ICE5LP4K-SWG36ITR50

IC FPGA 26 I/O 36WLCSP
Part Description

iCE40 Ultra™ Field Programmable Gate Array (FPGA) IC 26 81920 3520 36-XFBGA, WLCSP

Quantity 695 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package36-WLCSP (2.1x2.1)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case36-XFBGA, WLCSPNumber of I/O26Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level1 (Unlimited)Number of LABs/CLBs440Number of Logic Elements/Cells3520
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits81920

Overview of ICE5LP4K-SWG36ITR50 – iCE40 Ultra FPGA, 3520 Logic Elements, 36-WLCSP (2.1 × 2.1)

The ICE5LP4K-SWG36ITR50 is an iCE40 Ultra™ family field-programmable gate array (FPGA) offered in a 36-WLCSP (2.1 × 2.1 mm) package for space-constrained designs. It integrates up to 3,520 logic elements with approximately 80 kbits of embedded RAM and a variety of on-chip peripherals to support low-power mobile and industrial sensor-management applications.

Designed for industrial-grade operation, this surface-mount device supports a 1.14 V to 1.26 V core supply and an operating temperature range of −40 °C to 100 °C, making it suitable for always-on and sensor-preprocessing roles in compact systems.

Key Features

  • Logic Capacity: 3,520 logic elements (LUT-based architecture) to implement custom digital logic and control functions.
  • Embedded Memory: Approximately 80 kbits of on-chip RAM for buffering, small lookup tables, and state storage.
  • I/O and Package: 26 user I/O pins in a 36-XFBGA / 36-WLCSP (2.1 × 2.1 mm) package; surface-mount mounting for compact board layouts.
  • Low-Voltage Core Supply: Operates from 1.14 V to 1.26 V core voltage range, enabling low-power system designs.
  • Industrial Temperature Rating: Rated for −40 °C to 100 °C operation for reliability in industrial environments.
  • Ultra-Low Power Family Features: Family-level on-chip peripherals including two on-chip oscillators (10 kHz LFOSC and 48 MHz HFOSC) to support low-power and wake-up functions.
  • Integrated Interfaces: Hardened I²C and SPI controllers (family-level) to simplify sensor and host connectivity without external controllers.
  • On-Chip DSP and LED Drivers: Family-level DSP blocks for pre-processing and embedded RGB PWM with three 24 mA constant-current LED outputs plus a 500 mA IR LED driver for direct LED interfacing.
  • Configuration Flexibility: SRAM configuration through standard SPI or internal nonvolatile configuration memory (NVCM) per family specifications.
  • RoHS Compliant: Environmentally compliant component suitable for modern manufacturing requirements.

Typical Applications

  • Portable and Mobile Sensor Management: Always-on sensor preprocessing, aggregation, and low-power wake functionality for handheld and mobile devices.
  • Embedded User Interfaces: Drive RGB status LEDs or service indicators directly using the integrated PWM and constant-current outputs.
  • Infrared and Optical Signaling: Use the high-current IR LED driver capability (family-level) for IR transmission or barcode-emulation applications.
  • Industrial and Commercial Handhelds: Compact FPGA logic and embedded memory for control, protocol bridging, and sensor interfacing in industrial handheld equipment.

Unique Advantages

  • Compact, High-Density Package: 36-WLCSP (2.1 × 2.1 mm) footprint enables advanced logic in space-constrained PCBs, reducing overall board area.
  • Balanced Integration: Combines logic, embedded RAM, hardened serial interfaces, oscillators, DSP blocks, and LED drivers to reduce external BOM and simplify design.
  • Industrial Reliability: Rated for −40 °C to 100 °C operation and supplied in a surface-mount package suitable for automated assembly in industrial applications.
  • Low-Power Operation: Family-level ultra-low power architecture and on-chip clocking options help minimize standby and active power consumption in battery-powered systems.
  • Flexible Configuration: Support for SPI-based configuration and internal nonvolatile configuration memory provides deployment flexibility and streamlined manufacturing.

Why Choose ICE5LP4K-SWG36ITR50?

The ICE5LP4K-SWG36ITR50 delivers a compact, industrial-grade FPGA solution combining 3,520 logic elements and approximately 80 kbits of embedded memory with family-level integrated peripherals geared toward low-power sensor and interface applications. Its small 36-WLCSP package and 26 I/Os make it a practical choice when board space is limited but programmable logic and on-chip functionality are required.

This device is suitable for engineers developing compact embedded systems that need a balance of integration, industrial temperature performance, and low-power operation. It supports streamlined BOMs and provides configuration flexibility for production-ready designs.

Request a quote or submit an inquiry to receive pricing and availability details for the ICE5LP4K-SWG36ITR50 and to discuss fitment for your design and volume requirements.

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