ICE5LP4K-SWG36ITR1K
| Part Description |
iCE40 Ultra™ Field Programmable Gate Array (FPGA) IC 26 81920 3520 36-XFBGA, WLCSP |
|---|---|
| Quantity | 1,131 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 36-WLCSP (2.1x2.1) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 36-XFBGA, WLCSP | Number of I/O | 26 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 1 (Unlimited) | Number of LABs/CLBs | 440 | Number of Logic Elements/Cells | 3520 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 81920 |
Overview of ICE5LP4K-SWG36ITR1K – iCE40 Ultra FPGA, 3520 logic elements, 36-WLCSP
The ICE5LP4K-SWG36ITR1K is an iCE40 Ultra™ family field programmable gate array (FPGA) in a compact 36-WLCSP package. It provides approximately 3,520 logic elements with embedded block RAM and on-chip peripherals targeted at ultra-low power mobile and handheld sensor-management applications.
Designed for integration in space-constrained, low-power systems, this device combines configurable logic, embedded memory, hardened serial interfaces and on-chip oscillators with a 1.14–1.26 V supply range and an industrial temperature rating of −40 °C to 100 °C.
Key Features
- Logic Capacity Approximately 3,520 logic elements for implementing control, glue logic and sensor pre-processing functions.
- Embedded Memory Approximately 81,920 bits (≈80 kbits) of block RAM to support buffering and small data structures.
- On-chip DSP Dedicated DSP resources that support signed and unsigned 8-bit and 16-bit multiply, accumulate and multiply-accumulate functions for sensor pre-processing.
- Hardened Serial Interfaces Two hardened I²C controllers and two hardened SPI controllers for direct sensor and host connectivity.
- Peripheral I/O 26 general-purpose I/O pins, with three dedicated RGB open-drain LED outputs (user-selectable sink up to 24 mA) and one IR LED open-drain driver (user-selectable sink up to 500 mA).
- Clocking and Oscillators Two on-chip oscillators (10 kHz LFOSC and 48 MHz HFOSC), one PLL and multiple low-skew global clock resources to simplify timing and wake/sleep management.
- Configuration Options SRAM configuration via standard SPI or internal nonvolatile configuration memory (NVCM) for flexible system boot and reconfiguration.
- Power Ultra-low power architecture with typical standby current as low as 71 μA and a supply voltage range of 1.14 V to 1.26 V.
- Package & Mounting 36-WLCSP (2.1 × 2.1 mm) surface-mount package (36-XFBGA, WLCSP) for ultra-small form-factor designs.
- Operating Range & Compliance Industrial temperature rating −40 °C to 100 °C and RoHS compliant.
Typical Applications
- Mobile & Handheld Devices Sensor management, low-power control and interface bridging in smartphones, tablets and other consumer handhelds.
- Always-on Sensor Systems Low-frequency oscillator and low standby current allow always-on sensor monitoring and event detection with minimal power draw.
- Sensor Pre-processing & Fusion On-chip DSP and embedded memory enable local preprocessing of sensor data to off-load host processors and reduce system latency.
- Peripheral Interface & LED Control Hardened SPI/I²C controllers, RGB LED outputs and a high-current IR driver support direct connection to sensors, status LEDs and IR components without external drivers.
Unique Advantages
- Highly integrated peripherals: Hardened I²C and SPI blocks, oscillators, DSP and LED/IR drivers reduce external components and simplify BOM.
- Low-power operation: Ultra-low standby current and on-chip oscillators support always-on and intermittent-wake use cases in battery-powered products.
- Compact WLCSP package: 36-WLCSP (2.1 × 2.1 mm) enables designs with strict board-area constraints while retaining ample I/O and logic resources.
- Industrial temperature range: −40 °C to 100 °C operation makes the device suitable for commercial and industrial handheld environments.
- Flexible configuration: Supports standard SPI configuration and internal nonvolatile configuration memory for multiple system boot modes and field updates.
- On-chip DSP acceleration: DSP blocks for 8/16-bit multiply and MAC operations help off-load application processors and accelerate sensor algorithms.
Why Choose ICE5LP4K-SWG36ITR1K?
The ICE5LP4K-SWG36ITR1K delivers a balanced combination of logic density, embedded memory and on-chip peripherals in an ultra-small, low-power package. Its feature set is oriented toward sensor management, LED/IR driving and lightweight pre-processing tasks where minimizing external components and power consumption is critical.
This device is well suited for designers of mobile and handheld systems, always-on sensor nodes and compact industrial handheld products who require a compact FPGA with integrated interfaces, on-chip oscillators and DSP capabilities backed by RoHS compliance and an industrial operating range.
Request a quote or submit an inquiry to check pricing, availability and to arrange technical support for integrating the ICE5LP4K-SWG36ITR1K into your next design.

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