EPF6016QI208-3N

IC FPGA 171 I/O 208QFP
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 171 1320 208-BFQFP

Quantity 438 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case208-BFQFPNumber of I/O171Voltage4.5 V - 5.5 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs132Number of Logic Elements/Cells1320
Number of Gates16000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of EPF6016QI208-3N – FLEX 6000 FPGA, 1,320 logic elements, 171 I/O, 208‑BFQFP

The EPF6016QI208-3N is an Altera FLEX 6000 family field programmable gate array (FPGA) offered in a 208‑BFQFP surface‑mount package. It delivers a medium‑density, register‑rich LUT architecture with OptiFLEX area‑efficiency and a built‑in low‑skew clock distribution tree suitable for prototyping, design testing, and cost‑sensitive gate‑array replacement projects.

Designed for industrial environments, this device combines 1,320 logic elements and approximately 16,000 typical gates with 171 I/O pins and a 4.5 V to 5.5 V supply range, enabling mixed‑voltage interface strategies and system‑level integration where board space and predictable timing are important.

Key Features

  • Core Architecture (OptiFLEX)  Register‑rich, LUT‑based OptiFLEX architecture that improves area efficiency for medium‑density logic implementations.
  • Logic Capacity  Provides 1,320 logic elements and a typical gate count of 16,000, enabling a broad set of combinational and sequential functions on a single device.
  • I/O and Voltage  171 I/O pins with MultiVolt I/O interface operation and a supply voltage range of 4.5 V to 5.5 V to support mixed‑voltage system integration and 5.0‑V PCI‑compliant operation where applicable.
  • Package and Mounting  208‑BFQFP (supplier package: 208‑PQFP, 28×28) in a surface‑mount form factor for board designs requiring a PQFP footprint.
  • Industrial Temperature Range  Specified for operation from −40 °C to 100 °C, suitable for industrial applications and extended temperature deployments.
  • System‑level Features  In‑circuit reconfigurability via external configuration device or controller, and built‑in JTAG boundary‑scan (IEEE 1149.1) for board‑level test and debug without consuming device logic.
  • Interconnect and Arithmetic Support  FastTrack interconnect structure with dedicated carry and cascade chains for efficient implementation of adders, counters, comparators, and high‑fan‑in logic.
  • Power and Clocking  Built‑in low‑skew clock distribution and programmable output slew‑rate control to manage switching noise and timing across the design.
  • Compliance and Environmental  RoHS compliant and 100% functionally tested prior to shipment.

Typical Applications

  • Prototyping and Design Validation: Use for rapid prototype iterations and functional testing where in‑circuit reconfiguration and fast design changes accelerate development cycles.
  • Gate‑Array Replacement: Cost‑sensitive designs that require a programmable alternative to medium‑volume gate arrays benefit from the FLEX 6000 architecture and area efficiency.
  • Industrial Control Systems: Industrial applications that require operation across −40 °C to 100 °C and robust I/O pin count for sensor and actuator interfacing.
  • Mixed‑Voltage System Bridging: MultiVolt I/O capabilities enable bridging between subsystems operating at different logic voltages on a single programmable device.
  • Board Test and Production Debug: Built‑in JTAG boundary‑scan simplifies manufacturing test, board bring‑up, and in‑system diagnostics.

Unique Advantages

  • Medium‑density integration: 1,320 logic elements and roughly 16,000 typical gates place common digital functions and glue logic on a single FPGA, reducing BOM and board complexity.
  • Flexible I/O count and packaging: 171 I/O pins in a 208‑BFQFP footprint deliver a blend of pin availability and compact package for space‑constrained designs.
  • Industrial suitability: Specified −40 °C to 100 °C operation and surface‑mount packaging tailored for industrial applications where environmental range matters.
  • System‑level integration: In‑circuit reconfiguration and MultiVolt I/O support enable field updates and voltage interfacing without major hardware changes.
  • Built‑in testability: IEEE‑1149.1 JTAG boundary‑scan and 100% functional testing streamline board test development and production validation.
  • Predictable timing and arithmetic support: Low‑skew clocks, FastTrack interconnect, and dedicated carry/cascade chains simplify implementation of timing‑sensitive and arithmetic logic.

Why Choose EPF6016QI208-3N?

The EPF6016QI208-3N offers a balanced, industrial‑grade FPGA solution for designers seeking medium‑density programmable logic with flexible I/O and reliable system‑level features. With 1,320 logic elements, 171 I/O pins, OptiFLEX area efficiency, and industry‑rated temperature specifications, this device supports prototyping, gate‑array replacement, and embedded control designs that demand in‑system reconfigurability and board‑level testability.

Choosing this FLEX 6000 device provides a predictable platform for development and deployment where integration, manufacturability, and long‑term support from the FLEX 6000 family are priorities.

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