EPF6016TI144-3

The EPF6016TI144-3 is a FLEX 6000 family programmable logic device from Intel designed as a low-cost, reprogrammable alternative to high-volume gate array designs. It uses a register-rich, look-up table (LUT) based OptiFLEX architecture with reconfigurable SRAM elements to enable rapid design iteration and in-circuit updates.

Targeted for prototyping, design testing and industrial systems, the device combines a compact logic fabric with 117 I/O pins, in-system reconfigurability and industrial-grade operating conditions for robust board- and system-level integration.

Key Features

• Core architecture – Register-rich, LUT-based OptiFLEX architecture for area-efficient programmable logic.
• Logic capacity – Approximately 1,320 logic elements providing a typical equivalent of 16,000 gates for moderate-complexity functions.
• I/O and mixed-voltage support – 117 user I/O pins with MultiVolt I/O interface operation to enable bridging between systems running at different voltages.
• Configuration and test – In-circuit reconfigurability via external configuration device and IEEE 1149.1 (JTAG) boundary-scan circuitry available without consuming device logic; devices are 100% functionally tested prior to shipment.
• Dedicated arithmetic and high-fan-in resources – Dedicated carry and cascade chains for efficient implementation of adders, counters, comparators and high-fan-in logic.
• Clocking – Built-in low-skew clock distribution tree with four low-skew global paths for clock, clear, preset or logic signals.
• Power and supply – Operates from 4.5 V to 5.5 V; low standby current (typical specification less than 0.5 mA).
• Package and thermal – 144-pin LQFP package (supplier device package listed as 144-TQFP, 20×20 mm) with an operating temperature range of −40 °C to 100 °C.
• Standards and compliance – 5.0-V device compatibility with the PCI Local Bus Specification, Revision 2.2; RoHS compliant.

Typical Applications

• Prototyping and design validation – Reconfigurable SRAM-based fabric and in-circuit reconfiguration speed board bring-up and iterative development cycles.
• Gate array replacement – Acts as a programmable alternative to fixed gate arrays for lower-volume or evolving designs.
• PCI-based systems – 5.0-V device compatibility with PCI Local Bus Specification, Revision 2.2 makes the device suitable for PCI interface implementations.
• Mixed-voltage interface and bridging – MultiVolt I/O supports interfacing between different logic voltages in heterogeneous systems.
• Industrial control and embedded systems – Industrial-grade qualification and wide operating temperature range support deployment in factory and instrumentation environments.

Unique Advantages

• In-system reconfigurability: Reprogrammable SRAM elements and in-circuit configuration support enable functional changes without board remanufacture.
• Balanced logic and I/O integration: 1,320 logic elements paired with 117 I/O pins fit applications that require moderate logic density and significant external interfacing.
• Built-in testability: IEEE 1149.1 JTAG boundary-scan support and 100% functional device testing simplify board-level validation and manufacturing test.
• Efficient arithmetic and logic primitives: Dedicated carry and cascade chains reduce routing overhead and improve implementation efficiency for adders, counters and high-fan-in logic.
• Industrial-ready packaging and thermal range: 144-pin LQFP package and −40 °C to 100 °C rating suit demanding environmental requirements.
• Family-level compatibility: FLEX 6000 family pin-compatibility and OptiFLEX architecture help simplify upgrades across device densities and pin counts.

Why Choose EPF6016TI144-3?

The EPF6016TI144-3 provides a pragmatic balance of programmable logic capacity, I/O count and industrial operating range for engineers replacing gate-array designs or accelerating prototype-to-product cycles. Its OptiFLEX LUT-based architecture, dedicated arithmetic resources and in-system reconfiguration capabilities make it suitable for designs that need moderate logic integration with significant external interfacing.

Backed by Intel’s FLEX 6000 family feature set—on-package options, standard compliance for PCI systems and factory-level functional testing—this device delivers a durable, upgradable platform for OEMs and development teams seeking predictable integration and field reprogrammability.

Request a quote or submit an RFQ to receive pricing and availability information for the EPF6016TI144-3.