EPF6024ABI256-2

IC FPGA 218 I/O 256BGA
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 218 1960 256-BBGA

Quantity 197 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-BGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BBGANumber of I/O218Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs196Number of Logic Elements/Cells1960
Number of Gates24000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of EPF6024ABI256-2 – FLEX 6000 FPGA, 1,960 Logic Elements, 218 I/Os, 256-BBGA

The EPF6024ABI256-2 is a FLEX 6000 series field-programmable gate array (FPGA) offered in a 256-ball BGA package. It implements a register-rich, LUT-based OptiFLEX architecture intended for designers seeking a reprogrammable alternative to fixed gate-array implementations, with support for in-circuit reconfiguration and board-level interfacing.

This device is suited for prototyping, design testing, and industrial embedded applications that require flexible logic integration, a high I/O count, and wide operating temperature capability.

Key Features

  • Core architecture OptiFLEX architecture with a register-rich, lookup-table (LUT) based fabric for efficient area utilization and predictable routing.
  • Logic capacity Approximately 1,960 logic elements delivering roughly 24,000 typical equivalent gates for implementing custom glue logic, control state machines, and mid-density logic functions.
  • I/O and interfacing Up to 218 user I/O pins enable broad external connectivity; MultiVolt I/O operation supports interfacing between systems at different voltage domains.
  • Configuration and test Reconfigurable SRAM-based programming allows in-circuit reconfigurability (ICR); built-in IEEE Std. 1149.1 JTAG boundary-scan circuitry provides board-level test without consuming user logic.
  • Clock and arithmetic support Built-in low-skew clock distribution tree and dedicated carry and cascade chains enable efficient implementation of adders, counters, and high-fan-in logic.
  • Package and mounting Surface-mount 256-ball BGA (256-BBGA) in a 27×27 footprint for compact board placement and high pin density.
  • Power and temperature Device supply range 3.0 V to 3.6 V with industrial-grade operating temperature from −40 °C to 100 °C.
  • Manufacturing and compliance 100% functional testing at shipment and RoHS-compliant manufacturing.

Typical Applications

  • Prototyping and design validation Reprogrammable FPGA fabric and in-circuit reconfiguration let development teams iterate designs quickly during prototyping and testing phases.
  • Gate-array replacement / glue logic Mid-density logic capacity and abundant I/Os make this device suitable for replacing custom gate-array functions and consolidating discrete logic.
  • Industrial control and automation Industrial temperature rating and flexible I/O support make it suitable for control logic, protocol bridging, and interface conditioning in automation equipment.
  • Bus bridging and multi-voltage systems MultiVolt I/O operation allows the device to act as an interface between subsystems operating at different logic levels.

Unique Advantages

  • Flexible reconfigurability: SRAM-based configuration enables in-field and in-circuit design changes without replacing hardware.
  • High I/O density: 218 I/O pins in a 256-ball BGA package provide extensive board-level connectivity while minimizing PCB footprint.
  • Series-proven architecture: OptiFLEX LUT-based architecture and dedicated routing resources support efficient logic packing and predictable timing.
  • Built-in testability: Integrated IEEE 1149.1 JTAG boundary-scan reduces the need for additional test logic and simplifies board-level debugging.
  • Industrial robustness: Rated for −40 °C to 100 °C operation, addressing thermal requirements common in industrial environments.
  • Pin- and footprint-friendly packaging: 256-BBGA (27×27) delivers high pin count in a compact, surface-mount form factor for density-optimized designs.

Why Choose EPF6024ABI256-2?

The EPF6024ABI256-2 positions itself as a mid-density, reprogrammable logic device that balances logic capacity, high I/O count, and industrial temperature capability. It is appropriate for engineers who need a flexible, in-system programmable FPGA for prototyping, interface bridging, and consolidating discrete logic on compact, surface-mount PCBs.

With OptiFLEX architecture, dedicated arithmetic/cascade chains, and built-in JTAG, the device provides a practical platform for designs that require reconfigurability, board-level testability, and robust I/O integration over a wide temperature range.

Request a quote or submit an inquiry to learn about availability, pricing, and lead times for EPF6024ABI256-2. Our team can provide procurement and technical guidance to support your design cycle.

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