ICE5LP4K-SWG36ITR
| Part Description |
iCE40 Ultra™ Field Programmable Gate Array (FPGA) IC 26 81920 3520 36-XFBGA, WLCSP |
|---|---|
| Quantity | 625 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 36-WLCSP (2.1x2.1) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 36-XFBGA, WLCSP | Number of I/O | 26 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 1 (Unlimited) | Number of LABs/CLBs | 440 | Number of Logic Elements/Cells | 3520 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 81920 |
Overview of ICE5LP4K-SWG36ITR – iCE40 Ultra FPGA, 3,520 logic elements, 36-WLCSP
The ICE5LP4K-SWG36ITR is an iCE40 Ultra™ ultra-low power field programmable gate array (FPGA) in a compact 36-WLCSP (2.1×2.1 mm) package. Built for mobile and always-on sensor applications, the device combines programmable logic with embedded memory, hardened serial interfaces and on-chip peripherals to simplify sensor management and low-power system designs.
With 3,520 logic elements, approximately 80 kbits of embedded RAM, 26 I/Os and an industrial temperature range, this FPGA targets handheld, mobile and industrial handheld applications where integration, low standby current and a small footprint matter.
Key Features
- Logic Capacity — 3,520 logic elements suitable for sensor pre-processing, glue logic and small to mid-size control functions.
- Embedded Memory — Approximately 80 kbits (81,920 bits) of on-chip RAM for buffering, state storage and small data structures.
- Peripherals & Interfaces — Two hardened I²C controllers and two hardened SPI controllers provide direct sensor and host interfaces without needing external cores.
- On‑Chip Oscillators — LFOSC (10 kHz) for low-power always‑on tasks and HFOSC (48 MHz) for active processing and wake events.
- DSP and Arithmetic — On-chip DSP block supporting signed/unsigned 8-bit and 16-bit operations including multiplier, accumulator and MAC functions to off-load application processors.
- LED and IR Drivers — Three 24 mA RGB LED outputs with selectable sink current and a dedicated 500 mA IR LED driver for direct LED interfacing and IR applications.
- Clocking & PLL — Flexible on-chip clocking with multiple low-skew global signal resources and one PLL with dynamic interface.
- Configuration Options — SRAM configuration via standard SPI or internal nonvolatile configuration memory (NVCM) for flexible field programming.
- Power and Operating Range — Supply voltage range 1.14 V to 1.26 V and industrial operating temperature range of −40 °C to 100 °C.
- Package and Size — 36-WLCSP (2.1×2.1 mm) supplier device package; family devices available in ultra-small form factors (as small as 2.078×2.078 mm).
Typical Applications
- Smartphones and Mobile Devices — Sensor management, LED/IR control and low-power preprocessing using the device’s SPI/I²C interfaces and DSP blocks.
- Always‑On Sensor Systems — Low-frequency oscillator and very low standby current enable ultra-low power monitoring and wake-on-event functions.
- Handheld Commercial & Industrial Devices — Compact WLCSP package, industrial temperature rating and integrated interfaces make it suitable for portable industrial tools and handheld controllers.
- Sensor Pre‑processing & Fusion — On-chip DSP and embedded RAM allow local preprocessing of sensor data before passing to host processors, reducing system-level bandwidth and power.
- USB Type‑C Cable Detect / Power Delivery — Flexible I/O and programmable logic can be used to implement cable-detect and control functions in compact designs.
Unique Advantages
- Highly integrated peripherals: Hardened SPI and I²C, on-chip oscillators, DSP, LED and IR drivers reduce external component count and simplify PCB designs.
- Ultra‑low power architecture: Designed for low standby current and with a 10 kHz LFOSC for always‑on tasks, enabling energy-efficient sensor and mobile applications.
- Compact footprint: 36‑WLCSP (2.1×2.1 mm) package and family options in ultra-small form factors help minimize board area in space-constrained products.
- Deterministic on‑chip resources: Multiple global clock resources and a PLL provide flexible, low-skew clocking for timing-critical interfaces and logic.
- Embedded DSP and RAM: Built-in MAC/DSP blocks and ~80 kbits of RAM let designers off-load compute tasks and store intermediate data without external memory.
Why Choose ICE5LP4K-SWG36ITR?
The ICE5LP4K-SWG36ITR positions itself as a compact, ultra-low power FPGA that integrates the interfaces and peripherals commonly required in mobile, sensor and handheld applications. Its combination of 3,520 logic elements, on-chip DSP, hardened SPI/I²C controllers and dedicated LED/IR drivers provides designers with a highly integrated building block to reduce BOM and simplify system architecture.
With an industrial operating temperature range, narrow supply voltage window and a small WLCSP footprint, this device is well suited to space- and power-constrained designs that need reliable, programmable logic close to sensors or user interfaces. The iCE40 Ultra family scalability and on-chip configuration options support evolving product requirements and production programming models.
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