ICE5LP4K-SWG36ITR

IC FPGA 26 I/O 36WLCSP
Part Description

iCE40 Ultra™ Field Programmable Gate Array (FPGA) IC 26 81920 3520 36-XFBGA, WLCSP

Quantity 625 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package36-WLCSP (2.1x2.1)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case36-XFBGA, WLCSPNumber of I/O26Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level1 (Unlimited)Number of LABs/CLBs440Number of Logic Elements/Cells3520
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits81920

Overview of ICE5LP4K-SWG36ITR – iCE40 Ultra FPGA, 3,520 logic elements, 36-WLCSP

The ICE5LP4K-SWG36ITR is an iCE40 Ultra™ ultra-low power field programmable gate array (FPGA) in a compact 36-WLCSP (2.1×2.1 mm) package. Built for mobile and always-on sensor applications, the device combines programmable logic with embedded memory, hardened serial interfaces and on-chip peripherals to simplify sensor management and low-power system designs.

With 3,520 logic elements, approximately 80 kbits of embedded RAM, 26 I/Os and an industrial temperature range, this FPGA targets handheld, mobile and industrial handheld applications where integration, low standby current and a small footprint matter.

Key Features

  • Logic Capacity — 3,520 logic elements suitable for sensor pre-processing, glue logic and small to mid-size control functions.
  • Embedded Memory — Approximately 80 kbits (81,920 bits) of on-chip RAM for buffering, state storage and small data structures.
  • Peripherals & Interfaces — Two hardened I²C controllers and two hardened SPI controllers provide direct sensor and host interfaces without needing external cores.
  • On‑Chip Oscillators — LFOSC (10 kHz) for low-power always‑on tasks and HFOSC (48 MHz) for active processing and wake events.
  • DSP and Arithmetic — On-chip DSP block supporting signed/unsigned 8-bit and 16-bit operations including multiplier, accumulator and MAC functions to off-load application processors.
  • LED and IR Drivers — Three 24 mA RGB LED outputs with selectable sink current and a dedicated 500 mA IR LED driver for direct LED interfacing and IR applications.
  • Clocking & PLL — Flexible on-chip clocking with multiple low-skew global signal resources and one PLL with dynamic interface.
  • Configuration Options — SRAM configuration via standard SPI or internal nonvolatile configuration memory (NVCM) for flexible field programming.
  • Power and Operating Range — Supply voltage range 1.14 V to 1.26 V and industrial operating temperature range of −40 °C to 100 °C.
  • Package and Size — 36-WLCSP (2.1×2.1 mm) supplier device package; family devices available in ultra-small form factors (as small as 2.078×2.078 mm).

Typical Applications

  • Smartphones and Mobile Devices — Sensor management, LED/IR control and low-power preprocessing using the device’s SPI/I²C interfaces and DSP blocks.
  • Always‑On Sensor Systems — Low-frequency oscillator and very low standby current enable ultra-low power monitoring and wake-on-event functions.
  • Handheld Commercial & Industrial Devices — Compact WLCSP package, industrial temperature rating and integrated interfaces make it suitable for portable industrial tools and handheld controllers.
  • Sensor Pre‑processing & Fusion — On-chip DSP and embedded RAM allow local preprocessing of sensor data before passing to host processors, reducing system-level bandwidth and power.
  • USB Type‑C Cable Detect / Power Delivery — Flexible I/O and programmable logic can be used to implement cable-detect and control functions in compact designs.

Unique Advantages

  • Highly integrated peripherals: Hardened SPI and I²C, on-chip oscillators, DSP, LED and IR drivers reduce external component count and simplify PCB designs.
  • Ultra‑low power architecture: Designed for low standby current and with a 10 kHz LFOSC for always‑on tasks, enabling energy-efficient sensor and mobile applications.
  • Compact footprint: 36‑WLCSP (2.1×2.1 mm) package and family options in ultra-small form factors help minimize board area in space-constrained products.
  • Deterministic on‑chip resources: Multiple global clock resources and a PLL provide flexible, low-skew clocking for timing-critical interfaces and logic.
  • Embedded DSP and RAM: Built-in MAC/DSP blocks and ~80 kbits of RAM let designers off-load compute tasks and store intermediate data without external memory.

Why Choose ICE5LP4K-SWG36ITR?

The ICE5LP4K-SWG36ITR positions itself as a compact, ultra-low power FPGA that integrates the interfaces and peripherals commonly required in mobile, sensor and handheld applications. Its combination of 3,520 logic elements, on-chip DSP, hardened SPI/I²C controllers and dedicated LED/IR drivers provides designers with a highly integrated building block to reduce BOM and simplify system architecture.

With an industrial operating temperature range, narrow supply voltage window and a small WLCSP footprint, this device is well suited to space- and power-constrained designs that need reliable, programmable logic close to sensors or user interfaces. The iCE40 Ultra family scalability and on-chip configuration options support evolving product requirements and production programming models.

Request a quote or submit an inquiry to get pricing, availability and design support for ICE5LP4K-SWG36ITR.

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