EPF6024AFC256-2
| Part Description |
FLEX 6000 Field Programmable Gate Array (FPGA) IC 219 1960 256-BGA |
|---|---|
| Quantity | 236 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 219 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 196 | Number of Logic Elements/Cells | 1960 | ||
| Number of Gates | 24000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of EPF6024AFC256-2 – FLEX 6000 FPGA, 256‑FBGA, 1,960 logic elements
The EPF6024AFC256-2 is a FLEX 6000 family Field Programmable Gate Array offered in a 256‑FBGA (17×17) surface-mount package. Built on the OptiFLEX architecture with a register-rich, LUT-based structure, this device targets low-cost programmable replacements for gate arrays and fast-turn prototyping or design testing.
With approximately 24,000 typical gates and 1,960 logic elements, 219 available I/O, in-circuit reconfigurability and JTAG boundary-scan support, the EPF6024AFC256-2 is suited to commercial embedded applications that require flexible logic integration and multi-voltage I/O interfacing.
Key Features
- Core Architecture OptiFLEX register-rich, LUT-based architecture providing approximately 24,000 typical gates and 1,960 logic elements for logic-dense implementations.
- I/O and Voltage 219 I/O pins with MultiVolt I/O interface capability to bridge systems operating at different voltages. Device supply specified at 3 V to 3.6 V.
- Packaging & Mounting 256‑FBGA (17×17) fine-pitch ball‑grid array package, surface-mount for compact PCB integration.
- Clocking & Arithmetic Support Built-in low‑skew clock distribution tree plus dedicated carry and cascade chains for efficient implementation of adders, counters, and high‑fan‑in logic.
- Configuration & Test In‑circuit reconfigurability via external configuration device or intelligent controller and built‑in IEEE 1149.1 JTAG boundary‑scan test circuitry (available without consuming device logic). Devices are 100% functionally tested prior to shipment.
- Power Low power consumption with typical standby specification less than 0.5 mA.
- Environmental & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.
- On‑chip Memory Total on-chip RAM bits: 0.
Typical Applications
- Prototyping and Design Validation Used as a low‑cost, reprogrammable alternative to gate-array prototypes and for rapid design iteration during development and testing.
- Peripheral and Interface Bridging MultiVolt I/O and abundant I/O pins make the device suitable for bridging between subsystems that operate at different logic levels.
- Control and Glue Logic Implement control, glue logic, and custom state machines where moderate logic density and flexible reconfiguration are required.
- Testable Embedded Systems Built‑in JTAG boundary‑scan and 100% functional device testing support streamlined board-level test and validation flows.
Unique Advantages
- Reconfigurable Design Flow: In‑circuit reconfigurability enables field updates and rapid design changes without hardware swaps.
- Flexible I/O Integration: 219 I/O pins and MultiVolt operation simplify interfacing to diverse peripherals and mixed-voltage systems.
- Compact, Production‑Ready Package: 256‑FBGA (17×17) surface-mount package reduces PCB footprint while providing high pin density for complex I/O routing.
- Testability Built In: IEEE 1149.1 JTAG boundary‑scan and 100% functional testing improve board-level diagnostics and reduce bring‑up time.
- Efficient Arithmetic and Clocking: Dedicated carry and cascade chains plus a low‑skew clock tree streamline implementation of high-speed arithmetic and synchronous logic.
- Low Standby Power: Typical standby current below 0.5 mA helps minimize idle power consumption in battery‑sensitive or low‑power designs.
Why Choose EPF6024AFC256-2?
The EPF6024AFC256-2 positions itself as a flexible, cost-effective FPGA option for commercial embedded designs that need reprogrammability, substantial I/O, and logic density in a compact package. Its OptiFLEX architecture, dedicated arithmetic chains, and built-in test features provide a practical balance of performance, integration, and testability for prototyping and production applications.
Designed for engineers who require rapid design iteration and reliable board-level testing, this device is advantageous for projects that benefit from field reconfiguration, multi-voltage interfacing, and a high pin count in a 256‑FBGA form factor.
Request a quote or submit an inquiry to learn about availability, pricing, and volume options for the EPF6024AFC256-2. Our team can provide lead‑time and procurement support to help integrate this FLEX 6000 FPGA into your next design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018