EPF6024AQC240-3

IC FPGA 199 I/O 240QFP
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 199 1960 240-BFQFP

Quantity 834 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFPNumber of I/O199Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs196Number of Logic Elements/Cells1960
Number of Gates24000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of EPF6024AQC240-3 – FLEX 6000 Field Programmable Gate Array (FPGA) IC 199 I/Os 240-BFQFP

The EPF6024AQC240-3 is a FLEX 6000 family FPGA featuring the OptiFLEX LUT-based architecture and register-rich logic. It provides a reprogrammable, low-cost alternative to high-volume gate array designs and is targeted at prototyping, design testing, and low- to mid-volume programmable logic applications.

With 1,960 logic elements (approximately 24,000 typical gates), 199 I/O pins, and support for in-circuit reconfiguration and IEEE-1149.1 JTAG boundary-scan, this device balances moderate logic density, flexible I/O, and system-level configurability for embedded and control-oriented designs.

Key Features

  • Core Architecture — OptiFLEX register-rich, LUT-based architecture designed to improve device area efficiency and routing.
  • Logic Capacity — 1,960 logic elements delivering approximately 24,000 typical gates for implementing combinational and sequential logic.
  • I/O and Interface Capabilities — 199 I/O pins with per-pin tri-state output enable and programmable output slew-rate control for optimized signal integrity and interface flexibility.
  • Configuration & Test — In-circuit reconfigurability via external configuration device or intelligent controller; built-in IEEE Std. 1149.1 JTAG boundary-scan (BST) circuitry for board-level test and programming without consuming user logic.
  • Interconnect & Arithmetic Support — FastTrack continuous routing structure, dedicated carry and cascade chains to implement arithmetic and high-fan-in logic functions efficiently.
  • Power and Voltage — Supply voltage 3.0 V to 3.6 V; low-power standby behavior is supported by the FLEX 6000 family architecture.
  • Package & Mounting — Surface-mount device in a 240-pin BFQFP package (product lists Package Case: 240-BFQFP and Supplier Device Package: 240-PQFP (32×32)).
  • Commercial Temperature Rating — Rated for 0 °C to 85 °C operation suitable for commercial applications.
  • No Embedded SRAM — Total on-chip RAM bits: 0, for designs that rely on external memory or do not require embedded RAM.
  • Design Tool Support — FLEX 6000 family devices are supported by software design flows that provide automatic place-and-route and industry-standard design-entry formats.

Typical Applications

  • Prototype and Design Validation — Rapidly iterate hardware logic and verify system behavior during development thanks to the device’s reprogrammability and JTAG support.
  • Low- to Mid-Volume Gate Array Replacement — Implement custom logic without the cost and lead time of ASIC gate arrays while retaining the ability to change designs in the field.
  • Interface Bridging & Glue Logic — Use the device’s flexible I/O and programmable routing to bridge peripherals or implement board-level glue logic between subsystems operating at different voltages.
  • Control and Sequencing — Implement control state machines, counters, and arithmetic functions using dedicated carry and cascade chains for efficient resource use.

Unique Advantages

  • Reprogrammable Flexibility: In-circuit reconfiguration enables design updates and functional changes without hardware replacement.
  • Balanced Logic Density: 1,960 logic elements (~24,000 gates) provide substantial capability for complex glue logic and mid-size designs while maintaining manageable power and footprint.
  • Comprehensive I/O: 199 I/O pins with per-pin control and slew-rate programmability simplify signal interfacing and help control switching noise.
  • Built-in Testability: IEEE-1149.1 JTAG boundary-scan facilitates board-level testing and in-field diagnostics without consuming user logic resources.
  • Efficient Arithmetic Support: Dedicated carry and cascade chains accelerate adders, counters, and high-fan-in functions to improve performance for common logic patterns.
  • Commercial Readiness: Surface-mount 240-pin package and 0 °C to 85 °C rating suit a wide range of commercial embedded systems and production environments.

Why Choose EPF6024AQC240-3?

The EPF6024AQC240-3 is positioned for engineers and teams seeking a reprogrammable, mid-density FPGA solution with strong I/O capability and family-level architecture advantages such as OptiFLEX and dedicated arithmetic chains. Its combination of 1,960 logic elements, nearly 24,000 typical gates, and 199 I/Os makes it well suited to prototyping, design validation, and replacing low- to mid-volume gate array implementations.

With commercial temperature grading, support for in-circuit reconfiguration and JTAG boundary-scan, and a compact 240-pin surface-mount package, this device provides a practical balance of integration, configurability, and system-level testability for embedded product development and small-batch production.

Request a quote or submit your requirements to get pricing and availability for the EPF6024AQC240-3 and evaluate how it fits into your next programmable-logic design.

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