EPF6024AQC208-2

The EPF6024AQC208-2 is a member of the FLEX 6000 programmable logic device family offering a register‑rich, LUT‑based FPGA architecture (OptiFLEX) that targets low‑cost replacements for high‑volume gate array designs. With 1,960 logic elements and approximately 24,000 typical gates, this device is suited for prototyping, design validation, and system functions that benefit from in‑circuit reconfigurability and flexible I/O.

Designed for surface‑mount deployment in a 208‑BFQFP package, the device supports a supply voltage range of 3.0 V to 3.6 V, 171 user I/O pins, and commercial temperature operation from 0 °C to 85 °C.

Key Features

• Core & architecture — OptiFLEX register‑rich, look‑up table (LUT) based architecture for area efficiency and reprogrammable SRAM‑based logic.
• Logic resources — 1,960 logic elements and approximately 24,000 typical gates provide medium‑density programmable logic for custom functions.
• I/O and interface flexibility — 171 I/O pins with MultiVolt I/O interface support, individual tri‑state output enable control, and programmable output slew‑rate to manage signal integrity.
• Clocking and routing — Built‑in low‑skew clock distribution and four low‑skew global paths, combined with FastTrack continuous routing for predictable interconnect delays.
• Dedicated arithmetic support — Dedicated carry and cascade chains for efficient implementation of adders, counters, and high‑fan‑in logic.
• System configuration & test — In‑circuit reconfigurability via external configuration device or controller and built‑in IEEE 1149.1 JTAG boundary‑scan for board‑level testability.
• Power & standby — Low standby current (typical specification less than 0.5 mA) and 3.0 V–3.6 V supply range suited to 3.3 V system environments.
• Package & mounting — Surface‑mount 208‑BFQFP (208‑PQFP 28×28 supplier package) for compact PCB implementations.
• Compliance & grade — Commercial grade device with RoHS compliance and operating temperature range of 0 °C to 85 °C.

Typical Applications

• Prototyping & design validation — Fast reprogrammability and OptiFLEX architecture enable rapid iteration during prototype and test cycles.
• Gate‑array replacement — A cost‑effective, programmable alternative to high‑volume gate array solutions for custom logic implementation.
• Field‑reconfigurable systems — In‑circuit reconfiguration supports field updates and design changes without board rework.
• Arithmetic and control logic — Dedicated carry and cascade chains accelerate implementation of adders, counters, and comparators in control and processing blocks.
• Mixed‑voltage system interfacing — MultiVolt I/O enables bridging between subsystems operating at different I/O voltages.

Unique Advantages

• Reconfigurable and adaptable: SRAM‑based logic and in‑circuit reconfigurability let you modify functionality during prototyping or after deployment.
• Efficient logic density: 1,960 logic elements and OptiFLEX architecture deliver significant gate capacity (≈24,000 typical gates) in a compact footprint.
• Flexible I/O integration: 171 I/O pins with programmable slew and individual tri‑state control simplify interfacing and signal conditioning on mixed‑voltage boards.
• Deterministic timing infrastructure: Low‑skew clock distribution, four global paths, and FastTrack interconnect reduce timing uncertainty for synchronous designs.
• Testability and system readiness: Built‑in IEEE 1149.1 JTAG boundary‑scan and 100% functional testing improve board‑level test coverage and production yield.
• Commercial‑grade, RoHS compliant: Surface‑mount 208‑BFQFP packaging with commercial temperature range and RoHS compliance for mainstream applications.

Why Choose EPF6024AQC208-2?

The EPF6024AQC208-2 positions itself as a pragmatic choice for engineers seeking medium‑density programmable logic with flexible I/O and in‑system reconfiguration. Its OptiFLEX architecture and dedicated arithmetic chains provide a balance of resource efficiency and performance for prototyping, board‑level custom logic, and systems that require field updates.

Backed by family‑level design support and tested manufacturing, this RoHS‑compliant, surface‑mount FPGA offers a compact package and predictable integration path for commercial applications operating within a 0 °C to 85 °C range and a 3.0 V to 3.6 V supply window.

If you would like pricing or availability for EPF6024AQC208-2, request a quote or submit a pricing inquiry for this FLEX 6000 FPGA to proceed with procurement or design planning.