EPF6024AQC208-1N
| Part Description |
FLEX 6000 Field Programmable Gate Array (FPGA) IC 171 1960 208-BFQFP |
|---|---|
| Quantity | 451 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 171 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 196 | Number of Logic Elements/Cells | 1960 | ||
| Number of Gates | 24000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of EPF6024AQC208-1N – FLEX 6000 Field Programmable Gate Array (FPGA), 171 I/O, 1,960 Logic Elements, 208-BFQFP
The EPF6024AQC208-1N is a FLEX 6000 family programmable logic device from Intel, delivered in a 208-pin BFQFP surface-mount package. It implements a register-rich, LUT-based OptiFLEX architecture and targets low-cost gate-array replacement, prototyping, and design testing where field reconfigurability and flexible I/O are required.
This device combines 1,960 logic elements (typical ~24,000 gates) and up to 171 I/O pins with features such as low-skew clock routing, in-circuit reconfigurability, and IEEE 1149.1 JTAG boundary-scan support to simplify board integration and accelerate development cycles.
Key Features
- Core architecture Register-rich, look-up table (LUT) based OptiFLEX architecture designed for efficient area utilization and predictable routing.
- Logic capacity Approximately 1,960 logic elements (typical equivalent ~24,000 gates) suitable for moderate-density programmable logic tasks.
- I/O and interfacing Up to 171 I/O pins with individual tri-state output enable control and programmable output slew-rate control to help manage switching noise and interface timing.
- Clock and interconnect Built-in low-skew clock distribution tree with four low-skew global paths and FastTrack interconnect for predictable routing and timing. Dedicated carry and cascade chains support efficient arithmetic and high-fan-in logic functions.
- Configuration and test In-circuit reconfigurability (ICR) via external configuration device or intelligent controller; built-in JTAG boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1-1990, available without consuming additional device logic.
- Power and voltage Supply voltage range 3.0 V to 3.6 V; datasheet-family notes low standby current (typical specification less than 0.5 mA in standby mode).
- Package & mounting 208-BFQFP package (supplier device package: 208-PQFP 28 × 28), surface-mount mounting for compact board designs.
- Operating conditions & compliance Commercial grade operation with an operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental compatibility.
- Design support FLEX 6000 family design flow and automatic place-and-route support for common engineering platforms and EDA tool environments referenced in the family datasheet.
Typical Applications
- Prototyping & design validation Rapid hardware iterations and function changes during prototype cycles through in-circuit reconfigurability and reprogrammable logic.
- Low-volume gate-array replacement Cost-effective programmable alternative for replacing small-scale gate-array designs where post-production changes may be required.
- Mixed-voltage interface bridging MultiVolt I/O interface capabilities make the device suitable for bridging subsystems that operate at different I/O voltages.
- Boundary-scan enabled testing Built-in IEEE 1149.1 JTAG BST circuitry simplifies board-level testability and production debug.
Unique Advantages
- Balanced logic density and gate count: 1,960 logic elements with a typical equivalent of ~24,000 gates provides a middle-ground density for moderate-complexity designs without excessive BOM cost.
- Flexible I/O and signal control: 171 I/O pins with per-pin tri-state enable and slew-rate control make it easier to manage signal integrity and interface timing across diverse peripherals.
- Field reconfigurability: In-circuit reconfiguration support enables on-board updates and functional changes without removing the device from the system.
- Integrated test support: IEEE 1149.1-compliant JTAG boundary-scan is available without consuming additional device logic, simplifying manufacturing test and in-field diagnostics.
- Compact surface-mount package: 208-BFQFP (208-PQFP 28 × 28) provides a compact footprint for space-constrained boards while preserving a high pin count.
- Commercial-grade operating range: Rated for 0 °C to 85 °C operation and RoHS compliant, suitable for a wide array of commercial electronic applications.
Why Choose EPF6024AQC208-1N?
The EPF6024AQC208-1N positions itself as a practical FLEX 6000 family option for designers seeking a programmable, reconfigurable solution with a balanced mix of logic capacity, I/O density, and package compactness. Its OptiFLEX architecture, dedicated arithmetic/cascade chains, and low-skew clock resources provide predictable routing and timing for moderate-complexity designs.
This device is well suited to engineering teams focused on prototyping, low-volume production, and designs that require field updates or robust boundary-scan testability. With commercial-grade temperature rating, RoHS compliance, and broad EDA tool support referenced by the family datasheet, it provides a reliable foundation for scalable development and deployment.
Request a quote or submit an inquiry to obtain pricing and availability for EPF6024AQC208-1N and to discuss how this FLEX 6000 device can fit your next design.

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