EPF6024AQC208-1N

IC FPGA 171 I/O 208QFP
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 171 1960 208-BFQFP

Quantity 451 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O171Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs196Number of Logic Elements/Cells1960
Number of Gates24000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/A

Overview of EPF6024AQC208-1N – FLEX 6000 Field Programmable Gate Array (FPGA), 171 I/O, 1,960 Logic Elements, 208-BFQFP

The EPF6024AQC208-1N is a FLEX 6000 family programmable logic device from Intel, delivered in a 208-pin BFQFP surface-mount package. It implements a register-rich, LUT-based OptiFLEX architecture and targets low-cost gate-array replacement, prototyping, and design testing where field reconfigurability and flexible I/O are required.

This device combines 1,960 logic elements (typical ~24,000 gates) and up to 171 I/O pins with features such as low-skew clock routing, in-circuit reconfigurability, and IEEE 1149.1 JTAG boundary-scan support to simplify board integration and accelerate development cycles.

Key Features

  • Core architecture Register-rich, look-up table (LUT) based OptiFLEX architecture designed for efficient area utilization and predictable routing.
  • Logic capacity Approximately 1,960 logic elements (typical equivalent ~24,000 gates) suitable for moderate-density programmable logic tasks.
  • I/O and interfacing Up to 171 I/O pins with individual tri-state output enable control and programmable output slew-rate control to help manage switching noise and interface timing.
  • Clock and interconnect Built-in low-skew clock distribution tree with four low-skew global paths and FastTrack interconnect for predictable routing and timing. Dedicated carry and cascade chains support efficient arithmetic and high-fan-in logic functions.
  • Configuration and test In-circuit reconfigurability (ICR) via external configuration device or intelligent controller; built-in JTAG boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1-1990, available without consuming additional device logic.
  • Power and voltage Supply voltage range 3.0 V to 3.6 V; datasheet-family notes low standby current (typical specification less than 0.5 mA in standby mode).
  • Package & mounting 208-BFQFP package (supplier device package: 208-PQFP 28 × 28), surface-mount mounting for compact board designs.
  • Operating conditions & compliance Commercial grade operation with an operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental compatibility.
  • Design support FLEX 6000 family design flow and automatic place-and-route support for common engineering platforms and EDA tool environments referenced in the family datasheet.

Typical Applications

  • Prototyping & design validation Rapid hardware iterations and function changes during prototype cycles through in-circuit reconfigurability and reprogrammable logic.
  • Low-volume gate-array replacement Cost-effective programmable alternative for replacing small-scale gate-array designs where post-production changes may be required.
  • Mixed-voltage interface bridging MultiVolt I/O interface capabilities make the device suitable for bridging subsystems that operate at different I/O voltages.
  • Boundary-scan enabled testing Built-in IEEE 1149.1 JTAG BST circuitry simplifies board-level testability and production debug.

Unique Advantages

  • Balanced logic density and gate count: 1,960 logic elements with a typical equivalent of ~24,000 gates provides a middle-ground density for moderate-complexity designs without excessive BOM cost.
  • Flexible I/O and signal control: 171 I/O pins with per-pin tri-state enable and slew-rate control make it easier to manage signal integrity and interface timing across diverse peripherals.
  • Field reconfigurability: In-circuit reconfiguration support enables on-board updates and functional changes without removing the device from the system.
  • Integrated test support: IEEE 1149.1-compliant JTAG boundary-scan is available without consuming additional device logic, simplifying manufacturing test and in-field diagnostics.
  • Compact surface-mount package: 208-BFQFP (208-PQFP 28 × 28) provides a compact footprint for space-constrained boards while preserving a high pin count.
  • Commercial-grade operating range: Rated for 0 °C to 85 °C operation and RoHS compliant, suitable for a wide array of commercial electronic applications.

Why Choose EPF6024AQC208-1N?

The EPF6024AQC208-1N positions itself as a practical FLEX 6000 family option for designers seeking a programmable, reconfigurable solution with a balanced mix of logic capacity, I/O density, and package compactness. Its OptiFLEX architecture, dedicated arithmetic/cascade chains, and low-skew clock resources provide predictable routing and timing for moderate-complexity designs.

This device is well suited to engineering teams focused on prototyping, low-volume production, and designs that require field updates or robust boundary-scan testability. With commercial-grade temperature rating, RoHS compliance, and broad EDA tool support referenced by the family datasheet, it provides a reliable foundation for scalable development and deployment.

Request a quote or submit an inquiry to obtain pricing and availability for EPF6024AQC208-1N and to discuss how this FLEX 6000 device can fit your next design.

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