EPF6016QI208-3

The EPF6016QI208-3 is a field programmable gate array (FPGA) in the FLEX 6000 family, designed for low-cost, reprogrammable logic implementations. It uses a register-rich, look-up table (LUT)-based architecture to deliver 1,320 logic elements and approximately 16,000 typical gates for flexible combinational and sequential logic.

Targeted at industrial applications and general-purpose embedded designs, this surface-mount device supports in-circuit reconfigurability and a broad operating range, offering a compact package option (208-BFQFP) with 171 I/O pins for dense peripheral interfacing.

Key Features

• Core Architecture – Register-rich, LUT-based OptiFLEX architecture that supports 1,320 logic elements and approximately 16,000 typical gates for configurable logic functions.
• I/O Capacity & Control – 171 I/O pins with individual tri-state output-enable control and programmable output slew-rate to manage signal integrity and drive requirements.
• Reconfiguration & Test – In-circuit reconfigurability (ICR) and built-in JTAG boundary-scan test (IEEE Std. 1149.1) for field updates and board-level test without consuming user logic.
• Interconnect & Arithmetic Support – Dedicated carry and cascade chains plus a continuous routing interconnect structure for efficient implementation of adders, counters, and high-fan-in logic.
• Power & Supply – Designed for 4.5 V to 5.5 V supply operation, suitable for 5.0 V system environments.
• Package & Mounting – Surface-mount 208-BFQFP package (supplier device package: 208-PQFP 28×28) for compact PCB layouts.
• Environmental & Grade – Industrial grade with an operating temperature range of −40 °C to 100 °C and RoHS compliance.
• On-chip Memory – Total on-chip RAM bits reported as 0 for this device variant.

Typical Applications

• Prototyping and Gate-Array Replacement – Replace or emulate gate-array designs during development and testing where reprogrammability and fast design changes are required.
• Industrial Control & Automation – Implement control logic, state machines, and I/O conditioning in industrial environments that require wide temperature operation and an industrial-grade package.
• Interface Bridging and Glue Logic – Use the device’s 171 I/O pins and programmable I/O characteristics to bridge peripherals, adapt signal levels, and centralize board-level glue logic.
• Test & Measurement Systems – Leverage JTAG boundary-scan and in-circuit reconfiguration for board diagnostics, iterative firmware updates, and laboratory instrumentation control.

Unique Advantages

• Reprogrammable Flexibility: Reconfigurable FPGA logic enables iterative design changes and field updates without hardware replacement.
• High I/O Density: 171 programmable I/O pins provide ample connectivity for multi-peripheral designs, reducing the need for external multiplexers or I/O expanders.
• Industrial Reliability: Rated for −40 °C to 100 °C and provided in a surface-mount PQFP package suited to industrial PCB assemblies.
• Efficient Arithmetic Support: Built-in carry and cascade chains simplify implementation of fast adders, counters, and comparators in logic-intensive functions.
• Test and Field-Service Friendly: Integrated JTAG boundary-scan and in-circuit reconfiguration streamline manufacturing test and field maintenance workflows.

Why Choose EPF6016QI208-3?

The EPF6016QI208-3 delivers a compact, industrial-grade FPGA solution with 1,320 logic elements and approximately 16,000 typical gates, making it well suited for designers who need reprogrammable logic, high I/O count, and robust operating-range characteristics. Its OptiFLEX-based architecture and dedicated logic chains simplify implementation of arithmetic and control functions while supporting in-circuit updates and board-level testability.

This device is appropriate for engineering teams and procurement seeking a reliable FLEX 6000 family FPGA for prototyping, industrial control, interface bridging, and test equipment where 5.0 V system compatibility, surface-mount packaging, and RoHS compliance are required.

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