EPF81188AQI208-4

IC FPGA 148 I/O 208QFP
Part Description

FLEX 8000 Field Programmable Gate Array (FPGA) IC 148 1008 208-BFQFP

Quantity 639 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case208-BFQFPNumber of I/O148Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs126Number of Logic Elements/Cells1008
Number of Gates12000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/A

Overview of EPF81188AQI208-4 – FLEX 8000 FPGA, 1,008 logic elements, 148 I/O, 208‑BFQFP

The EPF81188AQI208-4 is a member of the FLEX 8000 programmable logic device family offering mid-density, register-rich FPGA capability in a surface-mount 208‑BFQFP package. It delivers 1,008 logic elements (approximately 12,000 gates) with 148 user I/O pins and is specified for industrial operation.

Designed for system-level integration, the device supports in-circuit reconfigurability and family-level features such as MultiVolt I/O, predictable routing, and dedicated arithmetic chains, making it suitable for bus interfaces, high-speed controllers, coprocessor functions and other embedded logic tasks.

Key Features

  • Core Architecture FLEX 8000 family programmable logic device architecture providing a fine-grained LUT-and-register implementation for flexible logic mapping.
  • Logic Capacity 1,008 logic elements (≈12,000 usable gates) and 126 logic array blocks, supporting register-rich designs and moderate combinational density.
  • I/O and Packaging 148 user I/O pins in a 208‑BFQFP surface-mount package (supplier package: 208‑PQFP, 28×28 mm) for high-pin-count board designs.
  • Voltage Supply and I/O Levels Operating supply range 4.75 V to 5.25 V. Family MultiVolt I/O support enables a 5.0 V core while providing compatibility with both 5.0 V and 3.3 V logic levels.
  • System-Level Features In-circuit reconfigurability (ICR) via external configuration devices or an intelligent controller; peripheral register options for fast setup and predictable clock-to-output timing.
  • Interconnect and Arithmetic Support FastTrack continuous routing structure for predictable interconnect delays plus dedicated carry and cascade chains for efficient adders, counters and high-fan-in logic.
  • Memory No on-chip embedded RAM (Total RAM bits: 0), making the device focused on logic and register resources.
  • Power and Low-Power Modes Low-power standby operation (typical specification cited as 0.5 mA or less in standby for the family).
  • Reliability and Compliance Industrial operating temperature range of −40 °C to 85 °C and RoHS compliant.

Typical Applications

  • Bus Interfaces Integrate multiple buses or implement custom bus bridges where moderate logic density and many I/O pins are required.
  • High-Speed Controllers Implement control logic and timing-critical functions leveraging dedicated carry/cascade chains and predictable routing.
  • Coprocessor and Custom Logic Offload specialized processing or glue logic tasks using the device’s register resources and logic element array.
  • TTL and Legacy Integration Interface with legacy 5.0 V TTL systems while supporting 3.3 V compatible I/O levels where needed.

Unique Advantages

  • Configurable mid-density logic: 1,008 logic elements and roughly 12,000 gates provide a compact, programmable implementation for many embedded functions without excessive device overhead.
  • Flexible I/O voltage support: MultiVolt I/O enables a 5.0 V core with I/O compatibility for 5.0 V and 3.3 V signaling, simplifying mixed-voltage system integration.
  • In-field reconfigurability: Supports in-circuit reconfigurability via external configuration devices or controllers for firmware updates and field customization.
  • Predictable performance: FastTrack interconnect and dedicated carry/cascade chains support fast, predictable timing for arithmetic and high-fan-in logic functions.
  • Industrial robustness: Specified for −40 °C to 85 °C operation and supplied in a high-pin-count 208‑BFQFP surface-mount package suitable for industrial assemblies.
  • RoHS compliant: Meets RoHS environmental requirements for modern manufacturing and compliance needs.

Why Choose EPF81188AQI208-4?

The EPF81188AQI208-4 positions itself as a practical, mid-density programmable solution for designers needing a balance of logic capacity, I/O count and industrial temperature capability. Its FLEX 8000 family features—such as in-circuit reconfigurability, MultiVolt I/O, dedicated arithmetic chains and predictable routing—help reduce system complexity while enabling responsive, field-updatable designs.

This device is well suited for engineers and procurement teams building bus interfaces, high-speed controllers, coprocessors, or legacy TTL-integrated solutions that require a reliable, RoHS-compliant FPGA packaged in a 208‑BFQFP surface-mount form factor.

Request a quote or submit an RFQ to evaluate EPF81188AQI208-4 for your next design.

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