ICE5LP4K-SWG36ITR50
| Part Description |
iCE40 Ultra™ Field Programmable Gate Array (FPGA) IC 26 81920 3520 36-XFBGA, WLCSP |
|---|---|
| Quantity | 695 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 36-WLCSP (2.1x2.1) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 36-XFBGA, WLCSP | Number of I/O | 26 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 1 (Unlimited) | Number of LABs/CLBs | 440 | Number of Logic Elements/Cells | 3520 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 81920 |
Overview of ICE5LP4K-SWG36ITR50 – iCE40 Ultra FPGA, 3520 Logic Elements, 36-WLCSP (2.1 × 2.1)
The ICE5LP4K-SWG36ITR50 is an iCE40 Ultra™ family field-programmable gate array (FPGA) offered in a 36-WLCSP (2.1 × 2.1 mm) package for space-constrained designs. It integrates up to 3,520 logic elements with approximately 80 kbits of embedded RAM and a variety of on-chip peripherals to support low-power mobile and industrial sensor-management applications.
Designed for industrial-grade operation, this surface-mount device supports a 1.14 V to 1.26 V core supply and an operating temperature range of −40 °C to 100 °C, making it suitable for always-on and sensor-preprocessing roles in compact systems.
Key Features
- Logic Capacity: 3,520 logic elements (LUT-based architecture) to implement custom digital logic and control functions.
- Embedded Memory: Approximately 80 kbits of on-chip RAM for buffering, small lookup tables, and state storage.
- I/O and Package: 26 user I/O pins in a 36-XFBGA / 36-WLCSP (2.1 × 2.1 mm) package; surface-mount mounting for compact board layouts.
- Low-Voltage Core Supply: Operates from 1.14 V to 1.26 V core voltage range, enabling low-power system designs.
- Industrial Temperature Rating: Rated for −40 °C to 100 °C operation for reliability in industrial environments.
- Ultra-Low Power Family Features: Family-level on-chip peripherals including two on-chip oscillators (10 kHz LFOSC and 48 MHz HFOSC) to support low-power and wake-up functions.
- Integrated Interfaces: Hardened I²C and SPI controllers (family-level) to simplify sensor and host connectivity without external controllers.
- On-Chip DSP and LED Drivers: Family-level DSP blocks for pre-processing and embedded RGB PWM with three 24 mA constant-current LED outputs plus a 500 mA IR LED driver for direct LED interfacing.
- Configuration Flexibility: SRAM configuration through standard SPI or internal nonvolatile configuration memory (NVCM) per family specifications.
- RoHS Compliant: Environmentally compliant component suitable for modern manufacturing requirements.
Typical Applications
- Portable and Mobile Sensor Management: Always-on sensor preprocessing, aggregation, and low-power wake functionality for handheld and mobile devices.
- Embedded User Interfaces: Drive RGB status LEDs or service indicators directly using the integrated PWM and constant-current outputs.
- Infrared and Optical Signaling: Use the high-current IR LED driver capability (family-level) for IR transmission or barcode-emulation applications.
- Industrial and Commercial Handhelds: Compact FPGA logic and embedded memory for control, protocol bridging, and sensor interfacing in industrial handheld equipment.
Unique Advantages
- Compact, High-Density Package: 36-WLCSP (2.1 × 2.1 mm) footprint enables advanced logic in space-constrained PCBs, reducing overall board area.
- Balanced Integration: Combines logic, embedded RAM, hardened serial interfaces, oscillators, DSP blocks, and LED drivers to reduce external BOM and simplify design.
- Industrial Reliability: Rated for −40 °C to 100 °C operation and supplied in a surface-mount package suitable for automated assembly in industrial applications.
- Low-Power Operation: Family-level ultra-low power architecture and on-chip clocking options help minimize standby and active power consumption in battery-powered systems.
- Flexible Configuration: Support for SPI-based configuration and internal nonvolatile configuration memory provides deployment flexibility and streamlined manufacturing.
Why Choose ICE5LP4K-SWG36ITR50?
The ICE5LP4K-SWG36ITR50 delivers a compact, industrial-grade FPGA solution combining 3,520 logic elements and approximately 80 kbits of embedded memory with family-level integrated peripherals geared toward low-power sensor and interface applications. Its small 36-WLCSP package and 26 I/Os make it a practical choice when board space is limited but programmable logic and on-chip functionality are required.
This device is suitable for engineers developing compact embedded systems that need a balance of integration, industrial temperature performance, and low-power operation. It supports streamlined BOMs and provides configuration flexibility for production-ready designs.
Request a quote or submit an inquiry to receive pricing and availability details for the ICE5LP4K-SWG36ITR50 and to discuss fitment for your design and volume requirements.

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