EPF6024AQC240-1N

IC FPGA 199 I/O 240QFP
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 199 1960 240-BFQFP

Quantity 1,509 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFPNumber of I/O199Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs196Number of Logic Elements/Cells1960
Number of Gates24000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of EPF6024AQC240-1N – FLEX 6000 FPGA, 199 I/O, 1,960 Logic Elements, 240‑pin PQFP

The EPF6024AQC240-1N is a FLEX 6000 family field-programmable gate array (FPGA) offered by Intel, based on the OptiFLEX register‑rich, LUT‑based architecture. It provides a reprogrammable, low-cost alternative to fixed gate-array designs and is targeted at applications requiring rapid prototyping, design iteration, or board‑level reconfigurability.

This device combines 1,960 logic elements (approximately 24,000 gates), up to 199 I/O pins, and dedicated on-chip routing and clock resources to support control, interface bridging, and custom logic implementations within commercial‑grade systems operating at 3.0 V to 3.6 V and 0 °C to 85 °C.

Key Features

  • OptiFLEX LUT‑based architecture Register‑rich, look‑up table architecture that enables flexible logic mapping and design changes during prototyping and testing.
  • Logic density 1,960 logic elements (typical equivalent ~24,000 gates) to implement medium‑complexity custom logic and glue‑logic functions.
  • I/O and voltage support Up to 199 I/O pins with MultiVolt I/O capability to bridge systems operating at different I/O voltages; device supply 3.0 V to 3.6 V.
  • Package and mounting Available in a 240‑pin fine‑pitch quad flat package (240‑BFQFP / 240‑PQFP 32×32) for surface‑mount PCB integration.
  • Clock and fast paths Built‑in low‑skew clock distribution plus fast register‑to‑I/O paths for predictable timing and reduced clock skew impact.
  • Dedicated arithmetic and cascade resources Dedicated carry and cascade chains support efficient implementation of adders, counters, comparators and high‑fan‑in logic.
  • In‑circuit reconfigurability and test Supports in‑circuit reconfiguration via external configuration devices or intelligent controllers and includes IEEE 1149.1 JTAG boundary‑scan circuitry.
  • No embedded RAM Total on‑chip RAM bits reported as 0 — suitable for designs that do not require embedded memory blocks.
  • Commercial temperature grade & RoHS compliant Rated for 0 °C to 85 °C operation and compliant with RoHS environmental requirements.

Typical Applications

  • Gate‑array replacement and prototyping — Rapidly replace high‑volume gate‑array designs during product development or use the device for iterative prototyping and design testing.
  • Interface bridging — MultiVolt I/O enables bridging between systems operating at different logic voltages, simplifying board‑level interface logic.
  • Control and glue logic — Implement custom control functions, peripheral interfacing and glue logic where moderate logic density and plentiful I/O are required.
  • In‑system reconfigurable designs — Use in‑circuit reconfiguration to update functionality in the field or to switch operating modes without physical device replacement.

Unique Advantages

  • Flexible, reprogrammable platform: LUT‑based OptiFLEX architecture lets designers modify logic quickly during prototyping and testing, reducing development cycle time.
  • Predictable timing and fast I/O paths: Low‑skew clock distribution and fast register‑to‑I/O paths help achieve reliable timing for control and interface signals.
  • Efficient arithmetic implementation: Dedicated carry and cascade chains simplify and accelerate adders, counters and other arithmetic or high‑fan‑in logic blocks.
  • Board‑level reconfigurability and test support: In‑circuit reconfiguration and IEEE 1149.1 JTAG boundary‑scan support streamline production test and field updates.
  • Commercial temperature and standard packaging: 240‑pin PQFP/BFQFP surface‑mount package and 0 °C to 85 °C rating match common commercial electronics manufacturing and deployment models.
  • RoHS compliant: Meets environmental compliance requirements for lead‑free assembly and distribution.

Why Choose EPF6024AQC240-1N?

The EPF6024AQC240-1N delivers a balanced mix of logic capacity (1,960 logic elements / ~24,000 gates), ample I/O (199 pins), and board‑friendly packaging for commercial applications that require reprogrammable logic and flexible interfacing. Its OptiFLEX LUT architecture, dedicated arithmetic chains and low‑skew clock resources provide practical building blocks for glue logic, control systems, and interface bridging without committing to a fixed ASIC.

Designed for teams needing iterative development, field reconfiguration, and robust testability, this FLEX 6000 device offers a practical platform for reducing BOM complexity while maintaining predictable timing and test support across commercial products.

Request a quote or submit an inquiry to receive pricing and availability for EPF6024AQC240-1N.

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