ICE5LP4K-SWG36ITR1K

IC FPGA 26 I/O 36WLCSP
Part Description

iCE40 Ultra™ Field Programmable Gate Array (FPGA) IC 26 81920 3520 36-XFBGA, WLCSP

Quantity 1,131 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package36-WLCSP (2.1x2.1)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case36-XFBGA, WLCSPNumber of I/O26Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level1 (Unlimited)Number of LABs/CLBs440Number of Logic Elements/Cells3520
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits81920

Overview of ICE5LP4K-SWG36ITR1K – iCE40 Ultra FPGA, 3520 logic elements, 36-WLCSP

The ICE5LP4K-SWG36ITR1K is an iCE40 Ultra™ family field programmable gate array (FPGA) in a compact 36-WLCSP package. It provides approximately 3,520 logic elements with embedded block RAM and on-chip peripherals targeted at ultra-low power mobile and handheld sensor-management applications.

Designed for integration in space-constrained, low-power systems, this device combines configurable logic, embedded memory, hardened serial interfaces and on-chip oscillators with a 1.14–1.26 V supply range and an industrial temperature rating of −40 °C to 100 °C.

Key Features

  • Logic Capacity  Approximately 3,520 logic elements for implementing control, glue logic and sensor pre-processing functions.
  • Embedded Memory  Approximately 81,920 bits (≈80 kbits) of block RAM to support buffering and small data structures.
  • On-chip DSP  Dedicated DSP resources that support signed and unsigned 8-bit and 16-bit multiply, accumulate and multiply-accumulate functions for sensor pre-processing.
  • Hardened Serial Interfaces  Two hardened I²C controllers and two hardened SPI controllers for direct sensor and host connectivity.
  • Peripheral I/O  26 general-purpose I/O pins, with three dedicated RGB open-drain LED outputs (user-selectable sink up to 24 mA) and one IR LED open-drain driver (user-selectable sink up to 500 mA).
  • Clocking and Oscillators  Two on-chip oscillators (10 kHz LFOSC and 48 MHz HFOSC), one PLL and multiple low-skew global clock resources to simplify timing and wake/sleep management.
  • Configuration Options  SRAM configuration via standard SPI or internal nonvolatile configuration memory (NVCM) for flexible system boot and reconfiguration.
  • Power  Ultra-low power architecture with typical standby current as low as 71 μA and a supply voltage range of 1.14 V to 1.26 V.
  • Package & Mounting  36-WLCSP (2.1 × 2.1 mm) surface-mount package (36-XFBGA, WLCSP) for ultra-small form-factor designs.
  • Operating Range & Compliance  Industrial temperature rating −40 °C to 100 °C and RoHS compliant.

Typical Applications

  • Mobile & Handheld Devices  Sensor management, low-power control and interface bridging in smartphones, tablets and other consumer handhelds.
  • Always-on Sensor Systems  Low-frequency oscillator and low standby current allow always-on sensor monitoring and event detection with minimal power draw.
  • Sensor Pre-processing & Fusion  On-chip DSP and embedded memory enable local preprocessing of sensor data to off-load host processors and reduce system latency.
  • Peripheral Interface & LED Control  Hardened SPI/I²C controllers, RGB LED outputs and a high-current IR driver support direct connection to sensors, status LEDs and IR components without external drivers.

Unique Advantages

  • Highly integrated peripherals: Hardened I²C and SPI blocks, oscillators, DSP and LED/IR drivers reduce external components and simplify BOM.
  • Low-power operation: Ultra-low standby current and on-chip oscillators support always-on and intermittent-wake use cases in battery-powered products.
  • Compact WLCSP package: 36-WLCSP (2.1 × 2.1 mm) enables designs with strict board-area constraints while retaining ample I/O and logic resources.
  • Industrial temperature range: −40 °C to 100 °C operation makes the device suitable for commercial and industrial handheld environments.
  • Flexible configuration: Supports standard SPI configuration and internal nonvolatile configuration memory for multiple system boot modes and field updates.
  • On-chip DSP acceleration: DSP blocks for 8/16-bit multiply and MAC operations help off-load application processors and accelerate sensor algorithms.

Why Choose ICE5LP4K-SWG36ITR1K?

The ICE5LP4K-SWG36ITR1K delivers a balanced combination of logic density, embedded memory and on-chip peripherals in an ultra-small, low-power package. Its feature set is oriented toward sensor management, LED/IR driving and lightweight pre-processing tasks where minimizing external components and power consumption is critical.

This device is well suited for designers of mobile and handheld systems, always-on sensor nodes and compact industrial handheld products who require a compact FPGA with integrated interfaces, on-chip oscillators and DSP capabilities backed by RoHS compliance and an industrial operating range.

Request a quote or submit an inquiry to check pricing, availability and to arrange technical support for integrating the ICE5LP4K-SWG36ITR1K into your next design.

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