EPF6024AFC256-3

The EPF6024AFC256-3 is a member of the FLEX 6000 programmable logic device family. It implements a register-rich, LUT-based architecture (OptiFLEX) designed for low-cost, reprogrammable logic in prototyping, design testing, and low- to medium-density logic integration.

This device provides 1,960 logic elements (typical 24,000 gates), 219 I/O pins in a 256-FBGA (17×17) package, and supports in-circuit reconfigurability and standard boundary-scan testability for flexible system integration and board-level test strategies.

Key Features

• Logic Capacity — 1,960 logic elements (typical 24,000 gates) suitable for mid-density programmable logic functions.
• I/O and Interface — 219 I/O pins with individual tri-state output enable control and programmable output slew-rate to help manage signal integrity and mixed-voltage interfacing.
• Reconfigurability — In-circuit reconfigurability via external configuration device or intelligent controller for fast design iteration and field updates.
• Clocking and Timing — Built-in low-skew clock distribution tree and four low-skew global paths for clock, clear, preset, or logic signals to support synchronous designs.
• Dedicated Arithmetic and Logic Chains — Dedicated carry and cascade chains for implementing fast adders, counters, comparators, and high-fan-in logic functions.
• Test and Debug — Built-in JTAG boundary-scan (IEEE Std. 1149.1-1990) for board-level testing without consuming device logic; note that the embedded JTAG circuitry can add up to 14,000 gates in addition to listed typical gates.
• Flexible Interconnect — FastTrack continuous routing structure for predictable interconnect delays and efficient place-and-route.
• Package and Mounting — 256-FBGA (17×17) surface-mount package for compact board designs; commercial-grade device with RoHS compliance.
• Power and Environmental — Supply voltage 3.0 V to 3.6 V and commercial operating temperature range 0 °C to 85 °C.

Typical Applications

• Prototyping and Design Validation — Rapid device reprogramming supports iterative hardware development and functional testing during product bring-up.
• In-Circuit Reconfigurable Systems — In-circuit reconfigurability enables field updates and functional changes via external configuration devices or controllers.
• Mixed-Voltage Interfaces — MultiVolt I/O interface operation allows bridging between systems operating at different I/O voltages while using a 3.0–3.6 V supply for the device core.
• Arithmetic and Control Logic — Dedicated carry and cascade chains make the device suitable for implementing adders, counters, comparators, and other control logic functions.

Unique Advantages

• Reprogrammable Flexibility: Supports in-circuit reconfiguration to shorten development cycles and enable field updates without board changes.
• Balanced Logic Density: 1,960 logic elements and ~24,000 typical gates provide mid-range capacity for consolidating glue logic and control functions.
• Strong I/O Control: 219 I/O pins with individual tri-state enables and slew-rate control help optimize signal integrity across multiple interfaces.
• Built-in Testability: IEEE 1149.1 boundary-scan support simplifies board-level test and diagnostics without consuming core logic resources.
• Compact, Surface-Mount Package: 256-FBGA (17×17) package offers a compact footprint for space-constrained designs while maintaining a high pin count.
• Vendor Toolchain Support: The FLEX 6000 family is supported by vendor development and place-and-route tools to streamline design implementation and verification.

Why Choose EPF6024AFC256-3?

The EPF6024AFC256-3 positions itself as a flexible, mid-density FPGA option within the FLEX 6000 family, combining a register-rich LUT architecture with dedicated arithmetic chains and comprehensive I/O control. Its 256-FBGA package and 219 I/O pins make it suitable for compact designs that require moderate logic integration and board-level testability.

This device is well suited to teams needing rapid prototyping, in-field reconfiguration, and reliable boundary-scan testing, delivered in a commercial-grade, RoHS-compliant package with a 3.0–3.6 V supply range and 0 °C to 85 °C operating temperature.

Request a quote or submit a request for pricing and availability to evaluate EPF6024AFC256-3 for your next design.