ICE5LP4K-UWG20ITR
| Part Description |
iCE40 Ultra™ Field Programmable Gate Array (FPGA) IC 12 81920 3520 20-UFBGA, WLCSP |
|---|---|
| Quantity | 1,056 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 20-WLCSP (1.71x2.06) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 20-UFBGA, WLCSP | Number of I/O | 12 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 1 (Unlimited) | Number of LABs/CLBs | 440 | Number of Logic Elements/Cells | 3520 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 81920 |
Overview of ICE5LP4K-UWG20ITR – iCE40 Ultra FPGA, 3520 logic elements (20‑WLCSP)
The ICE5LP4K-UWG20ITR is an iCE40 Ultra™ family field-programmable gate array (FPGA) in a 20‑UFBGA WLCSP package. It combines a compact, surface-mount form factor with integrated logic, embedded memory, on-chip peripherals and hardened serial interfaces for space-constrained, low-power designs.
Targeted use cases include mobile and handheld devices, sensor management and always-on applications. The device emphasizes integration and ultra-low power operation through a 40 nm low-power process and on-chip support blocks that reduce external component count.
Key Features
- Core Logic — 3,520 logic elements for custom logic implementation and control tasks.
- Embedded Memory — 81,920 bits (approximately 80 kbits) of on-chip RAM for local data buffering and state storage.
- On‑chip DSP — DSP functional blocks supporting signed/unsigned 8‑bit and 16‑bit operations including multiplier, accumulator and MAC to offload simple preprocessing.
- Hardened Interfaces — Two on-chip SPI controllers and two on-chip I²C controllers for direct sensor and peripheral connectivity without soft‑IP overhead.
- Clocking — Two internal oscillators (10 kHz LFOSC and 48 MHz HFOSC), one PLL with dynamic interface and multiple global clock resources for flexible timing architectures.
- LED and IR Drivers — Three RGB PWM outputs with user-selectable sink up to 24 mA and one IR LED driver with up to 500 mA sink for direct LED/IR control.
- I/O and Packaging — 12 I/Os in a 20‑WLCSP (1.71 × 2.06 mm) surface-mount package for ultra-small board area; industrial grade mounting.
- Power — Nominal voltage supply range 1.14 V to 1.26 V to match low-voltage system rails.
- Operating Range — Industrial operating temperature from −40 °C to 100 °C.
- Compliance — RoHS compliant.
Typical Applications
- Smartphones and Mobile Devices — Sensor management, LED/IR control and small-footprint logic functions where low power and compact packaging are required.
- Tablets and Handheld Electronics — Local preprocessing, glue logic and interface bridging using on-chip SPI/I²C and DSP resources.
- Multi‑Sensor Systems — Aggregation and preprocessing for sensor fusion and always-on sensor tasks leveraging embedded memory and DSP blocks.
- USB Type‑C Cable Detect / Power Delivery — Compact logic and interface capability suitable for cable-detect and related control functions in constrained spaces.
Unique Advantages
- Highly Integrated Peripherals: Hardened SPI and I²C controllers, on-chip oscillators, DSP blocks and LED/IR drivers reduce external component count and simplify BOM.
- Ultra‑low Power Architecture: Built on a 40 nm low-power process with standby currents as low as 71 μA (typical), supporting energy-efficient always-on functions.
- Compact WLCSP Package: 20‑WLCSP (1.71 × 2.06 mm) surface-mount package minimizes PCB area for space-constrained designs.
- Embedded Memory and DSP: Approximately 80 kbits of on-chip RAM with DSP resources enables local buffering and preprocessing without external memory.
- Industrial Temperature Range: Rated for −40 °C to 100 °C, suitable for a wide range of commercial and industrial environments.
- Flexible Configuration: Device configuration via standard SPI or internal nonvolatile configuration memory (NVCM) supports multiple system architectures.
Why Choose ICE5LP4K-UWG20ITR?
The ICE5LP4K-UWG20ITR positions itself as a compact, low-power FPGA solution for designs that require on-board preprocessing, sensor interfacing and direct LED/IR control in constrained form factors. Its combination of 3,520 logic elements, embedded RAM, hardened serial interfaces and dedicated peripherals provides a balanced platform for mobile and handheld applications.
Designers seeking a small-package, industrial-temperature FPGA with integrated peripherals and low standby power will find this device appropriate for reducing BOM, conserving board space and consolidating functions that would otherwise require multiple components.
Request a quote or submit a pricing inquiry to receive availability, lead-time and ordering information for ICE5LP4K-UWG20ITR.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016