EPF6016TI144-2N

The EPF6016TI144-2N is a FLEX 6000 family field-programmable gate array (FPGA) offered for industrial applications. It implements a register-rich, LUT-based OptiFLEX architecture designed to provide a low-cost, reprogrammable alternative to fixed gate-array solutions and fast iteration during prototyping and design testing.

With 1,320 logic elements (roughly 16,000 typical gates), 117 I/O pins and a 144‑pin LQFP package, this 5‑volt-class device targets designs that require moderate logic density, configurable I/O control, and in-circuit reconfigurability across an extended operating temperature range.

Key Features

• Core architecture OptiFLEX, LUT-based architecture with a register-rich fabric for flexible combinational and sequential logic implementation.
• Logic capacity Approximately 1,320 logic elements and a typical gate-equivalent count of 16,000, enabling medium-density programmable logic designs.
• I/O and pin control 117 I/O pins with individual tri-state output enable and programmable output slew-rate control to manage switching noise and interface timing.
• Configuration & test Supports in-circuit reconfigurability (ICR) via external configuration devices or an intelligent controller, and includes IEEE 1149.1 JTAG boundary-scan circuitry for board-level test without consuming user logic.
• Interconnect & arithmetic support FastTrack continuous routing structure plus dedicated carry and cascade chains for high-speed arithmetic, counters and high-fan-in logic functions.
• Clock distribution Built-in low-skew clock distribution tree and four global low-skew paths suitable for clock, clear, preset or other critical signals.
• Package & mounting 144‑pin LQFP package; supplier device package listed as 144‑TQFP (20×20). Surface-mount mounting type for compact PCB integration.
• Power & temperature Voltage supply range 4.5 V to 5.5 V and industrial operating temperature range of −40 °C to 100 °C.
• Standards & compliance RoHS compliant. As a 5.0‑V family device, FLEX 6000 devices are documented for PCI Local Bus compatibility within the family datasheet.

Typical Applications

• Prototyping and design testing Reprogrammable logic fabric and in-circuit reconfiguration make this device well suited for iterative hardware development and validation.
• Low- to mid-density system logic Implement glue logic, control-state machines, protocol translation, and moderate arithmetic functions using the device’s logic elements and dedicated carry/cascade chains.
• Peripheral and bus interfacing 117 I/Os with programmable slew and per-pin tri-state control support interfacing to 5‑V peripherals and legacy buses in mixed-voltage systems.
• Industrial control and instrumentation Industrial-grade temperature range and surface-mount packaging make it suitable for embedded control, sensor aggregation, and user-interface logic in industrial equipment.

Unique Advantages

• Reprogrammable flexibility: In-circuit reconfiguration allows function updates in-system, shortening development cycles and enabling field updates.
• Balanced logic density: 1,320 logic elements (~16,000 gates) provide a practical middle ground for designs that need more capability than small PLDs but do not require high-density FPGAs.
• Robust I/O control: Per-pin tri-state enable and slew-rate programmability simplify signal integrity and interfacing across a range of external devices.
• Industrial readiness: Rated for −40 °C to 100 °C operation and surface-mount packaging for reliable use in industrial environments.
• Testability and integration: Integrated IEEE 1149.1 JTAG boundary-scan support eases board-level testing and reduces additional test logic requirements.
• Proven family features: OptiFLEX architecture, FastTrack interconnect, and dedicated arithmetic chains provide predictable routing and efficient use of device area.

Why Choose EPF6016TI144-2N?

The EPF6016TI144-2N brings FLEX 6000 family capabilities—OptiFLEX architecture, medium logic capacity, comprehensive I/O control and in-circuit reconfigurability—to industrial embedded designs that require a 5‑V-class FPGA in a compact 144‑pin package. Its combination of logic elements, I/O count, and family-level features makes it suitable for projects that need adaptable logic, reliable board-level testability and extended temperature operation.

This device is a strong option for engineering teams and procurement seeking a field-programmable solution that balances integration, configurability and industrial-grade operating range while maintaining compatibility with established development and test workflows.

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