EPF6024AFC256-1

The EPF6024AFC256-1 is a member of the FLEX 6000 programmable logic device family. It uses a register-rich, LUT-based OptiFLEX architecture to provide mid-density, reprogrammable logic suitable for low-cost gate-array replacement, prototyping, and design testing in commercial electronic systems.

With 1,960 logic elements and up to 219 I/O pins in a 256‑FBGA (17×17) package, the device targets designs requiring flexible I/O, in-circuit reconfiguration, and efficient area utilization while operating from a 3.0 V to 3.6 V supply and a commercial temperature range (0 °C to 85 °C).

Key Features

• Core Architecture Register-rich, LUT-based OptiFLEX architecture that optimizes device area efficiency for mid-density designs.
• Logic Density Approximately 1,960 logic elements (typical equivalent ~24,000 gates) to implement combinational and sequential logic.
• I/O and Signal Control Up to 219 I/O pins with individual tri-state output enable control, programmable output slew-rate, and a fast register-to-pin path for improved clock‑to‑output timing.
• Flexible Interconnect FastTrack continuous routing, dedicated carry and cascade chains for fast arithmetic and high‑fan‑in logic, and tri-state emulation for internal bus implementations.
• System-Level Support In-circuit reconfigurability via external configuration device or intelligent controller and built-in JTAG boundary-scan test circuitry (IEEE 1149.1) available without consuming device logic.
• Package & Mounting Surface-mount 256‑FBGA (17×17) package offering compact footprint and SameFrame pin-compatibility across FLEX 6000 devices for easy scaling.
• Power & Temperature Supply voltage range 3.0 V to 3.6 V (3.3 V nominal) with commercial grade operating temperature from 0 °C to 85 °C.
• Embedded Memory No on-chip RAM bits; device focuses on logic density and I/O resources.
• Regulatory RoHS compliant.

Typical Applications

• Gate-array replacement and low-volume ASIC alternative — Use for designs that benefit from a reprogrammable substitute for gate-array implementations during product development or low-volume production.
• Prototyping and design validation — Fast iterations enabled by in-circuit reconfiguration and broad tool support for Windows and UNIX development environments.
• Custom I/O and interface bridging — High I/O count and MultiVolt I/O capability make the device suitable for bridging and adapting signals across different voltage domains in commercial systems.
• Control and glue logic — Implement custom peripheral controllers, glue logic, and timing-critical datapaths using dedicated carry and cascade chains.

Unique Advantages

• Mid-density logic with compact footprint: 1,960 logic elements in a 256‑FBGA package provide a balance of capability and board space efficiency.
• High I/O capacity: Up to 219 I/O pins support complex interfacing without external multiplexing or additional buffer logic.
• Runtime flexibility: In-circuit reconfigurability enables field updates and rapid design changes without board-level modifications.
• Efficient arithmetic and logic: Dedicated carry and cascade chains speed implementation of adders, counters, and high‑fan‑in logic functions.
• Test and integration ready: Built-in JTAG boundary-scan and 100% functional device testing simplify board-level bring-up and manufacturing test.
• Package and pin compatibility: SameFrame pin-compatibility across FLEX 6000 devices simplifies upgrades and density migration within the family.

Why Choose EPF6024AFC256-1?

The EPF6024AFC256-1 delivers a mid-range programmable logic solution optimized for commercial applications that require flexible I/O, in-system reconfiguration, and efficient use of board area. Its OptiFLEX architecture and dedicated interconnect features let designers implement arithmetic-heavy and high‑fan‑in logic with straightforward synthesis and place‑and‑route support.

Ideal for engineers replacing gate arrays, accelerating prototyping cycles, or consolidating glue logic and interface functions, this FLEX 6000 device provides a tested, RoHS‑compliant option with vendor-supported development tools and SameFrame compatibility to ease scaling across the family.

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