EPF6024AQC208-2N

IC FPGA 171 I/O 208QFP
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 171 1960 208-BFQFP

Quantity 905 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O171Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs196Number of Logic Elements/Cells1960
Number of Gates24000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of EPF6024AQC208-2N – FLEX 6000 FPGA, 1,960 logic elements, 171 I/O (208-BFQFP)

The EPF6024AQC208-2N is a FLEX 6000 family field-programmable gate array (FPGA) offered in a 208-pin BFQFP package. Built on the OptiFLEX register-rich, LUT-based architecture, it provides a reprogrammable, mid-density logic fabric suited to prototyping, low-cost gate-array replacement, and commercial embedded designs.

With 1,960 logic elements, roughly 24,000 typical gates, and 171 I/O pins, this surface-mount, commercial-grade device supports in-circuit reconfiguration and a range of system-level features for board-level integration and testability.

Key Features

  • Core architecture OptiFLEX register-rich, look-up table (LUT) based architecture designed for efficient area utilization and reprogrammable logic implementation.
  • Logic capacity 1,960 logic elements delivering approximately 24,000 typical gates for mid-density custom logic and glue-logic functions.
  • I/O and signaling 171 I/O pins with individual tri-state output enable control and programmable output slew-rate to manage switching noise and interface timing.
  • Configuration and test In-circuit reconfigurability via external configuration device or controller, plus built-in JTAG boundary-scan (IEEE Std. 1149.1) for board-level testing without consuming device logic.
  • Dedicated arithmetic and routing Dedicated carry and cascade chains and a FastTrack continuous routing structure provide efficient implementation of adders, counters, and high-fan-in logic.
  • Power and supply Operates from a 3.0 V to 3.6 V supply range suitable for 3.3 V system environments.
  • Package and mounting 208-pin BFQFP (208-PQFP footprint, 28×28) in a surface-mount package for standard PCB assembly.
  • Operating conditions and compliance Commercial-grade device rated for 0 °C to 85 °C and RoHS compliant.
  • Factory test and quality 100% functional testing prior to shipment, removing the need for vendor-supplied test vectors or scan chains.

Typical Applications

  • Prototyping and design validation Reprogrammable SRAM-based architecture and in-circuit reconfiguration enable rapid iteration during prototype and test cycles.
  • Gate-array replacement Mid-density logic capacity makes this device suitable as a low-cost, programmable alternative to fixed gate-array solutions.
  • Custom I/O bridging High I/O count and per-pin output control enable bridging and interfacing between different system voltages and peripherals.
  • Commercial embedded systems Use in consumer and commercial products requiring flexible logic implementation within a 3.3 V system environment.

Unique Advantages

  • Reprogrammable mid-density logic: 1,960 logic elements and ~24,000 typical gates provide the capacity needed for glue logic, protocol handling, and custom finite-state machines without over-specifying resources.
  • Robust I/O control: 171 I/O pins with individual tri-state enables and programmable slew rate simplify signal integrity and mixed-voltage interfacing on complex boards.
  • Built-in testability: IEEE 1149.1 JTAG boundary-scan support simplifies board-level testing and reduces additional test hardware.
  • Efficient arithmetic and routing: Dedicated carry and cascade chains plus FastTrack interconnect enable predictable timing for adders, counters, and wide combinatorial logic.
  • Production-ready quality: Devices are 100% functionally tested before shipment, supporting dependable integration into commercial products.
  • Standard package and assembly: 208-pin BFQFP surface-mount package fits common PCB assembly flows and standard PQFP footprints.

Why Choose EPF6024AQC208-2N?

The EPF6024AQC208-2N is positioned as a practical, reprogrammable solution for engineers needing a mid-density FPGA with substantial I/O and proven architecture. Its OptiFLEX design, dedicated arithmetic resources, and comprehensive I/O control make it well suited for prototyping, gate-array replacement, and commercial embedded designs operating around 3.3 V.

Supported by the FLEX 6000 family design infrastructure and factory-tested for quality, this device offers a balance of capacity, testability, and package compatibility for teams looking to shorten development cycles and simplify board-level integration.

Request a quote or submit a procurement inquiry to begin pricing and availability for EPF6024AQC208-2N.

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