EPF8636ARC208-4

LOADABLE PLD, CMOS, PQFP208
Part Description

FLEX 8000 Field Programmable Gate Array (FPGA) IC 136 504 208-BFQFP Exposed Pad

Quantity 823 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAltera
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package208-RQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFP Exposed PadNumber of I/O136Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH not applicable
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs63Number of Logic Elements/Cells504
Number of Gates6000ECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of EPF8636ARC208-4 – FLEX 8000 FPGA, 504 logic elements, 136 I/O

The EPF8636ARC208-4 is a FLEX 8000 field-programmable gate array (FPGA) IC from Altera. It delivers 504 logic elements and 6,000 gates with up to 136 digital I/O in a 208-BFQFP exposed pad surface-mount package.

Designed for commercial-temperature applications, the device operates from a 4.75 V to 5.25 V supply range and is RoHS compliant, offering a compact, standards-compatible option for designs that require moderate programmable logic and a high I/O count.

Key Features

  • Logic Capacity 504 logic elements and approximately 6,000 gates provide programmable logic resources for custom digital functions.
  • High I/O Count 136 user I/O pins support a broad set of external interfaces and parallel signals in a single device.
  • Memory No on-chip RAM bits reported (0 bits), enabling predictable external memory planning where required.
  • Power Supports a 4.75 V to 5.25 V supply range for compatibility with 5 V system domains.
  • Package and Mounting 208-BFQFP exposed pad package (supplier device package: 208-RQFP, 28×28) in a surface-mount form factor for compact board layouts and thermal conduction through the exposed pad.
  • Operating Range Commercial-grade operating temperature of 0°C to 70°C for standard commercial applications.
  • Compliance RoHS compliant, meeting common environmental restrictions for lead-free assemblies.

Typical Applications

  • Custom logic implementation Use the 504 logic elements to implement application-specific state machines, control logic, and glue logic in compact designs.
  • High-density I/O control Leverage 136 I/O pins to consolidate multiple parallel interfaces or sensor/actuator connections on a single FPGA.
  • Board-level integration The exposed pad 208-BFQFP package and surface-mount mounting simplify board layout for space-constrained commercial products.

Unique Advantages

  • Balanced logic and I/O Combines 504 logic elements with 136 I/O pins to support mid-range logic implementations while minimizing external glue circuitry.
  • 5 V system compatibility Operates across a 4.75 V–5.25 V supply window, aligning with legacy 5 V designs.
  • Compact, thermally aware package 208-BFQFP exposed pad helps simplify mechanical integration and thermal conduction in surface-mount assemblies.
  • Commercial-grade suitability Rated for 0°C to 70°C operation to match typical commercial product environments.
  • Environmentally compliant RoHS compliance supports lead-free manufacturing requirements.

Why Choose EPF8636ARC208-4?

The EPF8636ARC208-4 positions itself as a practical, mid-range FPGA choice when a balance of programmable logic and a high I/O count is required in a compact, surface-mount package. Its 504 logic elements and 136 I/O pins make it suitable for commercial designs that need on-board programmability without large FPGA overhead.

Backed by Altera documentation and supplied in a 208-BFQFP exposed pad package, this device offers a predictable integration path for customers targeting 5 V system domains and RoHS-compliant production environments.

Request a quote or submit an inquiry to receive pricing and availability for the EPF8636ARC208-4.

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