EPF81188AQC208-2

The EPF81188AQC208-2 is a FLEX 8000 family field-programmable logic device from Intel, delivering 1,008 logic elements and a high-pin-count 208-BFQFP surface-mount package for board-level integration. Built for mid-density programmable logic applications, this device targets system designs that require substantial register resources, flexible I/O, and in-system configurability.

Typical use cases include bus interfaces, coprocessor and controller functions, digital signal processing tasks, and integration of multiple high-width data paths where predictable routing and register-rich architecture matter.

Key Features

• Core Capacity  1,008 logic elements and 126 logic array blocks (LABs) provide a balance of logic density and register resources suitable for mid-range programmable logic tasks.
• High Pin Count I/O  Up to 148 user I/O pins on the 208-BFQFP package enable integration with multiple buses and peripherals on a single device.
• Flexible Interconnect  Series-level FastTrack continuous routing and dedicated carry and cascade chains enable predictable interconnect delays and efficient implementation of arithmetic and high-fan-in logic.
• In-Circuit Reconfigurability (ICR)  Supports reconfiguration via external configuration devices or an intelligent controller to enable field updates and design iteration without board removal.
• MultiVolt™ I/O Compatibility  Series support for MultiVolt I/O allows the device core to operate at 5.0 V while I/O pins are compatible with both 5.0 V and 3.3 V logic environments; the device supply range is specified at 4.75 V to 5.25 V.
• System Test and Integration  Selected devices in the family include JTAG boundary-scan (IEEE 1149.1) for board-level testability and easier integration into complex systems.
• Programmable Output Control  Slew-rate control on outputs helps manage switching noise at the board level for cleaner signal integrity.
• Commercial-Grade Package  Surface-mount 208-BFQFP (supplier package: 208-PQFP, 28 × 28 mm) for standard commercial PCB assembly; operating temperature range 0 °C to 70 °C.
• Low Standby Power  Series documentation indicates low-power standby behavior (typical standby currents specified at or below 0.5 mA in series literature), supporting designs with low idle power requirements.
• Design Tool Support  The FLEX 8000 family is supported by vendor-provided software design tools and automatic place-and-route flows for streamlined development and implementation.
• RoHS Compliant  Manufactured in compliance with RoHS requirements for lead-free assembly environments.

Typical Applications

• Bus Interfaces  Consolidate and bridge multiple 32-bit buses or mixed-width data paths using the device’s high I/O count and register-rich fabric for reliable data throughput.
• High-Speed Controllers  Implement high-performance control logic and state machines where predictable routing and dedicated arithmetic chains reduce design complexity.
• Coprocessor and TTL Integration  Offload application-specific functions or glue logic for TTL-based systems while taking advantage of flexible I/O voltage compatibility.
• Digital Signal Processing  Deploy for DSP-like functions, wide-data-path manipulation, and data transformation leveraging abundant registers and optimized interconnect resources.

Unique Advantages

• Balanced Logic and Register Resources: With 1,008 logic elements and 126 LABs, the device provides a mid-density platform for designs that need substantial registers without overcommitting on area.
• Predictable Routing for Timing: FastTrack continuous routing and dedicated carry/cascade chains help achieve deterministic interconnect delays and simplify timing closure.
• Flexible I/O Strategy: MultiVolt I/O compatibility and 148 user I/O pins reduce the need for external level shifters and simplify mixed-voltage system designs.
• Field Reconfigurability: In-circuit reconfigurability enables updates and iterative development in the field, reducing lifecycle costs and enabling late-stage feature additions.
• Board-Level Testability: JTAG boundary-scan support on selected devices facilitates manufacturing test and debug, accelerating bring-up on complex PCBs.
• Commercial Package and Compliance: Surface-mount 208-BFQFP packaging and RoHS compliance support mainstream commercial product assembly and regulatory expectations.

Why Choose EPF81188AQC208-2?

The EPF81188AQC208-2 positions itself as a practical, mid-density programmable logic solution for embedded system designers and integrators who need a register-rich FPGA with flexible I/O and predictable routing. Its combination of 1,008 logic elements, a 148-pin I/O footprint, and surface-mount 208-BFQFP packaging make it suitable for consolidating glue logic, bus interfaces, controllers, and DSP-like functions on a single device.

Backed by the FLEX 8000 family toolchain support and series-level features such as in-circuit reconfigurability and dedicated arithmetic chains, the EPF81188AQC208-2 offers a scalable, supported platform for commercial applications requiring reliable performance across the 0 °C to 70 °C temperature range and a 4.75 V to 5.25 V supply environment.

Request a quote or submit your design requirements to receive pricing and availability information for the EPF81188AQC208-2. Our team can help match device quantities and packaging options to your project schedule.