EPF8820ATC144-2

IC FPGA 112 I/O 144TQFP
Part Description

FLEX 8000 Field Programmable Gate Array (FPGA) IC 112 672 144-LQFP

Quantity 587 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 70°C
Package / Case144-LQFPNumber of I/O112Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs84Number of Logic Elements/Cells672
Number of Gates8000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/A

Overview of EPF8820ATC144-2 – FLEX 8000 FPGA IC, 112 I/O, 672 logic elements, 144-LQFP

The EPF8820ATC144-2 is a FLEX 8000 family field-programmable gate array (FPGA) offered by Intel. It delivers a mid-range programmable-logic resource set—672 logic elements and 84 logic array blocks—packaged in a 144-pin LQFP for surface-mount assembly.

Designed for commercial-grade systems that require moderate logic density and a high I/O count, this device supports 112 user I/O pins, operates from a 4.75 V to 5.25 V supply, and is specified for 0 °C to 70 °C operation. The device is RoHS compliant and targets applications that benefit from reconfigurable logic and flexible I/O interfacing.

Key Features

  • Core / Logic Capacity  672 logic elements and 84 logic array blocks provide configurable logic and registers for mid-density designs.
  • I/O and Interface Density  112 user I/O pins support a wide range of external peripherals and bus connections in a single device footprint.
  • Supply and Voltage Compatibility  Operates from a 4.75 V to 5.25 V supply; FLEX 8000 family documentation specifies MultiVolt I/O support across the family for compatibility with 5.0 V and 3.3 V logic levels.
  • Package and Mounting  Delivered in a 144-LQFP surface-mount package suitable for compact PCB implementations.
  • Commercial Temperature Grade  Specified for 0 °C to 70 °C operation for typical commercial applications.
  • On-chip Memory  Total on-chip RAM bits: 0; device focuses on combinational and registered logic resources rather than embedded RAM.
  • Standards and Family-level Features  FLEX 8000 family devices include features such as in-circuit reconfigurability and family-level support for system-level functions like PCI 5.0 V operation and JTAG boundary-scan on selected devices.
  • Regulatory  RoHS compliant.

Typical Applications

  • Bus Interfaces: Implement bus bridging and protocol glue logic where multiple parallel interfaces must be consolidated or translated.
  • High-Speed Controllers: Control logic for motor drivers, communication controllers, or timing-sensitive subsystems that need predictable routing and register-rich architecture.
  • Coprocessor and Peripheral Logic: Offload specialized control or preprocessing tasks from a main CPU using configurable logic and plentiful I/O.
  • TTL Integration and Board-Level Glue: Integrate legacy TTL-level devices and create custom timing or handshake logic between modules.

Unique Advantages

  • Balanced Logic and I/O: 672 logic elements paired with 112 I/O pins supports designs that require moderate on-chip logic with extensive external interfacing.
  • 5 V System Compatibility: Designed for 5.0 V supply operation (4.75 V–5.25 V), aligning with common legacy and industrial 5 V systems.
  • Compact, Surface-Mount Package: 144-LQFP surface-mount package enables PCB space savings while preserving a high pin count for complex I/O layouts.
  • Family-Level Reconfigurability: FLEX 8000 family support for in-circuit reconfigurability enables field updates and design iteration without board-level changes.
  • Commercial-Level Qualification: Specified operating range of 0 °C to 70 °C and RoHS compliance make it suitable for commercial embedded systems.

Why Choose EPF8820ATC144-2?

The EPF8820ATC144-2 positions itself as a practical choice for commercial embedded designs that require a combination of moderate programmable logic density and a generous number of I/O pins in a compact surface-mount package. Its 672 logic elements and 112 user I/Os make it well suited for bus interfacing, controller logic, and coprocessor or glue-logic roles where on-chip RAM is not a primary requirement.

Backed by the FLEX 8000 family feature set—including in-circuit reconfigurability and family support for mixed-voltage I/O—this device offers designers a flexible platform for iterative development and system integration while meeting commercial temperature and RoHS requirements.

Request a quote or submit an inquiry to obtain pricing, availability, and technical support for EPF8820ATC144-2.

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