EPF81188AQC240-3

IC FPGA 184 I/O 240QFP
Part Description

FLEX 8000 Field Programmable Gate Array (FPGA) IC 184 1008 240-BFQFP

Quantity 1,303 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFPNumber of I/O184Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs126Number of Logic Elements/Cells1008
Number of Gates12000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/A

Overview of EPF81188AQC240-3 – FLEX 8000 Field Programmable Gate Array (FPGA) IC 184 I/O, 1,008 Logic Elements, 240-BFQFP

The EPF81188AQC240-3 is a FLEX 8000 family programmable logic device from Intel, offering a register-rich, CMOS FPGA architecture optimized for system-level integration in commercial applications. It combines a dense logic fabric with flexible I/O and reconfiguration capabilities to support bus interfaces, data transformation, and high-speed control functions.

With 1,008 logic elements and up to 184 user I/O pins in a 240-pin BFQFP package, this device targets designers who need a compact, high-pin-count programmable device for 5.0 V systems while leveraging the FLEX 8000 family’s routing, arithmetic, and system features.

Key Features

  • Logic Capacity — 1,008 logic elements distributed across the device, providing a balanced mix of logic and register resources for control, glue-logic, and medium-density integration.
  • High I/O Count — 184 user I/O pins suitable for multi-bus integration, wide data paths, and interfacing with parallel peripherals.
  • Package and Mounting — Supplied in a 240-BFQFP package (supplier device package: 240-PQFP 32×32) and designed for surface-mount assembly.
  • Power and Temperature — Supports a 4.75 V to 5.25 V supply and is rated for commercial operation from 0 °C to 70 °C.
  • In-Circuit Reconfigurability — Family-level support for in-circuit reconfigurability (ICR) via external configuration devices or an intelligent controller to enable field updates and iterative development.
  • MultiVolt I/O — Family MultiVolt I/O interface enables the device core to run at 5.0 V while I/O pins are compatible with 5.0 V and 3.3 V logic levels, simplifying mixed-voltage system designs.
  • FastTrack Interconnect & Dedicated Chains — Continuous routing structure with dedicated carry and cascade chains to implement fast arithmetic and high-fan-in logic functions efficiently.
  • System-Level Features — Family features include PCI Local Bus Specification compliance for 5.0-V operation (PCI SIG Rev. 2.2), optional JTAG boundary-scan on selected devices, programmable output slew-rate control, and low standby current (typical ≤ 0.5 mA).
  • Design and Tooling — Fabricated on an advanced SRAM process with software support and automatic place-and-route available through the MAX+PLUS II development system and standard HDL/netlist flows.

Typical Applications

  • Bus Interfaces and Bridges — Use the device’s high I/O count and MultiVolt I/O capability to implement parallel bus interfaces and protocol bridging in 5.0 V systems.
  • High-Speed Controllers — Implement timing-critical control logic and high-speed peripheral controllers that benefit from dedicated carry/cascade chains and predictable interconnect.
  • Data Transformation and DSP Glue Logic — Suitable for wide-data-path manipulation, data formatting, and intermediate processing stages in signal-processing and coprocessor applications.
  • TTL Integration and System Glue — Ideal for integrating TTL-level peripherals and consolidating discrete logic into a single programmable device.

Unique Advantages

  • Flexible Reconfiguration: In-circuit reconfigurability lets designers update logic in the field or refine designs without PCB changes.
  • Mixed-Voltage Interfacing: MultiVolt I/O support simplifies integration with both 5.0 V and 3.3 V peripherals while keeping the core compatible with 5.0 V systems.
  • Predictable Performance: FastTrack continuous routing and dedicated arithmetic/cascade chains provide repeatable interconnect behavior for timing-sensitive designs.
  • High Pin Density in a Compact Package: 184 user I/Os in a 240-BFQFP package reduce board-level routing complexity for multi-bus and parallel applications.
  • Low Standby Power: Family-level low-power standby operation (typical ≤ 0.5 mA) helps minimize idle power in battery-assisted or always-on systems.
  • Established Toolchain: Support from the MAX+PLUS II development environment and standard HDL/netlist flows accelerates design entry, synthesis, and verification.

Why Choose EPF81188AQC240-3?

The EPF81188AQC240-3 positions itself as a practical choice for commercial embedded designs that require medium-density programmable logic with a high number of I/Os and robust system features. Its combination of 1,008 logic elements, 184 user I/Os, MultiVolt I/O compatibility, and in-circuit reconfigurability delivers design flexibility for bus interfaces, controllers, and DSP glue logic in 5.0 V environments.

Backed by FLEX 8000 family features and an established design tool ecosystem, the EPF81188AQC240-3 is suited to teams seeking a balanced trade-off between integration, predictable routing, and support for mixed-voltage systems over the product lifecycle.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the EPF81188AQC240-3. Our team can provide the details you need to evaluate this device for your next design.

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