EPF6024AFC256-2

IC FPGA 219 I/O 256FBGA
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 219 1960 256-BGA

Quantity 236 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O219Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs196Number of Logic Elements/Cells1960
Number of Gates24000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/A

Overview of EPF6024AFC256-2 – FLEX 6000 FPGA, 256‑FBGA, 1,960 logic elements

The EPF6024AFC256-2 is a FLEX 6000 family Field Programmable Gate Array offered in a 256‑FBGA (17×17) surface-mount package. Built on the OptiFLEX architecture with a register-rich, LUT-based structure, this device targets low-cost programmable replacements for gate arrays and fast-turn prototyping or design testing.

With approximately 24,000 typical gates and 1,960 logic elements, 219 available I/O, in-circuit reconfigurability and JTAG boundary-scan support, the EPF6024AFC256-2 is suited to commercial embedded applications that require flexible logic integration and multi-voltage I/O interfacing.

Key Features

  • Core Architecture  OptiFLEX register-rich, LUT-based architecture providing approximately 24,000 typical gates and 1,960 logic elements for logic-dense implementations.
  • I/O and Voltage  219 I/O pins with MultiVolt I/O interface capability to bridge systems operating at different voltages. Device supply specified at 3 V to 3.6 V.
  • Packaging & Mounting  256‑FBGA (17×17) fine-pitch ball‑grid array package, surface-mount for compact PCB integration.
  • Clocking & Arithmetic Support  Built-in low‑skew clock distribution tree plus dedicated carry and cascade chains for efficient implementation of adders, counters, and high‑fan‑in logic.
  • Configuration & Test  In‑circuit reconfigurability via external configuration device or intelligent controller and built‑in IEEE 1149.1 JTAG boundary‑scan test circuitry (available without consuming device logic). Devices are 100% functionally tested prior to shipment.
  • Power  Low power consumption with typical standby specification less than 0.5 mA.
  • Environmental & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.
  • On‑chip Memory  Total on-chip RAM bits: 0.

Typical Applications

  • Prototyping and Design Validation  Used as a low‑cost, reprogrammable alternative to gate-array prototypes and for rapid design iteration during development and testing.
  • Peripheral and Interface Bridging  MultiVolt I/O and abundant I/O pins make the device suitable for bridging between subsystems that operate at different logic levels.
  • Control and Glue Logic  Implement control, glue logic, and custom state machines where moderate logic density and flexible reconfiguration are required.
  • Testable Embedded Systems  Built‑in JTAG boundary‑scan and 100% functional device testing support streamlined board-level test and validation flows.

Unique Advantages

  • Reconfigurable Design Flow: In‑circuit reconfigurability enables field updates and rapid design changes without hardware swaps.
  • Flexible I/O Integration: 219 I/O pins and MultiVolt operation simplify interfacing to diverse peripherals and mixed-voltage systems.
  • Compact, Production‑Ready Package: 256‑FBGA (17×17) surface-mount package reduces PCB footprint while providing high pin density for complex I/O routing.
  • Testability Built In: IEEE 1149.1 JTAG boundary‑scan and 100% functional testing improve board-level diagnostics and reduce bring‑up time.
  • Efficient Arithmetic and Clocking: Dedicated carry and cascade chains plus a low‑skew clock tree streamline implementation of high-speed arithmetic and synchronous logic.
  • Low Standby Power: Typical standby current below 0.5 mA helps minimize idle power consumption in battery‑sensitive or low‑power designs.

Why Choose EPF6024AFC256-2?

The EPF6024AFC256-2 positions itself as a flexible, cost-effective FPGA option for commercial embedded designs that need reprogrammability, substantial I/O, and logic density in a compact package. Its OptiFLEX architecture, dedicated arithmetic chains, and built-in test features provide a practical balance of performance, integration, and testability for prototyping and production applications.

Designed for engineers who require rapid design iteration and reliable board-level testing, this device is advantageous for projects that benefit from field reconfiguration, multi-voltage interfacing, and a high pin count in a 256‑FBGA form factor.

Request a quote or submit an inquiry to learn about availability, pricing, and volume options for the EPF6024AFC256-2. Our team can provide lead‑time and procurement support to help integrate this FLEX 6000 FPGA into your next design.

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