EPF81188AQC240-4

IC FPGA 184 I/O 240QFP
Part Description

FLEX 8000 Field Programmable Gate Array (FPGA) IC 184 1008 240-BFQFP

Quantity 460 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFPNumber of I/O184Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs126Number of Logic Elements/Cells1008
Number of Gates12000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/A

Overview of EPF81188AQC240-4 – FLEX 8000 Field Programmable Gate Array (FPGA) IC

The EPF81188AQC240-4 is a FLEX 8000 family FPGA offered by Intel, provided in a 240-pin BFQFP package. It combines a fine-grained logic architecture of 1,008 logic elements with a high I/O count to target mid-range programmable logic applications requiring substantial register resources and predictable interconnect.

Designed for commercial-temperature systems, this device supports 5.0 V core operation (4.75 V to 5.25 V supply range) and provides a balance of integration, I/O density, and low-power standby behavior for bus interfaces, data transformation, and control applications.

Key Features

  • Core architecture  FLEX family architecture with compact 4-input look-up tables and programmable registers for register-rich logic implementation.
  • Logic density  1,008 logic elements and approximately 12,000 usable gates, enabling mid-range integration for controllers and glue-logic functions.
  • Logic array resources  126 logic array blocks to structure logic and registers for predictable placement and routing.
  • I/O capability  184 user I/O pins for high pin-count system integration and multi-bus interfaces.
  • Power and voltage  Operates from 4.75 V to 5.25 V; family-level MultiVolt I/O enables device core to run at 5.0 V while supporting 5.0 V and 3.3 V logic levels on I/O pins.
  • Low-power standby  Family-level typical standby current specification of 0.5 mA or less.
  • System-level features  Supports in-circuit reconfigurability via external configuration devices or intelligent controllers; family includes PCI Local Bus Specification, Revision 2.2 compliance for 5.0 V operation (series-level).
  • Fast, predictable interconnect  Series FastTrack continuous routing structure and dedicated arithmetic/cascade chains to accelerate adders, counters, comparators, and high-fan-in logic (series-level).
  • Packaging  240-BFQFP package (supplier device package listed as 240-PQFP 32×32) in surface-mount form factor for high-pin-count board designs.
  • Commercial temperature grade  Rated for 0 °C to 70 °C operation and RoHS compliant.
  • On-chip memory  No on-chip RAM bits (Total Ram Bits: 0), for applications that depend on distributed registers and LUT-based logic rather than embedded block RAM.

Typical Applications

  • Digital signal processing (DSP)  Register-rich logic and dedicated arithmetic resources make the device suitable for datapath manipulation and signal conditioning tasks within mid-range DSP pipelines.
  • Bus interfaces and controllers  High I/O count and PCI-series compliance (for 5.0 V operation) support implementation of parallel bus bridges, interface controllers, and glue logic between TTL/legacy subsystems.
  • Coprocessor and acceleration logic  Use as custom coprocessor or accelerator functions where compact LUT-based logic and abundant registers reduce external component count.
  • TTL integration and system glue  MultiVolt I/O compatibility and 184 I/O pins facilitate integration with 5.0 V and 3.3 V TTL/CMOS devices for system-level interfacing.
  • High-pin-count multi-bus aggregation  240-pin package enables consolidation of multiple 32-bit buses or multiple parallel interfaces into a single device for board-level simplification.

Unique Advantages

  • Balanced mid-range density: 1,008 logic elements and ~12,000 gates provide a practical compromise between integration and cost for mid-complexity designs.
  • High I/O connectivity: 184 user I/O pins support dense external interfacing without expanding to larger, more costly packages.
  • 5 V supply compatibility: Operation across 4.75 V–5.25 V and family-level MultiVolt I/O support streamline integration into legacy 5.0 V systems while accommodating 3.3 V signaling at the I/O.
  • Surface-mount 240-pin package: 240-BFQFP/240-PQFP (32×32) packaging provides a compact, manufacturable footprint for high-pin-count designs.
  • Commercial-grade reliability: Rated for 0 °C–70 °C operation and RoHS compliant to meet standard commercial product requirements.
  • Low standby power: Family-level standby current of 0.5 mA or less helps reduce system idle power consumption.

Why Choose EPF81188AQC240-4?

The EPF81188AQC240-4 positions itself as a practical FLEX 8000 family FPGA for designers who need mid-range logic capacity, substantial I/O, and 5 V system compatibility. With 1,008 logic elements, 184 I/O pins, and a 240-pin surface-mount package, it is well suited to bus-centric designs, interface consolidation, and register-heavy logic implementations where embedded RAM is not required.

Backed by the FLEX 8000 family architecture and series-level features such as in-circuit reconfigurability, dedicated arithmetic chains, and predictable routing, this device offers a clear migration and development path for commercial applications that demand reliable, programmable logic integration.

Request a quote or submit an availability inquiry to start specifying EPF81188AQC240-4 for your next design.

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