EPF8820ATC144-4
| Part Description |
FLEX 8000 Field Programmable Gate Array (FPGA) IC 112 672 144-LQFP |
|---|---|
| Quantity | 574 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 112 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 84 | Number of Logic Elements/Cells | 672 | ||
| Number of Gates | 8000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of EPF8820ATC144-4 – FLEX 8000 Field Programmable Gate Array (FPGA) IC 112 I/O 672 logic elements 144-LQFP
The EPF8820ATC144-4 is a member of the FLEX 8000 family of register‑rich CMOS programmable logic devices. It delivers a compact FPGA architecture with 672 logic elements (LEs), approximately 8,000 usable gates, and 112 user I/O pins in a 144‑lead LQFP package for surface‑mount applications.
Designed for general commercial embedded designs, this device is well suited to tasks such as bus interfaces, TTL integration, coprocessor functions, DSP support and high‑speed control logic where moderate gate density, plentiful I/O and 5.0 V operation are required.
Key Features
- Core logic 672 logic elements providing roughly 8,000 usable gates and dedicated registers for implementing control, datapath and state‑machine functions.
- I/O capacity 112 user I/O pins to support multiple external buses, parallel interfaces and sensor/control connectivity.
- Voltage and power Nominal 5.0 V operation with a voltage supply range of 4.75 V to 5.25 V suitable for 5.0‑V systems.
- Package and mounting 144‑lead LQFP package (supplier device package: 144‑TQFP, 20×20) optimized for surface‑mount PCB assembly.
- Commercial temperature grade Rated for 0 °C to 70 °C operation to match standard commercial environments.
- Family system features FLEX 8000 family features include in‑circuit reconfigurability via external configuration devices or an intelligent controller, dedicated carry and cascade chains for arithmetic and high‑fan‑in logic, and programmable output slew‑rate control to reduce switching noise.
- Design tool support Supported by the FLEX 8000 development flow and vendor design tools for synthesis, place‑and‑route and simulation as part of the family ecosystem.
- Standards and testability (family level) Family documentation notes PCI‑local bus compatibility for 5.0‑V operation and boundary‑scan (JTAG) test support on selected devices.
Typical Applications
- Bus interface and glue logic Implement parallel bus bridges, protocol translation and TTL integration using the device’s dense I/O and moderate logic capacity.
- High‑speed controllers Build custom controllers and state machines for motor control, peripheral timing, or board‑level control where predictable routing and register density matter.
- Coprocessor and accelerator functions Offload specialized arithmetic or control tasks with dedicated carry chains and abundant registers for pipelined datapaths.
- DSP and wide‑data‑path manipulation Use the register‑rich fabric to implement moderate‑complexity DSP blocks and wide data paths for embedded signal processing tasks.
Unique Advantages
- Balanced logic density: 672 logic elements and ~8,000 usable gates offer a middle ground between small PLDs and larger FPGAs, simplifying design partitioning for mid‑range applications.
- Generous I/O count: 112 user I/O pins reduce the need for external expanders when integrating multiple buses, sensors or parallel interfaces.
- 5 V system compatibility: Direct operation at 4.75–5.25 V makes the device straightforward to integrate into legacy 5.0‑V systems.
- Surface‑mount package: The 144‑lead LQFP package provides a compact footprint for PCB designs while supporting a wide set of I/O signals.
- Family ecosystem and toolchain: Supported by the FLEX 8000 family design flow and vendor tools, reducing development time through established synthesis, place‑and‑route and simulation support.
Why Choose EPF8820ATC144-4?
The EPF8820ATC144-4 offers a practical combination of logic capacity, I/O density and 5.0‑V compatibility for commercial embedded designs that require mid‑range programmable logic. Its 672 logic elements and 112 user I/O pins enable consolidation of glue logic, bus interfaces and custom control functions into a single surface‑mount device.
For engineering teams targeting reliable, cost‑effective implementation of bus interfaces, coprocessor offload, DSP support or high‑speed control logic, this FLEX 8000 device provides a supported development ecosystem and family‑level features that streamline design and testing.
Request a quote or submit a sales inquiry to receive pricing, availability and technical assistance for EPF8820ATC144-4.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018