EPF8820ARC208-3

IC FPGA 152 I/O 208RQFP
Part Description

FLEX 8000 Field Programmable Gate Array (FPGA) IC 152 672 208-BFQFP Exposed Pad

Quantity 1,792 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-RQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFP Exposed PadNumber of I/O152Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs84Number of Logic Elements/Cells672
Number of Gates8000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/A

Overview of EPF8820ARC208-3 – FLEX 8000 Field Programmable Gate Array (FPGA) IC 152 I/O 672 Logic Elements 208-BFQFP Exposed Pad

The EPF8820ARC208-3 is a member of the FLEX 8000 family of register-rich, CMOS programmable logic devices. Architected for medium-density logic integration, this device delivers 8,000 usable gates implemented as 672 logic elements and 84 logic array blocks, with up to 152 user I/O pins in a 208-BFQFP exposed-pad package.

Designed for commercial applications requiring in-system configurability and predictable timing, the EPF8820ARC208-3 supports standard 5.0 V system operation (4.75 V to 5.25 V supply) and RoHS-compliant manufacturing for contemporary electronics assembly.

Key Features

  • Core Architecture 672 logic elements across 84 logic array blocks deliver medium-density, register-rich programmable logic suitable for control, glue logic, and bus-interface tasks.
  • Logic Density 8,000 usable gates provide the functional capacity for multi-bus integration, coprocessor glue, and high-pin-count controllers.
  • I/O Capability 152 user I/O pins enable extensive peripheral and bus connectivity in a single device footprint.
  • Package & Mounting 208-BFQFP exposed-pad package (supplier device package: 208-RQFP, 28×28) with surface-mount mounting type for compatible PCB assembly flows.
  • Power and Thermal Single-supply operation from 4.75 V to 5.25 V and commercial operating temperature range of 0 °C to 70 °C.
  • Family-Level System Features In-circuit reconfigurability (ICR), FastTrack® continuous interconnect for predictable routing delays, dedicated carry and cascade chains for arithmetic and high-fan-in logic, and programmable output slew-rate control to help manage switching noise.
  • Test and Design Support Built-in JTAG boundary-scan test (on selected family devices) and software design support in the FLEX 8000 family development flow for placement and routing.
  • Regulatory RoHS compliant for environmental and assembly requirements.

Typical Applications

  • Bus Interfaces and Glue Logic Integrate multiple bus segments or implement custom bus adapters using the device’s 152 I/O pins and 672 logic elements.
  • High-Pin-Count Controllers Use for controllers that consolidate multiple 8/16/32-bit data paths or peripheral interfaces into a single programmable device.
  • Embedded Control and State Machines Implement finite-state machines, protocol controllers, and timing-critical glue functions with dense register resources and dedicated carry/cascade chains.
  • Prototyping and In-System Reconfigurable Designs Leverage in-circuit reconfigurability for iterative development, field updates, or configurable feature sets in commercial products.

Unique Advantages

  • Balanced Logic Density: 8,000 usable gates and 672 logic elements provide a mid-point density that fits many controller and glue-logic requirements without overcommitting board area.
  • Extensive I/O in a Compact Package: 152 user I/Os in a 208-BFQFP exposed-pad package simplify system-level integration while supporting high connectivity.
  • predictable routing architecture: FastTrack continuous interconnect and dedicated arithmetic/cascade chains yield consistent timing behavior for critical paths.
  • Field Flexibility: In-circuit reconfigurability supports firmware updates and design iterations without board rework.
  • Industry-Ready Assembly: Surface-mount 208-BFQFP exposed-pad packaging and RoHS compliance align with standard manufacturing and environmental requirements.
  • Standard 5 V Operation: Direct support for 5.0 V systems (4.75 V to 5.25 V) simplifies integration into legacy and commercial 5 V designs.

Why Choose EPF8820ARC208-3?

The EPF8820ARC208-3 positions itself as a practical, commercially graded programmable logic device for designers who need a medium-density FPGA-style solution with rich register resources, abundant I/O, and in-system reconfigurability. Its combination of 672 logic elements, 152 I/O pins, and a 208-BFQFP exposed-pad package makes it well suited to control, bus-interface, and multi-bus consolidation tasks in commercial electronic products.

For teams building scalable, field-updatable systems, the FLEX 8000 family architecture and device-level features provide predictable routing, dedicated arithmetic support, and the system-level flexibility required for iterative development and deployment.

Request a quote or submit a proposal to receive pricing and availability for the EPF8820ARC208-3. Our team can provide lead-time and ordering guidance based on your project needs.

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