EPF6024ABC256-1

The EPF6024ABC256-1 is a member of the FLEX 6000 programmable logic family, a register-rich, LUT-based FPGA architecture designed as a low-cost, reprogrammable alternative to high-volume gate-array designs. This device combines OptiFLEX area-efficient architecture, in-circuit reconfigurability, and a high I/O count to support prototyping, design testing, and mid-density logic integration.

With approximately 24,000 typical gates realized as 1,960 logic elements and up to 218 I/O pins in a compact 256-ball BGA (27×27) package, this commercial-grade device targets applications that require flexible logic, multiple voltage domain interfacing, and standard commercial temperature operation.

Key Features

• Core Architecture  Register-rich, LUT-based OptiFLEX architecture designed to maximize device area efficiency and support reprogrammable logic functions.
• Logic Capacity  Approximately 24,000 typical gates implemented as 1,960 logic elements, providing mid-range programmable logic resources for glue logic, control functions, and prototype systems.
• I/O and Signal Integrity  Up to 218 I/O pins with individual tri-state control and programmable output slew-rate to reduce switching noise and support flexible interfacing.
• Reconfiguration & Test  In-circuit reconfigurability (ICR) and built-in JTAG boundary-scan (IEEE 1149.1) for programming and board-level test without consuming device logic.
• Interconnect & Arithmetic Support  FastTrack interconnect, dedicated carry chains for arithmetic functions, and cascade chains for high-fan-in logic accelerate common FPGA functions and place-and-route flow.
• Power & Voltage  Device supply range 3.0 V to 3.6 V; low-power standby behavior is described in the FLEX 6000 family documentation.
• Package & Mounting  256-ball BGA (256-BBGA, 27×27) surface-mount package for compact board integration and high I/O density.
• Operating Conditions  Commercial-grade operation from 0 °C to 85 °C and RoHS-compliant material status.

Typical Applications

• Gate-array replacement & prototyping  Rapidly replace or prototype ASIC/gate-array functions using reprogrammable logic and in-circuit reconfiguration to iterate designs quickly.
• Embedded control and glue logic  Implement control paths, state machines, and peripheral glue functions using the device’s 1,960 logic elements and abundant I/O.
• Multi-voltage interfaces  Bridge systems operating at different voltage domains using the FLEX 6000 family’s MultiVolt I/O capabilities.
• Board-level test and deployment  Use the integrated JTAG boundary-scan for manufacturing test and system debug without consuming user logic resources.

Unique Advantages

• Reprogrammable design flexibility: In-circuit reconfigurability lets you update functionality during development and in-field without PCB changes.
• High I/O density in a compact package: 218 I/Os in a 256-ball BGA (27×27) package reduces board footprint while supporting complex board-level interfaces.
• Mid-range logic capacity: ~24,000 typical gates implemented as 1,960 logic elements provide the capacity for a wide range of control and interface tasks.
• Built-in testability: IEEE 1149.1 JTAG boundary-scan is available without consuming additional device logic, simplifying manufacturing test and debug.
• Commercial-temperature readiness: Rated for 0 °C to 85 °C operation to meet general commercial application requirements.
• RoHS compliant: Materials and construction meet RoHS requirements for environmental compliance.

Why Choose EPF6024ABC256-1?

The EPF6024ABC256-1 positions itself as a practical, mid-density FPGA option for designers needing reprogrammable logic with a high I/O count and compact packaging. Its OptiFLEX architecture and dedicated interconnect features provide an efficient implementation of arithmetic and high-fan-in logic while built-in JTAG and in-circuit reconfigurability streamline prototype iteration and board-level testing.

This device is well suited for teams building prototypes, replacing gate-array functions, or integrating complex glue logic on commercial-temperature products. Its combination of logic capacity, I/O density, and package form factor delivers a scalable platform supported by the FLEX 6000 family design ecosystem.

Request a quote or submit an inquiry to receive pricing and availability information for EPF6024ABC256-1 and to discuss how it can fit into your next design.