EPF8820AQC208-2

IC FPGA 152 I/O 208QFP
Part Description

FLEX 8000 Field Programmable Gate Array (FPGA) IC 152 672 208-BFQFP

Quantity 694 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O152Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs84Number of Logic Elements/Cells672
Number of Gates8000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/A

Overview of EPF8820AQC208-2 – FLEX 8000 Field Programmable Gate Array (FPGA) IC 152 I/O, 672 Logic Elements, 208-BFQFP

The EPF8820AQC208-2 is a member of the FLEX 8000 programmable logic device family. It combines a register-rich, fine-grained FPGA architecture fabricated on an advanced SRAM process with system-level features aimed at commercial embedded and interface applications.

With 672 logic elements across 84 logic array blocks and up to 152 user I/O pins in a 208-pin BFQFP package, this device targets bus interfaces, controller functions, TTL integration and other moderate-density logic integration tasks where 5.0 V operation and flexible I/O are required.

Key Features

  • Core Architecture FLEX 8000 family architecture implemented in an SRAM-based process delivering 672 logic elements organized into 84 logic array blocks and approximately 8,000 usable gates.
  • I/O Density & Voltage Up to 152 user I/O pins with MultiVolt I/O support noted in the FLEX 8000 family; device supply range is 4.75 V to 5.25 V for 5.0 V operation.
  • System-Level Features Family-level capabilities include in-circuit reconfigurability (ICR) via external configuration devices or intelligent controllers, and PCI Local Bus Specification Revision 2.2 compliance for 5.0 V operation (as described for the FLEX 8000 family).
  • Interconnect & Arithmetic Support FastTrack continuous routing structure and dedicated carry and cascade chains provide predictable interconnect delays and hardware support for fast adders, counters, and high-fan-in logic functions.
  • Programmable I/O Behavior Programmable output slew-rate control reduces switching noise; family documentation also notes I/O compatibility with both 5.0 V and 3.3 V logic levels.
  • Package & Mounting Surface-mount 208-BFQFP package (supplier device package: 208-PQFP, 28×28) suitable for compact board-level integration; commercial-grade operating range from 0 °C to 70 °C.
  • Design & Test Support FLEX 8000 family devices are supported by software design tools and automatic place-and-route from the MAX+PLUS II development system (family-level documentation).
  • Compliance RoHS compliant.

Typical Applications

  • Bus Interfaces Integrate multiple parallel buses and implement custom bus-bridging or protocol glue logic using the device’s high I/O count and moderate logic density.
  • High-Speed Controllers Implement controller and timing-critical logic with dedicated carry/cascade chains and FastTrack routing for predictable delays.
  • TTL and Legacy Logic Integration Replace discrete TTL glue logic and consolidate board-level functions while maintaining 5.0 V I/O compatibility.
  • Coprocessor or Data Path Glue Use the register-rich fabric and numerous I/Os for offloading or interfacing with processors and wide data-path peripherals.

Unique Advantages

  • Moderate-density integration: 672 logic elements and ~8,000 gates provide a balance of logic capacity for consolidation of glue logic and medium-complexity functions.
  • High I/O availability: Up to 152 user I/O pins in a 208-pin package support multi-bus and multi-signal designs without large packages.
  • 5.0 V operation with flexible I/O: Device supply range of 4.75–5.25 V and family-level MultiVolt I/O capability enable integrating with 5.0 V and 3.3 V logic domains.
  • Predictable routing and arithmetic support: FastTrack interconnect and dedicated carry/cascade chains simplify implementation of adders, counters, and wide datapaths.
  • Compact surface-mount packaging: 208-BFQFP (surface mount) and a supplier 208-PQFP (28×28) footprint for space-conscious board layouts.
  • Commercial-grade reliability: Rated for 0 °C to 70 °C operation and RoHS compliant for standard commercial applications.

Why Choose EPF8820AQC208-2?

The EPF8820AQC208-2 provides a practical balance of logic capacity, I/O density, and 5.0 V operation for designers needing a commercially graded, reconfigurable logic device. Its FLEX 8000 family architecture brings predictable interconnect, dedicated arithmetic chains, and system-level features that simplify implementation of bus interfaces, controllers, and interface glue logic.

Backed by FLEX 8000 family design support (including MAX+PLUS II toolflow references in the family documentation), this device is suitable for teams integrating moderate-complexity digital functions into space-conscious, commercial-temperature-range products.

Request a quote or submit an inquiry for pricing and availability of EPF8820AQC208-2.

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