EPF6016TI144-3N

IC FPGA 117 I/O 144TQFP
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 117 1320 144-LQFP

Quantity 908 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFPNumber of I/O117Voltage4.5 V - 5.5 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs132Number of Logic Elements/Cells1320
Number of Gates16000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of EPF6016TI144-3N – FLEX 6000 FPGA, 117 I/O, 144-LQFP

The EPF6016TI144-3N is a FLEX 6000 family field-programmable gate array (FPGA) device from Intel. It implements a register-rich, look-up table (LUT) based OptiFLEX architecture and targets designers seeking a programmable alternative to high-volume gate-array implementations and rapid prototyping or design testing.

With 1,320 logic elements, approximately 16,000 typical gates, 117 I/O pins in a 144-pin LQFP surface-mount package, and support for 4.5 V to 5.5 V supply operation, this device is positioned for industrial applications that require in-circuit reconfigurability, predictable interconnect, and extended temperature operation.

Key Features

  • Core architecture Register-rich, LUT-based OptiFLEX architecture that increases device area efficiency for compact, routable designs.
  • Capacity & I/O Approximately 16,000 typical gates and 1,320 logic elements with 117 available I/O pins in a 144-LQFP package to support moderate-density logic and peripheral interfacing.
  • Voltage & Temperature 4.5 V to 5.5 V supply range and industrial operating temperature from −40 °C to 100 °C for robust operation in industrial environments.
  • In-system configurability In-circuit reconfigurability (ICR) via an external configuration device or intelligent controller, enabling field updates and iterative development.
  • Built-in test & boundary-scan IEEE Std. 1149.1-compliant JTAG boundary-scan test circuitry is included without consuming additional device logic; devices are 100% functionally tested prior to shipment.
  • Clock and interconnect Built-in low-skew clock distribution tree, FastTrack continuous routing interconnect, and four low-skew global paths for predictable timing.
  • Arithmetic and high-fan-in support Dedicated carry and cascade chains for efficient implementation of adders, counters, comparators, and high-fan-in logic.
  • I/O control Individual tri-state output-enable control per pin and programmable output slew-rate control to manage switching noise and interface timing.
  • Power and standby Designed for low power consumption with typical standby current specified in the family data (standby specification referenced in the datasheet).
  • Package & mounting Surface-mount 144-LQFP package (supplier device package 144-TQFP, 20×20) for PCB-level integration and moderate pin count density.
  • Standards compliance Family datasheet notes 5.0-V devices are fully compliant with the PCI Local Bus Specification, Revision 2.2, where applicable.

Typical Applications

  • Prototyping and design validation Rapid iteration of logic designs and in-circuit reconfiguration enable fast prototyping and functional testing before volume implementation.
  • Gate-array replacement Serves as a programmable alternative to fixed gate-array solutions for moderate-complexity digital functions and design flexibility in production.
  • Industrial control Suitable for control and interface tasks in industrial equipment that require 5 V signaling, extended temperature range, and reliable boundary-scan testing.
  • Peripheral bridging and interfacing MultiVolt I/O interface operation and individual I/O control simplify bridging between systems operating at different I/O voltages and managing signal integrity.

Unique Advantages

  • Area-efficient architecture: OptiFLEX and LUT-based design reduce die area while preserving routability, helping lower BOM cost versus equivalent gate-array implementations.
  • Field update capability: In-circuit reconfigurability enables firmware-like updates to hardware logic using an external configuration device or controller.
  • Predictable timing: Low-skew clock tree, FastTrack interconnect, and dedicated global paths provide more predictable routing delays for timing-sensitive designs.
  • Integrated testability: IEEE 1149.1 JTAG boundary-scan and 100% functional testing improve production test coverage and board-level debug.
  • Flexible I/O control: Per-pin tri-state enable and programmable slew-rate control help optimize signal integrity and interface behavior for diverse peripherals.
  • Industrial-ready operating range: 4.5 V–5.5 V supply compatibility and −40 °C to 100 °C operating range support deployment in industrial environments.

Why Choose EPF6016TI144-3N?

The EPF6016TI144-3N provides a balanced combination of moderate logic capacity, extensive I/O, and system-level features that make it suitable for replacing gate-array components, accelerating prototyping cycles, and implementing flexible industrial control logic. Its OptiFLEX architecture, dedicated arithmetic and cascade chains, and predictable interconnect offer a practical platform for designs that require reprogrammability and reliable timing.

Backed by the FLEX 6000 family datasheet features and vendor development-system support referenced for the family, this device is aimed at engineering teams needing a field-updatable, testable FPGA solution in a 144-LQFP surface-mount package with 5 V supply compatibility and industrial temperature rating.

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