EPF6024ATC144-1N

IC FPGA 117 I/O 144TQFP
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 117 1960 144-LQFP

Quantity 1,313 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O117Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs196Number of Logic Elements/Cells1960
Number of Gates24000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/A

Overview of EPF6024ATC144-1N – FLEX 6000 Field Programmable Gate Array (FPGA) IC 117 1960 144-LQFP

The EPF6024ATC144-1N is a FLEX 6000 family programmable logic device offering a register-rich, LUT-based architecture optimized for medium-density programmable logic designs. It combines 1,960 logic elements with a typical equivalent of 24,000 gates and up to 117 I/O in a 144-pin LQFP package, making it suitable for prototyping, design testing, and gate-array replacement applications where fast design iteration and flexible I/O are required.

Designed for commercial applications, the device supports a 3.0 V to 3.6 V supply range, surface-mount mounting in a 144‑LQFP footprint, and an operating temperature range of 0 °C to 85 °C.

Key Features

  • Architecture Register-rich, LUT-based OptiFLEX architecture that improves area efficiency for programmable logic implementations.
  • Logic Capacity 1,960 logic elements delivering the equivalent of approximately 24,000 typical gates for medium-density designs.
  • I/O and Packaging Up to 117 user I/O pins in a 144‑LQFP (144‑TQFP 20×20) package; surface-mount mounting for compact board designs.
  • Clock and Routing Built-in low-skew clock distribution and dedicated fast carry and cascade chains to support high-speed arithmetic and wide fan-in logic functions.
  • Reconfiguration and Test In-circuit reconfigurability via an external configuration device or intelligent controller, and built-in JTAG boundary-scan (IEEE Std. 1149.1) for device-level testing without consuming user logic.
  • Power and Supply Operates from a 3.0 V to 3.6 V supply, suitable for 3.3 V system environments.
  • Thermal and Compliance Commercial grade operation from 0 °C to 85 °C and RoHS-compliant device status.
  • Memory Device contains no embedded RAM bits (total RAM bits: 0), enabling predictable LUT-based logic utilization.

Typical Applications

  • Prototyping & Design Validation Rapid hardware iteration and functional validation during development cycles, leveraging reprogrammability and LUT-based logic.
  • Gate-Array Replacement Low-cost, reprogrammable alternative to fixed gate-array implementations for medium-density designs that benefit from quick design changes.
  • System I/O Bridging Flexible I/O pin count and dedicated I/O features support bridging and interfacing tasks across system components in mixed-voltage environments.
  • Embedded Control and Glue Logic Implement custom control logic, state machines, and interface glue in a compact 144‑pin surface-mount package.

Unique Advantages

  • High Logic Integration: 1,960 logic elements with an equivalent of ~24,000 gates provides substantial integration in a 144‑pin package, reducing external glue logic.
  • Compact, Surface-Mount Package: 144‑LQFP (20×20) footprint supports dense PCB layouts while maintaining ample I/O (117 pins).
  • Reprogrammability: In-circuit reconfigurability enables field updates and rapid prototype iterations without board changes.
  • Built-In Testability: JTAG boundary-scan (IEEE 1149.1) support allows device-level testing and board diagnostics without consuming user logic resources.
  • Commercial Temperature Range: Rated for 0 °C to 85 °C operation, matching typical commercial application requirements.
  • Regulatory Compliance: RoHS-compliant construction for modern manufacturing and environmental requirements.

Why Choose EPF6024ATC144-1N?

The EPF6024ATC144-1N positions itself as a practical, medium-density programmable logic solution for engineering teams needing flexibility, reprogrammability, and a compact package footprint. With 1,960 logic elements, 117 I/O, and a 144‑LQFP surface-mount package, it delivers a balance of integration and board-level simplicity for prototyping, gate-array replacement, and control/bridging functions in commercial applications.

Supply voltage compatibility with 3.0 V–3.6 V systems, built-in JTAG testability, and RoHS compliance make this device a suitable choice for designers seeking predictable integration and straightforward lifecycle support within the FLEX 6000 family framework.

Request a quote or submit an inquiry to receive pricing and availability information for EPF6024ATC144-1N. Our team can assist with lead times and volume pricing to support your design and production needs.

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