.
- Compact Packaging: 144‑pin LQFP surface-mount package provides a balance of I/O count and small PCB footprint for space-constrained applications.
Why Choose EPF6024ATC144-1?
The EPF6024ATC144-1 positions itself as a compact, reprogrammable alternative to fixed gate-array implementations—delivering the flexibility to iterate designs quickly while maintaining predictable interconnect and specialized arithmetic chains. Its combination of ~1,960 logic elements, 117 I/O pins, and OptiFLEX architecture makes it well suited to engineers developing prototypes, embedded control logic, and board-level interface functions.
Backed by the FLEX 6000 family design ecosystem, the device offers scalable pin and package compatibility across the family, integrated testability, and support for multi-voltage I/O scenarios—helping reduce BOM complexity and shorten development cycles for commercial-grade applications.
Request a quote or submit a procurement inquiry to receive pricing and availability for EPF6024ATC144-1.

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