EPF8820AQC208-4
| Part Description |
FLEX 8000 Field Programmable Gate Array (FPGA) IC 152 672 208-BFQFP |
|---|---|
| Quantity | 1,483 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 152 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 84 | Number of Logic Elements/Cells | 672 | ||
| Number of Gates | 8000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of EPF8820AQC208-4 – FLEX 8000 Field Programmable Gate Array (FPGA) IC 152 672 208-BFQFP
The EPF8820AQC208-4 is a FLEX 8000 family FPGA from Intel, delivering a register‑rich, SRAM‑based programmable logic fabric for mid‑density logic integration. The device combines 84 logic array blocks (LABs) and 672 logic elements with up to 152 user I/O pins in a 208‑pin surface‑mount package, targeting designs that require flexible I/O, reconfigurability, and compact board-level integration.
Typical use cases include bus interfaces, control and coprocessing logic, data transformation and DSP‑style tasks where a combination of high I/O count and on‑chip register resources improves system integration and reduces external glue logic.
Key Features
- Logic Capacity 84 logic array blocks and 672 logic elements provide mid‑density programmable logic suitable for control, interface, and data‑path functions.
- Gate Equivalent Approximately 8,000 usable gates for implementing a wide range of combinational and sequential logic.
- Register‑Rich Architecture Designed for designs that rely on plentiful flip‑flops and registers rather than embedded RAM (Total on‑chip RAM bits: 0), enabling predictable timing for state‑based logic.
- I/O and Voltage Up to 152 user I/O pins with MultiVolt™ I/O capability described in the FLEX 8000 family; device supply range is 4.75 V to 5.25 V for 5.0‑V operation.
- Reconfigurability & Test Supports in‑circuit reconfigurability (ICR) via external configuration devices or an intelligent controller; includes JTAG boundary‑scan test circuitry on selected devices as described for the family.
- Fast Interconnect & Arithmetic Support Family features such as the FastTrack® continuous routing structure and dedicated carry/cascade chains provide predictable interconnect delays and efficient implementation of adders, counters, and high‑fan‑in logic.
- Package & Mounting 208‑pin BFQFP surface‑mount package (supplier device package listed as 208‑PQFP, 28×28) for compact PCB layouts and high I/O density.
- Commercial Grade & Environmental Commercial operating temperature 0°C to 70°C and RoHS compliance for regulatory and supply‑chain requirements.
Typical Applications
- Bus Interfaces: Implement multi‑bus bridging and protocol conversion where 152 I/O pins and reconfigurability simplify board-level integration.
- TTL Integration: Replace multiple discrete glue‑logic devices with a single programmable device to consolidate TTL interfacing and logic translation.
- Coprocessor and Control Logic: Offload custom control, sequencing, or coprocessing tasks to the FPGA’s register‑rich fabric for tighter system timing and reduced latency.
- High‑Speed Controllers: Implement real‑time controllers and high‑fan‑in control logic using the device’s dedicated carry and cascade chains for efficient arithmetic and comparison functions.
Unique Advantages
- Balanced Mid‑Density Resource Mix: 672 logic elements with approximately 8,000 gates provides a practical balance of logic and I/O for many embedded control and interface tasks.
- High I/O Count in a Compact Package: 152 user I/O pins in a 208‑pin surface‑mount package enable multiple bus integrations and dense connectivity without a large package footprint.
- In‑Circuit Reconfigurability: Supports dynamic configuration updates via external devices or intelligent controllers, allowing in‑system design iteration and field updates.
- Predictable Routing and Arithmetic Support: FastTrack interconnect architecture and dedicated carry/cascade chains simplify high‑performance arithmetic and wide datapath implementation.
- RoHS‑Compliant Commercial Offering: Commercial temperature grading (0°C to 70°C) and RoHS compliance make the device suitable for mainstream electronics applications with regulatory and environmental considerations addressed.
Why Choose EPF8820AQC208-4?
The EPF8820AQC208-4 positions itself as a practical, register‑rich FPGA choice for designers needing mid‑density logic, significant I/O, and in‑system flexibility. Its combination of 672 logic elements, 152 I/O, and a compact 208‑pin surface‑mount package enables consolidation of interface logic, control functions, and coprocessing stages into a single programmable device.
This part is well suited for engineering teams focused on reducing board complexity and accelerating time‑to‑market through reconfigurable hardware. With family features such as FastTrack interconnects, dedicated arithmetic chains, and support for in‑circuit reconfiguration, the EPF8820AQC208-4 provides a verifiable, specification‑driven platform for embedded and interface‑centric designs.
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