EPF8636AQC208-3
| Part Description |
FLEX 8000 Field Programmable Gate Array (FPGA) IC 136 504 208-BFQFP |
|---|---|
| Quantity | 810 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 136 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 63 | Number of Logic Elements/Cells | 504 | ||
| Number of Gates | 6000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of EPF8636AQC208-3 – FLEX 8000 FPGA IC, 136 I/O, 504 Logic Elements, 208-BFQFP
The EPF8636AQC208-3 is a FLEX 8000 series field-programmable gate array (FPGA) device from Intel (Altera), designed as a register-rich programmable logic solution. It combines fine-grained logic elements and a fast continuous routing architecture to support control, interface, and data-path functions across a range of commercial applications.
Targeted use cases include bus interfaces, TTL integration, coprocessor functions, high-speed controllers and DSP-style data transformation tasks. The device offers a balance of logic density, I/O capacity and system-level features such as in-circuit reconfigurability and programmable I/O options.
Key Features
- Logic Capacity — 504 logic elements (LEs) organized for register-rich implementations, suitable for glue-logic, control and medium-complexity datapath functions.
- Logic Array Blocks (LABs) — 63 LABs to structure logic resources for predictable synthesis and place-and-route results.
- I/O Density — 136 user I/O pins, enabling multiple bus interfaces or parallel data paths directly from the package.
- Gate Equivalence — Approximately 6,000 gates worth of logic resources for system integration and glue logic consolidation.
- Registers / Flip‑Flops — Device family includes a high register count (approximately 820 flip‑flops for the EPF8636A family) to support pipelined and state-machine designs.
- Power and Supply — Single supply range of 4.75 V to 5.25 V for core and I/O operation in standard 5.0 V systems.
- Package & Mounting — 208-pin BFQFP package (supplier device package: 208-PQFP, 28×28); surface-mount for standard PCB assembly.
- Operating Range — Commercial grade operation from 0 °C to 70 °C.
- No Embedded RAM — The device lists no on-chip RAM bits, emphasizing a register-based architecture for state and timing control.
- RoHS Compliant — Conforms to RoHS requirements for lead-free manufacturing and assembly.
- Series-Level System Features — FLEX 8000 family capabilities include in-circuit reconfigurability, FastTrack continuous routing, dedicated carry and cascade chains, programmable output slew-rate control, and support for boundary-scan (JTAG) on selected devices.
Typical Applications
- Bus Interface Logic — Implements glue logic for parallel or multiplexed buses, enabling consolidation of multiple bus transceivers and interface functions into a single device.
- High-Speed Control — Acts as a control engine or state machine for motor drives, controllers and communication front-ends requiring deterministic routing.
- Coprocessor / Glue Functions — Offloads protocol conversion, simple arithmetic acceleration and control sequencing from a main CPU.
- Digital Signal Processing Support — Suitable for DSP-style tasks such as wide-data-path manipulation and data transformation using register-rich resources and dedicated arithmetic chains.
Unique Advantages
- Balanced Logic Density: 504 logic elements and ~6,000 gate equivalence provide capacity to consolidate multiple discrete functions and reduce BOM count.
- High Pin Count for System Integration: 136 user I/O pins allow direct connection to parallel buses, sensors, and peripheral devices without external expander ICs.
- Register-Rich Architecture: A large number of flip‑flops supports pipelining and state-heavy designs, improving timing closure for complex control paths.
- Predictable Routing: FastTrack continuous interconnect and dedicated carry/cascade chains help achieve consistent timing and efficient implementation of arithmetic and high-fan-in logic.
- In-System Flexibility: Series-level in-circuit reconfigurability enables design iteration and field updates via external configuration devices or intelligent controllers.
- Commercial Temperature and Standard Packaging: Commercial-grade operation (0 °C to 70 °C) in a 208-pin BFQFP surface-mount package for mainstream PCB assembly processes.
Why Choose EPF8636AQC208-3?
The EPF8636AQC208-3 combines the FLEX 8000 series architecture with a compact 208-pin package and a high I/O count to deliver a flexible, register-rich programmable logic solution for commercial applications. Its mix of logic elements, predictable routing structures and series-level system features make it well suited to designers seeking to integrate bus interfaces, control logic and DSP-oriented data handling into a single device.
This device is appropriate for engineering teams focused on reducing component count, speeding development iterations through in-circuit reconfigurability, and achieving reliable timing using dedicated interconnect resources provided by the FLEX 8000 family.
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