EPF6016TC144-3

IC FPGA 117 I/O 144TQFP
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 117 1320 144-LQFP

Quantity 1,159 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O117Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs132Number of Logic Elements/Cells1320
Number of Gates16000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of EPF6016TC144-3 – FLEX 6000 FPGA, 1,320 logic elements, 117 I/O, 144-LQFP

The EPF6016TC144-3 is a FLEX 6000 family Field Programmable Gate Array (FPGA) from Intel, featuring a register-rich, look-up table (LUT) based OptiFLEX architecture. It provides a programmable, low-cost alternative to high-volume gate array designs and is suited to prototyping, design testing, and commercial embedded logic applications.

With approximately 16,000 typical gates, 1,320 logic elements, and 117 I/O pins in a 144-pin surface-mount package, this device targets compact, reconfigurable logic implementations that require flexible I/O and standard 5 V supply compatibility.

Key Features

  • OptiFLEX architecture  Register-rich, LUT-based architecture for efficient logic packing and routability within the FLEX 6000 family.
  • Logic density  Approximately 16,000 typical gates and 1,320 logic elements for moderate-complexity custom logic and control functions.
  • I/O capability  117 I/O pins with individual tri-state output enable control and programmable output slew-rate control to help manage signal integrity and interfacing.
  • Clock and interconnect  Built-in low-skew clock distribution tree and family-level FastTrack interconnect structure for predictable routing delays and timing.
  • Configuration and test  Supports in-circuit reconfigurability (ICR) via external configuration device or controller and includes built-in JTAG boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1-1990.
  • Supply and compliance  5.0 V device operation with a supply range of 4.75 V to 5.25 V; family documentation notes compatibility with PCI Local Bus Specification, Revision 2.2 for 5.0 V devices.
  • Package and mounting  Surface-mount, 144-pin LQFP package (supplier device package: 144-TQFP, 20×20), enabling compact PCB layouts.
  • Commercial grade and temperature  Commercial grade device rated for 0 °C to 85 °C operating temperature and RoHS compliant.
  • Low-power standby  Family-level specification indicates very low standby current (typical specification under 0.5 mA in standby mode).

Typical Applications

  • Prototyping and design validation  Replace or emulate gate-array functionality during development and accelerate design iterations with reconfigurable logic.
  • Custom control and glue logic  Implement medium-complexity control, state machines, and glue logic between subsystems while consolidating discrete components.
  • Mixed-voltage system interfacing  Use the device’s flexible I/O and 5 V operation to bridge between components and subsystems that require different signal levels.
  • PCI-based system integration  Leverage the family’s 5.0 V compatibility for designs that interface to PCI Local Bus environments.

Unique Advantages

  • Flexible programmability: Reprogrammable FPGA architecture enables rapid design changes during prototyping and field updates via in-circuit reconfiguration.
  • Balanced density and I/O: Approximately 16,000 gates with 1,320 logic elements and 117 I/O provide a good balance of logic capacity and external connectivity for compact designs.
  • Built-in testability: Integrated JTAG boundary-scan simplifies board-level testing and fault isolation without consuming additional user logic.
  • Predictable timing: Low-skew clock distribution and dedicated interconnect structures help achieve consistent timing for synchronous designs.
  • Compact surface-mount package: 144-LQFP (supplier 144-TQFP, 20×20) enables small PCB footprints while retaining ample I/O.
  • Commercial readiness: RoHS compliant and specified for 0 °C to 85 °C operation for mainstream commercial applications.

Why Choose EPF6016TC144-3?

The EPF6016TC144-3 combines FLEX 6000 family architecture with a practical mix of logic density, I/O count, and 5 V supply compatibility. It is well suited for engineers who need a reprogrammable solution to replace gate-array implementations, consolidate glue logic, or rapidly iterate on system designs during prototyping and low- to mid-volume production.

Backed by FLEX 6000 family design support and built-in test/configuration capabilities, this commercial-grade device offers a reliable platform for compact embedded logic designs where flexibility, predictable timing, and standard-voltage interfacing are priorities.

Request a quote or submit a quote for EPF6016TC144-3 to evaluate its fit for your next programmable-logic project.

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