EPF6024AQC208-3

The EPF6024AQC208-3 is a FLEX 6000 family field programmable gate array (FPGA) in a 208-pin BFQFP package, offering a register-rich, LUT-based architecture optimized for area efficiency. With 1,960 logic elements (approximately 24,000 typical gates) and 171 general-purpose I/O pins, this commercial-grade device targets low-cost gate-array replacement, rapid prototyping, and flexible system I/O functions.

Designed for reconfigurable applications, the device supports in-circuit reconfiguration and provides built-in test and I/O capabilities that simplify board-level integration and production test workflows.

Key Features

• Core architecture Register-rich, look-up table (LUT)-based OptiFLEX architecture that increases device area efficiency and supports reprogrammable SRAM elements.
• Logic capacity 1,960 logic elements (typical 24,000 gates) suitable for medium-complexity programmable logic tasks.
• I/O and interfacing 171 I/O pins with individual tri-state output enable control and programmable output slew-rate control to help manage signal integrity and interfacing.
• Clock and interconnect Built-in low-skew clock distribution tree and FastTrack continuous routing interconnect for predictable timing; dedicated carry and cascade chains for arithmetic and high-fan-in logic.
• Configuration and test Supports in-circuit reconfigurability via external configuration device or intelligent controller; includes built-in JTAG boundary-scan test (IEEE Std. 1149.1) and 100% functional testing prior to shipment.
• Power and voltage Device operates from 3.0 V to 3.6 V; family-level standby current specification is typically less than 0.5 mA.
• Package and mounting 208-BFQFP (208-PQFP, 28×28) surface-mount package; commercial operating temperature range 0 °C to 85 °C; RoHS compliant.
• Software and tool support Supported by the FLEX 6000 family development flow and compatible EDA tool interfaces for place-and-route and design entry (tools referenced in family datasheet).

Typical Applications

• Prototyping and design validation Use the reprogrammable FLEX 6000 architecture for rapid iteration during prototyping and design testing where quick logic changes are required.
• Low-cost gate-array replacement Replace fixed gate-array implementations with a programmable solution to shorten time-to-market and enable post-production updates.
• System I/O and interface bridging 171 I/O pins with per-pin control and MultiVolt I/O capability allow flexible interfacing and bridging between different voltage domains.
• Peripheral control and glue logic Dense logic elements and dedicated carry/cascade chains simplify implementation of adders, counters, and control logic for embedded peripherals.

Unique Advantages

• OptiFLEX area efficiency: The family architecture minimizes die area while preserving routability, enabling higher gate counts in a compact footprint.
• Predictable timing: Low-skew clock distribution and FastTrack interconnect reduce timing uncertainty and aid timing closure for synchronous designs.
• Flexible I/O control: Individual tri-state enables and programmable slew-rate per pin simplify mixed-signal interfacing and help manage EMI and signal integrity.
• Built-in testability: IEEE 1149.1 JTAG boundary-scan and 100% functional testing streamline board-level test and verification without consuming device logic.
• Proven configuration options: In-circuit reconfigurability via external devices or controllers supports field updates and design iteration without hardware changes.
• Compact SMT package: 208-pin BFQFP surface-mount package provides a high-pin-count option for PCB integration in commercial applications.

Why Choose EPF6024AQC208-3?

The EPF6024AQC208-3 combines the FLEX 6000 family’s OptiFLEX architecture with 1,960 logic elements and 171 I/O pins to deliver a versatile mid-range FPGA option for designers seeking a programmable alternative to gate-array solutions. Its combination of predictable timing resources, comprehensive I/O control, and in-circuit reconfigurability makes it well suited to prototyping, interface logic, and moderate-complexity system designs.

With surface-mount 208-BFQFP packaging, RoHS compliance, and commercial temperature rating, this device offers a balance of integration, configurability, and production-ready features for engineering and procurement teams focused on flexibility and cost-effective design iteration.

Request a quote or submit a pricing inquiry to initiate availability and delivery details for EPF6024AQC208-3.