EPF6024ABC256-2

IC FPGA 218 I/O 256BGA
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 218 1960 256-BBGA

Quantity 962 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-BGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BBGANumber of I/O218Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs196Number of Logic Elements/Cells1960
Number of Gates24000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/A

Overview of EPF6024ABC256-2 – FLEX 6000 Field Programmable Gate Array (FPGA) IC 218 1960 256-BBGA

The EPF6024ABC256-2 is a FLEX 6000 programmable logic device offering a register-rich, LUT-based architecture with OptiFLEX area efficiency. It provides 1,960 logic elements and a typical gate count of 24,000, making it suitable for medium-complexity, reconfigurable logic functions in commercial systems.

Designed for prototyping, design validation, and commercial system integration, the device supports in-circuit reconfigurability and a mix of system-level features—enabling flexible I/O interfacing and reliable board-level implementation in a 256-BBGA surface-mount package.

Key Features

  • Core architecture  Register-rich, look-up table (LUT)-based OptiFLEX architecture that optimizes device area efficiency.
  • Logic resources  Approximately 1,960 logic elements and a typical gate-equivalent of 24,000 to implement medium-density logic functions.
  • I/O and interface flexibility  Up to 218 I/O pins with individual tri-state output enable control and programmable output slew-rate to manage switching noise and interface timing.
  • Configuration and test  Supports in-circuit reconfigurability via an external configuration device or controller and includes built-in JTAG boundary-scan (IEEE 1149.1-1990) circuitry; devices are 100% functionally tested prior to shipment.
  • Routing and arithmetic support  FastTrack interconnect structure with dedicated carry and cascade chains for efficient arithmetic and high-fan-in logic implementation.
  • Clocking and timing  Built-in low-skew clock distribution tree and four low-skew global paths to support synchronized system signals.
  • Package and mounting  256-ball BGA (256-BBGA, 27×27) surface-mount package for compact board placement and higher pin density.
  • Power and operating range  Supply voltage range of 3.0 V to 3.6 V with low standby current (typical less than 0.5 mA); commercial operating temperature range 0 °C to 85 °C.
  • Design tool support  Software design support and automatic place-and-route are provided by the FLEX 6000 development system referenced in the device family documentation.

Typical Applications

  • Prototyping and design validation  Reconfigurable logic enables rapid iteration and in-circuit reconfiguration during development and test phases.
  • Commercial system glue logic  Implements custom interface logic, protocol bridging, and glue functions in commercial electronics using its dense I/O and LUT-based resources.
  • Mixed-voltage interfacing  Flexible I/O controls and programmable slew-rate help when bridging subsystems with differing signaling requirements.
  • Arithmetic and control blocks  Dedicated carry and cascade chains accelerate adders, counters, and comparator functions in control and signal-processing paths.

Unique Advantages

  • Reconfigurable hardware  In-circuit reconfigurability lets you update logic without replacing hardware, reducing time-to-market for iterative designs.
  • Balanced integration  1,960 logic elements and 218 I/O pins combine to reduce external glue logic and simplify board-level designs.
  • Built-in testability  On-chip JTAG boundary-scan and 100% functional testing improve board-level debug and manufacturing yield confidence.
  • Efficient arithmetic support  Dedicated carry and cascade chains streamline implementation of fast adders, counters, and high-fan-in logic without consuming excess routing resources.
  • Compact, high-density package  256-BBGA package delivers high pin count in a compact footprint for space-constrained commercial applications.
  • Low standby power  Typical standby current under 0.5 mA helps minimize idle power in battery-assisted or low-power commercial applications.

Why Choose EPF6024ABC256-2?

The EPF6024ABC256-2 positions itself as a practical, reconfigurable solution for commercial designs that require medium-density logic, substantial I/O capacity, and board-level testability. Its OptiFLEX architecture, dedicated arithmetic chains, and comprehensive I/O controls provide a balanced platform for prototyping, interface logic, and system control functions.

Engineers seeking a programmable logic device with in-circuit reconfiguration, built-in JTAG testing, and supported development tools will find the EPF6024ABC256-2 suited to designs where flexibility, integration, and proven device-level testing are important.

Request a quote or submit an inquiry to begin pricing and availability for the EPF6024ABC256-2.

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