EPF6024ABI256-2
| Part Description |
FLEX 6000 Field Programmable Gate Array (FPGA) IC 218 1960 256-BBGA |
|---|---|
| Quantity | 197 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-BGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BBGA | Number of I/O | 218 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 196 | Number of Logic Elements/Cells | 1960 | ||
| Number of Gates | 24000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of EPF6024ABI256-2 – FLEX 6000 FPGA, 1,960 Logic Elements, 218 I/Os, 256-BBGA
The EPF6024ABI256-2 is a FLEX 6000 series field-programmable gate array (FPGA) offered in a 256-ball BGA package. It implements a register-rich, LUT-based OptiFLEX architecture intended for designers seeking a reprogrammable alternative to fixed gate-array implementations, with support for in-circuit reconfiguration and board-level interfacing.
This device is suited for prototyping, design testing, and industrial embedded applications that require flexible logic integration, a high I/O count, and wide operating temperature capability.
Key Features
- Core architecture OptiFLEX architecture with a register-rich, lookup-table (LUT) based fabric for efficient area utilization and predictable routing.
- Logic capacity Approximately 1,960 logic elements delivering roughly 24,000 typical equivalent gates for implementing custom glue logic, control state machines, and mid-density logic functions.
- I/O and interfacing Up to 218 user I/O pins enable broad external connectivity; MultiVolt I/O operation supports interfacing between systems at different voltage domains.
- Configuration and test Reconfigurable SRAM-based programming allows in-circuit reconfigurability (ICR); built-in IEEE Std. 1149.1 JTAG boundary-scan circuitry provides board-level test without consuming user logic.
- Clock and arithmetic support Built-in low-skew clock distribution tree and dedicated carry and cascade chains enable efficient implementation of adders, counters, and high-fan-in logic.
- Package and mounting Surface-mount 256-ball BGA (256-BBGA) in a 27×27 footprint for compact board placement and high pin density.
- Power and temperature Device supply range 3.0 V to 3.6 V with industrial-grade operating temperature from −40 °C to 100 °C.
- Manufacturing and compliance 100% functional testing at shipment and RoHS-compliant manufacturing.
Typical Applications
- Prototyping and design validation Reprogrammable FPGA fabric and in-circuit reconfiguration let development teams iterate designs quickly during prototyping and testing phases.
- Gate-array replacement / glue logic Mid-density logic capacity and abundant I/Os make this device suitable for replacing custom gate-array functions and consolidating discrete logic.
- Industrial control and automation Industrial temperature rating and flexible I/O support make it suitable for control logic, protocol bridging, and interface conditioning in automation equipment.
- Bus bridging and multi-voltage systems MultiVolt I/O operation allows the device to act as an interface between subsystems operating at different logic levels.
Unique Advantages
- Flexible reconfigurability: SRAM-based configuration enables in-field and in-circuit design changes without replacing hardware.
- High I/O density: 218 I/O pins in a 256-ball BGA package provide extensive board-level connectivity while minimizing PCB footprint.
- Series-proven architecture: OptiFLEX LUT-based architecture and dedicated routing resources support efficient logic packing and predictable timing.
- Built-in testability: Integrated IEEE 1149.1 JTAG boundary-scan reduces the need for additional test logic and simplifies board-level debugging.
- Industrial robustness: Rated for −40 °C to 100 °C operation, addressing thermal requirements common in industrial environments.
- Pin- and footprint-friendly packaging: 256-BBGA (27×27) delivers high pin count in a compact, surface-mount form factor for density-optimized designs.
Why Choose EPF6024ABI256-2?
The EPF6024ABI256-2 positions itself as a mid-density, reprogrammable logic device that balances logic capacity, high I/O count, and industrial temperature capability. It is appropriate for engineers who need a flexible, in-system programmable FPGA for prototyping, interface bridging, and consolidating discrete logic on compact, surface-mount PCBs.
With OptiFLEX architecture, dedicated arithmetic/cascade chains, and built-in JTAG, the device provides a practical platform for designs that require reconfigurability, board-level testability, and robust I/O integration over a wide temperature range.
Request a quote or submit an inquiry to learn about availability, pricing, and lead times for EPF6024ABI256-2. Our team can provide procurement and technical guidance to support your design cycle.

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