EPF8820ABC225-4
| Part Description |
FLEX 8000 Field Programmable Gate Array (FPGA) IC 152 672 225-BGA |
|---|---|
| Quantity | 165 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 225-BGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 225-BGA | Number of I/O | 152 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 84 | Number of Logic Elements/Cells | 672 | ||
| Number of Gates | 8000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of EPF8820ABC225-4 – FLEX 8000 Field Programmable Gate Array (FPGA) IC 152 672 225-BGA
The EPF8820ABC225-4 is a FLEX 8000 family programmable logic device designed for register-rich, high-density logic implementations. With 672 logic elements and support for approximately 8,000 usable gates, this device targets applications that require medium-density FPGA functionality in a compact 225‑BGA package.
Built for system-level flexibility, the device supports in-circuit reconfigurability and a FastTrack® continuous routing structure for predictable interconnect delays. It is well suited for bus interfaces, data-path processing, and general-purpose controller functions where a combination of logic density, I/O count, and reconfigurability are important.
Key Features
- Logic Density — 672 logic elements and a device-class capacity of approximately 8,000 usable gates, organized across 84 logic array blocks (LABs) for compact combinational and registered logic.
- Registers / Flip‑Flops — High register count appropriate for synchronous designs (device family documentation lists flip‑flop resources associated with this class of device).
- I/O and Voltage — 152 user I/O pins with MultiVolt I/O capability described for the FLEX 8000 family; device voltage supply specified at 4.75 V to 5.25 V to support 5.0 V operation.
- Interconnect & Arithmetic — FastTrack® continuous routing and dedicated carry/cascade chains (family features) provide predictable routing delays and support for fast adders, counters, and comparators.
- Configuration & System Features — In‑circuit reconfigurability (ICR) via external configuration devices or controllers and family-level support for PCI Local Bus Specification Revision 2.2 at 5.0 V operation.
- Package & Mounting — Surface-mount 225‑BGA (19 × 19) package, suitable for high‑pin‑count board integration while minimizing board footprint.
- Commercial Temperature Grade — Operating temperature range specified 0 °C to 70 °C for commercial applications.
- Embedded Memory — No on-chip RAM bits documented for this device class in the available data.
- Standby Power — Family documentation lists low standby current characteristics (typical family guidance).
Typical Applications
- Data-path and DSP functions — Medium-density logic and plentiful registers make the device suitable for wide-data-path manipulation and DSP front-end tasks.
- Bus Interfaces and Glue Logic — High I/O count and 5.0 V-compatible operation enable integration with TTL buses and board-level interface logic.
- Coprocessor and Acceleration Blocks — Dedicated carry and cascade chains accelerate arithmetic and high‑fan‑in logic commonly used in coprocessor or accelerator designs.
- High‑Speed Controllers — Continuous routing and predictable interconnect delays support controller implementations requiring deterministic timing.
Unique Advantages
- Balanced Logic and Register Resources: 672 logic elements combined with a high register count provide a compact, register-rich fabric for synchronous designs.
- Predictable Interconnect: FastTrack® continuous routing reduces variability in routing delays, simplifying timing closure for mid-density applications.
- Flexible System Integration: 152 user I/Os in a 225‑BGA footprint enable multiple bus interfaces and board-level consolidation while minimizing PCB area.
- In-Circuit Reconfigurability: Support for ICR via external configuration devices allows field updates and iterative development without board-level changes.
- 5.0 V Operation Compatibility: Device supply range (4.75 V to 5.25 V) and family-level PCI compatibility support legacy 5.0 V systems and interfaces.
Why Choose EPF8820ABC225-4?
The EPF8820ABC225-4 delivers a practical balance of logic density, register resources, and I/O capacity in a compact 225‑BGA package for commercial-grade applications. Its FLEX 8000 family architecture emphasizes predictable routing, arithmetic support through dedicated chains, and in‑circuit reconfigurability—features that simplify mixed-signal board integration, bus interfacing, and controller or accelerator designs.
Designed for engineers who need a medium-density, register-rich programmable device with 5.0 V system compatibility and a mature tool and design ecosystem documented for the FLEX 8000 family, this device is appropriate for projects where reprogrammability, deterministic routing, and compact packaging deliver long-term design flexibility.
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