EPF6024ABC256-3

The EPF6024ABC256-3 is a FLEX 6000 family field programmable gate array (FPGA) supplied in a 256‑ball BGA package. It uses a register‑rich, LUT‑based OptiFLEX architecture and is targeted at commercial applications where a reprogrammable, low‑cost alternative to high‑volume gate arrays is required.

With 1,960 logic elements, up to 24,000 typical gates, and 218 I/O pins, this device is well suited for prototyping, design testing, and system designs that require flexible I/O and in‑circuit reconfiguration. The device operates from a 3.0 V to 3.6 V supply and is rated for commercial temperature operation (0 °C to 85 °C).

Key Features

• Logic Capacity — 1,960 logic elements and approximately 24,000 typical gates provide a mid‑density programmable fabric for glue logic, control, and moderate complexity functions.
• I/O Density — 218 user I/O pins support dense external interfacing from a single device package.
• OptiFLEX Architecture — Register‑rich, LUT‑based architecture designed for area efficiency and reconfigurability.
• In‑Circuit Reconfigurability (ICR) — Supports reprogramming via an external configuration device or intelligent controller to enable field updates and iterative development.
• Power and Supply — Operates from a 3.0 V to 3.6 V supply; 3.3 V devices in the family support hot‑socketing and include low standby current characteristics (typical standby below 0.5 mA as documented for the FLEX 6000 family).
• Interconnect and Arithmetic Support — Dedicated carry and cascade chains plus a continuous routing FastTrack interconnect structure for predictable delays and efficient arithmetic implementation.
• I/O Control — Individual tri‑state output enables and programmable output slew‑rate control for improved signal integrity and flexible drive behavior.
• Package & Mounting — 256‑BBGA (256‑BGA, 27×27) fine‑pitch ball‑grid array, surface‑mount package suitable for compact board layouts.
• Commercial Grade & Compliance — Commercial temperature grade (0 °C to 85 °C) and RoHS compliant.
• Design and Test Support — Family documentation describes built‑in JTAG boundary‑scan support and software tool support for design entry and place‑and‑route as provided for the FLEX 6000 device family.

Typical Applications

• Gate‑array replacement and prototyping — Use as a reprogrammable, low‑cost alternative to high‑volume gate array designs during prototyping and design verification.
• Embedded control and glue logic — Implement control functions, glue logic, and peripheral interfaces using the device’s logic elements and abundant I/O.
• Multi‑voltage system bridging — Leverage the family’s MultiVolt I/O support to interface subsystems operating at different voltages.
• Field‑updatable systems — Take advantage of in‑circuit reconfigurability for firmware updates, iterative feature additions, or post‑deployment fixes.

Unique Advantages

• Reprogrammable flexibility: OptiFLEX, LUT‑based architecture and in‑circuit reconfiguration let designers change functionality without respinning hardware.
• Balanced capacity and I/O: 1,960 logic elements and 218 I/O pins provide a balanced solution for mid‑density designs requiring significant external connectivity.
• Area‑efficient architecture: The OptiFLEX design reduces die area while maintaining routability, helping control BOM and board space.
• Predictable arithmetic performance: Dedicated carry and cascade chains simplify implementation of fast adders, counters, and comparators with automated tool support.
• Compact board integration: 256‑BBGA surface‑mount packaging enables dense PCB layouts and reliable solder connections for commercial products.
• Compliance and tooling: RoHS compliance, built‑in JTAG boundary‑scan, and documented toolchain support streamline development and test flows.

Why Choose EPF6024ABC256-3?

The EPF6024ABC256-3 offers a commercially graded, mid‑density FPGA option within the FLEX 6000 family that combines 1,960 logic elements, high I/O count, and OptiFLEX architecture for area‑efficient, reprogrammable designs. Its surface‑mount 256‑BBGA package and 3.0–3.6 V supply make it suitable for compact commercial applications that require flexible interfacing and field reconfiguration.

This device is a pragmatic choice for teams needing a reprogrammable alternative to gate arrays during prototyping and early production, providing design flexibility, test support, and documented architecture features that align with common embedded development flows.

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