EPF8820ARC208-4

The EPF8820ARC208-4 is a member of the FLEX 8000 family of SRAM-based FPGAs designed for register-rich, low-cost programmable logic applications. It provides 672 logic elements organized across 84 logic array blocks, and up to 152 user I/O pins in a 208-pin BFQFP exposed-pad surface-mount package. The device targets system-level designs that require flexible I/O, in-circuit reconfigurability, and rapid implementation using standard development tools.

Key Features

• Core Logic  672 logic elements arranged in 84 logic array blocks support combinational and registered logic implementation for glue logic, controllers, and data-path functions.
• Gate Density  Approximately 8,000 usable gates suitable for medium-density logic integration and bus interfacing.
• I/O and Voltage  152 user I/O pins with MultiVolt™ I/O support family-level compatibility allowing the device core to operate at 5.0 V while I/O pins are compatible with both 5.0 V and 3.3 V signaling; rated supply voltage 4.75 V to 5.25 V.
• Packaging & Mounting  208-BFQFP exposed-pad package (supplier device package 208-RQFP, 28×28) in a surface-mount form factor suited for high-pin-count board integration.
• Configuration & System Features  Family-level support for in-circuit reconfigurability (ICR) via external configuration devices or an intelligent controller; JTAG boundary-scan test (BST) available on selected devices.
• Interconnect & Arithmetic Support  FastTrack® continuous routing structure plus dedicated carry and cascade chains to implement high-speed arithmetic and high‑fan‑in logic functions efficiently.
• Performance Controls  Programmable output slew-rate control and peripheral register options for tuning setup and clock‑to‑output timing behavior.
• Power & Temperature  Designed for commercial-grade operation with a rated operating temperature range of 0°C to 70°C and typical low standby current characteristics at the family level.
• Compliance & Environment  RoHS compliant for lead‑free environmental requirements.
• Development Ecosystem  Supported by the FLEX 8000 family toolset for automated place-and-route and standard HDL/netlist flows for efficient design turn‑up.

Typical Applications

• Bus Interfaces  Integrate multiple parallel buses or implement custom bus bridging using the device's high I/O count and medium gate density.
• High-Speed Controllers  Implement control logic for peripherals, memory controllers, or board-level interfaces where predictable interconnect delays and dedicated carry/cascade chains accelerate design.
• TTL and Logic Integration  Replace glue logic and TTL arrays by consolidating discrete functions into a single programmable device with flexible I/O voltage compatibility.
• Coprocessor and Glue Logic  Embed control and glue functions alongside main processors for custom data-path manipulation and protocol adaptation.

Unique Advantages

• Balanced Logic Density:  About 8,000 gates and 672 logic elements provide a mid-density option that balances integration with predictable routing for faster timing closure.
• High I/O Count:  152 user I/O pins enable consolidation of multiple signals and buses into a single device, reducing board complexity and BOM count.
• Flexible I/O Voltage Support:  MultiVolt I/O compatibility permits mixed 5.0 V and 3.3 V interfaces without external level-shifting for many use cases.
• Reconfigurability:  In-circuit reconfigurability simplifies field updates and iterative development flows.
• System-Level Features:  Dedicated carry/cascade chains and FastTrack routing help deliver efficient arithmetic and predictable interconnect performance for timing-sensitive logic.
• Commercial-Grade, RoHS Compliant:  Commercial temperature rating and RoHS compliance align the device with a wide range of mainstream electronics projects.

Why Choose EPF8820ARC208-4?

The EPF8820ARC208-4 delivers a practical combination of mid-range logic capacity, extensive I/O, and family-level system features such as in-circuit reconfigurability and dedicated arithmetic chains. Its 208-pin BFQFP exposed-pad package and surface-mount mounting make it suitable for board-level integration where multiple parallel interfaces or bus consolidation are required.

This device is well suited to design teams seeking a commercially graded, register‑rich programmable logic device with predictable routing, flexible I/O voltage options, and support from established FLEX 8000 design tools—enabling quicker prototyping and deployment in a variety of embedded applications.

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