EPF6024ATC144-3

IC FPGA 117 I/O 144TQFP
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 117 1960 144-LQFP

Quantity 1,410 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O117Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level6 (Time on Label)Number of LABs/CLBs196Number of Logic Elements/Cells1960
Number of Gates24000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of EPF6024ATC144-3 – FLEX 6000 Field Programmable Gate Array (FPGA), 1,960 logic elements, 117 I/O, 144-LQFP

The EPF6024ATC144-3 is a FLEX 6000 family programmable logic device from Intel (Altera) that combines a register-rich, LUT-based architecture with the OptiFLEX area-efficiency approach. It provides 1,960 logic elements and a typical equivalent of 24,000 gates in a 144-pin surface-mount package, targeting low-cost alternatives to gate-array designs and rapid design iteration during prototyping and testing.

With 117 I/O pins, multi-voltage I/O capability described for the family, and in-circuit reconfigurability, this device is suited for embedded systems and control applications that require flexible I/O interfacing and field updates within a commercial temperature range.

Key Features

  • Core architecture – Register-rich, LUT-based OptiFLEX architecture for efficient use of device area and routability.
  • Logic capacity – 1,960 logic elements and approximately 24,000 typical gates, providing mid-range programmable capacity for control, glue logic, and custom functions.
  • I/O and interfacing – 117 I/O pins to support system-level connectivity and bridging between subsystems operating at different voltages (family MultiVolt I/O operation).
  • Reconfiguration and test – Supports in-circuit reconfigurability via external configuration devices or intelligent controllers; includes IEEE 1149.1 JTAG boundary-scan test circuitry (family feature).
  • Clocking and interconnect – Built-in low-skew clock distribution tree and four low-skew global paths; FastTrack interconnect structure with dedicated carry and cascade chains for arithmetic and high-fan-in logic.
  • Power and supply – Designed for 3.0 V to 3.6 V supply operation; family documentation notes low standby current (typical specification less than 0.5 mA in standby mode).
  • Package and mounting – 144-LQFP package case (supplier package listed as 144-TQFP 20×20) with surface-mount mounting for compact PCB footprints.
  • Commercial temperature grade – Rated for 0 °C to 85 °C operating temperature for standard commercial applications.

Typical Applications

  • Prototyping and design validation – Use as a reprogrammable alternative to gate arrays for fast design changes and iterative testing during development cycles.
  • Embedded control and glue logic – Implement custom control, timing, or interfacing functions where 1,960 logic elements and 117 I/O can consolidate discrete logic.
  • Field-upgradable systems – In-circuit reconfiguration enables functional updates in deployed hardware via external configuration devices or controllers.
  • Mixed-voltage system bridging – MultiVolt I/O operation enables interfacing between subsystems running at different voltage levels within commercial equipment.

Unique Advantages

  • Reconfigurable during deployment – In-circuit reconfigurability allows design updates without board-level hardware changes, shortening maintenance and upgrade cycles.
  • Balanced mid-range capacity – 1,960 logic elements and ~24,000 gates provide sufficient density for a wide range of control and glue-logic tasks while keeping board footprint and cost low.
  • Flexible I/O count – 117 I/O pins offer broad connectivity for sensors, peripherals, and buses without needing external I/O expanders.
  • Dedicated arithmetic support – Built-in carry and cascade chains simplify implementation of adders, counters, and comparators, reducing routing complexity and improving performance potential.
  • Compact surface-mount package – 144-LQFP (supplier 144-TQFP 20×20) provides a compact, manufacturable form factor for space-constrained PCB layouts.
  • Standard commercial temperature rating – 0 °C to 85 °C operation aligns with general-purpose embedded and consumer applications.

Why Choose EPF6024ATC144-3?

The EPF6024ATC144-3 positions itself as a practical, reprogrammable solution for engineers seeking a mid-density programmable logic device with flexible I/O and in-field update capability. Its OptiFLEX architecture, on-chip resources, and family-level features such as low-skew clocking, FastTrack interconnect, and JTAG boundary-scan support make it a suitable choice for prototyping, control logic, and system interfacing in commercial equipment.

This device is appropriate for teams that need a balance of capacity, configurability, and compact packaging, backed by the FLEX 6000 family design support and tooling referenced in the family documentation.

Request a quote or submit an inquiry to receive pricing, availability, and technical support information for the EPF6024ATC144-3.

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