EPF6024ABC256-2N

The EPF6024ABC256-2N is a FLEX 6000 family FPGA from Intel designed as a low-cost, reprogrammable alternative to fixed gate-array implementations. Built on a register-rich, look-up table (LUT) OptiFLEX architecture with reconfigurable SRAM elements, this device targets prototyping, design testing, and low-volume production where fast design changes and in-circuit updates are required.

Key on-board resources include approximately 1,960 logic elements and support for up to 24,000 typical gates, with 218 I/O pins in a 256-ball BGA package. The device operates from a 3.0 V to 3.6 V supply and meets commercial temperature requirements (0 °C to 85 °C).

Key Features

• Core Architecture  Register-rich, LUT-based OptiFLEX architecture providing approximately 1,960 logic elements and a typical gate-equivalent of 24,000 for flexible combinational and sequential logic implementation.
• I/O and Interface  Up to 218 I/O pins supported; MultiVolt I/O operation available at the family level to bridge systems operating at differing voltages and provide flexible interfacing options.
• System-Level Reconfigurability  Supports in-circuit reconfiguration via an external configuration device or intelligent controller, enabling field updates and design iteration without socket removal.
• On-Chip Routing and Arithmetic Support  FastTrack interconnect structure with dedicated carry and cascade chains for efficient arithmetic functions (adders, counters, comparators) and high-fan-in logic.
• Built-in Test and Clocking  IEEE 1149.1 JTAG boundary-scan test circuitry is available without consuming user logic; low-skew global clock distribution and four global paths for clock/clear/preset or logic signals.
• Package and Mounting  256-ball BGA (256-BBGA / 256-BGA 27×27) surface-mount package offering a compact footprint and SameFrame pin-compatibility across FLEX 6000 devices in similar packages.
• Supply and Temperature  Supply voltage range of 3.0 V to 3.6 V and commercial-grade operating temperature from 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• Gate-array replacement: Use the EPF6024ABC256-2N as a cost-effective, reprogrammable substitute for low- to mid-volume gate-array designs where rapid changes are anticipated.
• Prototyping and design testing: Ideal for iterative hardware development and validation thanks to reprogrammable SRAM elements and in-circuit reconfiguration capability.
• Mixed-voltage interface logic: Implement bridging and protocol translation between subsystems operating at different I/O voltages using the device’s MultiVolt I/O features.
• High-speed arithmetic and control: Leverage dedicated carry and cascade chains for fast adders, counters, and comparator implementations in embedded control logic.

Unique Advantages

• Reprogrammable flexibility: In-circuit reconfiguration enables updates and functional changes without board rework, accelerating development cycles and field maintenance.
• Compact logic density: Approximately 1,960 logic elements and 24,000 typical gates provide significant implementation capability in a single 256-BGA package.
• Extensive I/O count: 218 available I/O pins support complex interfacing needs while maintaining a compact BGA footprint.
• Built-in testability: IEEE 1149.1 JTAG boundary-scan circuitry supports board-level test without consuming user logic resources.
• Dedicated arithmetic chains: Hardware carry and cascade chains simplify and accelerate implementation of arithmetic and high-fan-in logic functions.
• Tool and IP ecosystem: Family-level design support includes common HDL and netlist flows and compatibility with standard EDA tools for efficient design entry and synthesis.

Why Choose EPF6024ABC256-2N?

The EPF6024ABC256-2N is positioned for designers needing a commercially graded, reprogrammable logic device that balances density, I/O richness, and system-level configurability. Its OptiFLEX architecture, dedicated arithmetic chains, and in-circuit reconfiguration make it well suited to prototyping, gate-array replacement, and mixed-voltage interface logic.

With a compact 256-BGA package, support for 3.0–3.6 V supply operation, and RoHS compliance, this device offers a practical option for commercial embedded designs that require frequent design iteration and flexible integration into existing PCB footprints.

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