EPF6024AQC208-1

IC FPGA 171 I/O 208QFP
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 171 1960 208-BFQFP

Quantity 431 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O171Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs196Number of Logic Elements/Cells1960
Number of Gates24000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/A

Overview of EPF6024AQC208-1 – FLEX 6000 FPGA, 1,960 logic elements, 171 I/Os, 208-BFQFP

The EPF6024AQC208-1 is a FLEX 6000 family Field Programmable Gate Array from Intel, offering a programmable, register-rich LUT architecture built on the OptiFLEX design. With 1,960 logic elements and up to 24,000 typical gates, this device targets low-cost gate-array replacement, rapid prototyping and design testing, and in-system reconfigurable logic where flexible I/O and predictable timing matter.

Packaged in a 208-pin BFQFP surface-mount package and rated for commercial operation (0 °C to 85 °C) with a 3.0 V to 3.6 V supply range, the EPF6024AQC208-1 provides a balance of density, I/O count (171 pins), and configuration flexibility for embedded and system-level designs.

Key Features

  • Core architecture — Register-rich, LUT-based OptiFLEX architecture that optimizes device area efficiency and supports fast design changes during prototyping and design testing.
  • Logic density — 1,960 logic elements providing approximately 24,000 typical gates for implementing mid-density logic functions.
  • I/O capability — 171 I/O pins with MultiVolt I/O interface support; features include individual tri-state output enable control, programmable output slew-rate control, and a fast register-to-pin path for improved clock-to-output timing.
  • Reconfigurability & configuration — In-circuit reconfigurability (ICR) via external configuration device or intelligent controller, enabling field updates and iterative design revisions.
  • Clocking and routing — Built-in low-skew clock distribution tree and four low-skew global paths; FastTrack continuous routing structure plus dedicated carry and cascade chains for efficient arithmetic and high-fan-in logic.
  • Testability — Built-in JTAG boundary-scan (IEEE Std. 1149.1) circuitry available without consuming device logic, simplifying board-level test and debug.
  • Package & mounting — 208-pin BFQFP (supplier package listed as 208-PQFP, 28×28) in a surface-mount form factor suited for compact PCBs.
  • Power & compliance — Operates from 3.0 V to 3.6 V; low-power standby behavior is supported by the FLEX 6000 family. RoHS-compliant.

Typical Applications

  • Prototyping and design validation — Rapid, reprogrammable logic lets teams iterate hardware functionality quickly during development and pre-production testing.
  • Gate-array replacement — Cost-effective alternative to low-volume gate arrays where mid-range logic density and pin counts are required.
  • System-level I/O bridging — MultiVolt I/O and extensive pin count support voltage-domain interfacing and peripheral glue logic across subsystems.
  • Field-upgradeable logic — In-circuit reconfigurability enables in-field updates and feature revisions without PCB or silicon changes.

Unique Advantages

  • Flexible reconfiguration: In-circuit reconfigurability via external devices or controllers simplifies firmware-driven feature updates and iterative development.
  • Predictable timing and routing: Low-skew clock tree, four global paths, and FastTrack interconnect give designers clearer timing margins for synchronous designs.
  • High I/O versatility: 171 I/Os with individual tri-state and programmable slew-rate controls allow optimized signal integrity and interfacing across peripherals.
  • Built-in test support: Integrated IEEE 1149.1 JTAG boundary-scan reduces the need for additional test logic and eases board-level validation.
  • Package density: 208-pin surface-mount BFQFP (208-PQFP, 28×28) offers a compact footprint while maintaining ample I/O for complex system integration.

Why Choose EPF6024AQC208-1?

The EPF6024AQC208-1 combines the FLEX 6000 family’s OptiFLEX architecture with 1,960 logic elements and 171 I/Os to deliver a mid-density, reprogrammable solution for designers who need adaptable logic and robust I/O in a compact package. Its support for in-circuit reconfiguration, dedicated arithmetic/cascade chains, and built-in boundary-scan make it suitable for iterative product development and systems that require post-deployment updates.

As a commercial-grade, RoHS-compliant device rated for 0 °C to 85 °C and operating from a 3.0 V to 3.6 V supply, the EPF6024AQC208-1 is positioned for embedded and system applications where flexibility, testability, and predictable routing are priorities.

Request a quote or submit an inquiry to check availability and pricing for the EPF6024AQC208-1 and to discuss how it can fit into your next design.

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